新产品开发整体流程介绍（PPT33）.ppt

C SystemIntroductionwillcover Role Responsibility R R ProcessCxStage C0 Proposalphase構想階段C1 Planningphase規劃階段C2 R DDesignphase設計階段C3 LabPilotRunphase樣品試作階段C4 EngPilotRunphase工程試作階段C5 PDPilotRunphase試產階段C6 MassProductionphase量產階段 Role Responsibility WistronCase Role Responsibility WistronCase Role Responsibility WistronCase Role Responsibility WistronCase Role Responsibility WistronCase Role Responsibility WistronCase WistronC SystemQualityControl ProposalPhase PlanningPhase R DDesignPhase LabPilot runPhase EngineeringPilot runPhase ProductionPilot runPhase MassProductionPhase C0 C1 C2 C3 C4 C5 CheckPoint WistronC Phase Availability Develop Plan Launch FAI SPCMTBFDemoCIP CLCAParetoAnalysisEWGReadyAFR TestReportsPre QVLReadyDiagnosticsProgramBugList ActionDCN ECN ECRFAIreportPFMEASQRC TrainingMTBFReviewQMP QPA QSAFPYRPPAPServiceability Design TestPlansIntegrateDesignReviewSignalQualityDFXIndexInitialSupplierAuditMemorandumDFMEASimulationMTBFEstimateMVP Concept Proposal MRSDefinitionScopeSCE ProductLifeCycle MDRR C4Go NoGo MRR C5Go NoGo C6 OOB OBA ORT Stress EWG FQH AFR DOA NewCSystemArchitecture Progress Time DetailActivities SubjectScopeDefinitionProcedure ActivitiesDefinition Record Report FormatDefinition EscalationRule MeasurementStandard ProjectManagement SystemMaintenance NewCSystemProductDevelopment ProposalPhase PlanningPhase R DDesignPhase LabPilotRunPhase Eng PilotRunPhase ProductionPilotrunPhase Massproductionphase C2meeting C3meeting C4meeting C5meeting C3checklistHWDVtestreportSWFVtestreportMEtestreportReliabilitytestreport prel ME Artwork packingdrawingPAL ROMdatalistingC3manufacturabilityreviewreportSampleapprovestatus buglistreview C4checklistBOMQVLTimestandardSystemBIOS KBCFWreleaseS WDriver AP Utility DiagnosticReleaseEEEng P RreportSMTWSP RreportPCBAWSP RreportMEEng P RreportEng P RQAreviewreportSchematics jumpersettingTestprogram ProcedureSOPforPCBA FAUsermanualR NPackingstandardCompatibilitytestreportReliabilityandC4ReliabilitytestreportKeyComponentverificationSparepartslist C5checklistServiceGuideEMCSafetyreportPDP RyieldrateanalysisrptPCBAinspectioninstructionProductinspectioninstructionMTBFDEMOtestreport PM PM C0meeting C1meeting PM C1checklistInventiondisclosureTimescheduleProjectteamModelnumberdefineGreendesignguideandreviewchecklistNonQVL Sampleapprovalrequestform C2checklistPESEMC SafetyRequestFormBOM QVL Prel PCBLayout prel Outsourcingmodulespecification PM NPI C0 C1 C2 C3 C4 C5 C6 C6meeting GCSD C6checklistProductphaseoutnotice C0ChecklistMRS C0 PM C0Meeting C0 工作重點及檢核項目 NewCSystemProductDevelopment ProposalPhase PlanningPhase R DDesignPhase LabPilotRunPhase Eng PilotRunPhase ProductionPilotrunPhase Massproductionphase C2meeting C3meeting C4meeting C5meeting C3checklistHWDVtestreportSWFVtestreportMEtestreportReliabilitytestreport prel ME Artwork packingdrawingPAL ROMdatalistingC3manufacturabilityreviewreportSampleapprovestatus buglistreview C4checklistBOMQVLTimestandardSystemBIOS KBCFWreleaseS WDriver AP Utility DiagnosticReleaseEEEng P RreportSMTWSP RreportPCBAWSP RreportMEEng P RreportEng P RQAreviewreportSchematics jumpersettingTestprogram ProcedureSOPforPCBA FAUsermanualR NPackingstandardCompatibilitytestreportReliabilityandC4ReliabilitytestreportKeyComponentverificationSparepartslist C5checklistServiceGuideEMCSafetyreportPDP RyieldrateanalysisrptPCBAinspectioninstructionProductinspectioninstructionMTBFDEMOtestreport PM PM C0meeting C1meeting PM C0ChecklistMRS C2checklistPESEMC SafetyRequestFormBOM QVL Prel PCBLayout prel Outsourcingmodulespecification PM NPI C0 C1 C2 C3 C4 C5 C6 C6meeting GCSD C6checklistProductphaseoutnotice C1checklistInventiondisclosureTimescheduleProjectteamModelnumberdefineGreendesignguideandreviewchecklistNonQVL Sampleapprovalrequestform C1 PM C1Meeting C1 工作重點及檢核項目 Case bottleCocainEngland 開採鋁礦 一噸鋁土提鍊半噸氧化鋁半小時加工 半噸氧化鋁熔煉成1 4噸金屬鋁再加工二週成鋁錠 瑞典或梛威熔爐工廠 澳大利亞 澳大利亞化學還原工廠 加熱至華氏900度壓延成1 8inch薄片 瑞典和德國壓延廠 船運一個月 冷軋成1 80inch薄片 冷軋廠 英國易開罐廠 成型 清洗 烘乾 防鏽 裝填 印刷 英國可樂廠 消費 鋁罐回收儘16 EcologicalRucksack 生態包袱 生產一片半導體晶片所產生之廢料為產品重量之十萬倍生產一台筆記型電腦所產生之廢料為產品重量之四千倍生產一公升佛羅里達橘子汁需要兩公升汽油及一千公升之水生產一噸紙需用掉九十八噸之其他資源資料來源 綠色資本主義 天下出版社 EURoHSDirective 指令期程2003 01 27指令發布2003 02 13歐盟公報發行 指令生效2004 08 13轉為會員國當地法律 法規或行政指令2006 07 01新投入之產品不得含有禁用物質指令要求 禁用項目鉛 Pb 鎘 Cd 汞 Hg 六價鉻 Cr6 多溴聯苯 PBB 多溴化二苯乙醚 PBDE Therestrictionoftheuseofcertainhazardoussubstancesinelectricalandelectronicequipment EURoHS管制規格 重金屬 汞 鉛 鎘 六價鉻溴性耐燃劑 聚溴聯苯 PBBs 溴聯苯醚 PBDEs 註 另有管制規範外的項目 EUWEEEDirective Directive2002 96 EC期程2003 01 27指令發布2003 02 13歐盟公報發行 指令生效2004 08 13轉為會員國當地法律 法規或行政指令2005 08 13完成回收系統建構 製造商因應回收之財務規劃就緒2006 12 31回收再利用率達每人每年4kg2008 12 31訂定下階段目標回收TargetofRecoveryandRecycling WasteElectricalandElectronicEquipment NewCSystemProductDevelopment ProposalPhase PlanningPhase R DDesignPhase LabPilotRunPhase Eng PilotRunPhase ProductionPilotrunPhase Massproductionphase C2meeting C3meeting C4meeting C5meeting C3checklistHWDVtestreportSWFVtestreportMEtestreportReliabilitytestreport prel ME Artwork packingdrawingPAL ROMdatalistingC3manufacturabilityreviewreportSampleapprovestatus buglistreview C4checklistBOMQVLTimestandardSystemBIOS KBCFWreleaseS WDriver AP Utility DiagnosticReleaseEEEng P RreportSMTWSP RreportPCBAWSP RreportMEEng P RreportEng P RQAreviewreportSchematics jumpersettingTestprogram ProcedureSOPforPCBA FAUsermanualR NPackingstandardCompatibilitytestreportReliabilityandC4ReliabilitytestreportKeyComponentverificationSparepartslist C5checklistServiceGuideEMCSafetyreportPDP RyieldrateanalysisrptPCBAinspectioninstructionProductinspectioninstructionMTBFDEMOtestreport PM PM C0meeting C1meeting PM C0ChecklistMRS PM C1checklistInventiondisclosureTimescheduleProjectteamModelnumberdefineGreendesignguideandreviewchecklistNonQVL Sampleapprovalrequestform NPI C0 C1 C2 C3 C4 C5 C6 C6meeting GCSD C6checklistProductphaseoutnotice C2checklistPESEMC SafetyRequestFormBOM QVL Prel PCBLayout prel Outsourcingmodulespecification C2 PM C2Meeting C2 工作重點及檢核項目 NewCSystemProductDevelopment ProposalPhase PlanningPhase R DDesignPhase LabPilotRunPhase Eng PilotRunPhase ProductionPilotrunPhase Massproductionphase C2meeting C3meeting C4meeting C5meeting C4checklistBOMQVLTimestandardSystemBIOS KBCFWreleaseS WDriver AP Utility DiagnosticReleaseEEEng P RreportSMTWSP RreportPCBAWSP RreportMEEng P RreportEng P RQAreviewreportSchematics jumpersettingTestprogram ProcedureSOPforPCBA FAUsermanualR NPackingstandardCompatibilitytestreportReliabilityandC4ReliabilitytestreportKeyComponentverificationSparepartslist C5checklistServiceGuideEMCSafetyreportPDP RyieldrateanalysisrptPCBAinspectioninstructionProductinspectioninstructionMTBFDEMOtestreport PM NPI C0 C1 C2 C3 C4 C5 C6 C6meeting GCSD C6checklistProductphaseoutnotice C3checklistHWDVtestreportSWFVtestreportMEtestreportReliabilitytestreport prel ME ArtworkpackingdrawingPAL ROMdatalistingC3manufacturabilityreviewreportSampleapprovestatus buglistreview C3 PM C3Meeting C3 工作重點及檢核項目 NewCSystemProductDevelopment ProposalPhase PlanningPhase R DDesignPhase LabPilotRunPhase Eng PilotRunPhase ProductionPilotrunPhase Massproductionphase C2meeting C3meeting C4meeting C5meeting C3checklistHWDVtestreportSWFVtestreportMEtestreportReliabilitytestreport prel ME Artwork packingdrawingPAL ROMdatalistingC3manufacturabilityreviewreportSampleapprovestatus buglistreview C5checklistServiceGuideEMCSafetyreportPDP RyieldrateanalysisrptPCBAinspectioninstructionProductinspectioninstructionMTBFDEMOtestreport PM NPI C0 C1 C2 C3 C4 C5 C6 C6meeting GCSD C6checklistProductphaseoutnotice C4checklistBOMQVLTimestandardSystemBIOS KBCFWreleaseS WDriver AP Utility DiagnosticreleaseEEEng P RreportSMTWSP RreportPCBAWSP RreportMEEng P RreportEng P RQAreviewreportSchematics jumpersettingTestprogram ProcedureSOPforPCBA FAUsermanualR NPackingstandardCompatibilitytestreportReliabilityandC4ReliabilitytestreportKeyComponentverificationSparepartslist C4 PM C4Meeting WistronMobileReliabilityTestPlan EnvironmentThermalProfileTestTemperatureandHumidityTestVibration Shock DropTestsAltitudeTest AcousticsTestsMTBFPrediction EMCLightning SurgeTestVoltageDipTestEFT ESDTestHarmonicTestIEC1000 4 XXEMI EMS PowerLineInterferenceLineVoltage FrequencyTestPowerSurgeTestVoltageDipandInterruptionPowerOn OffTestEFT BImmunityTestComplexMarginTest TransportationVibrationTestAltitudeTestShockTestDropTest UserInclineOperationTestBenchHandlingTestPowerSavingTestPressureTestAudioQualityTortureTest ReliabilityTest LCDModule WistronMobileReliabilityTestPlan WistronMobileReliabilityTest LCD C4 工作重點及檢核項目 NewCSystemProductDevelopment ProposalPhase PlanningPhase R DDesignPhase LabPilotRunPhase Eng PilotRunPhase ProductionPilotrunPhase Massproductionphase C2meeting C3meeting C4meeting C5meeting C3checklistHWDVtestreportSWFVtestreportMEtestreportReliabilitytestreport prel ME Artwork packingdrawingPAL ROMdatalistingC3manufacturabilityreviewreportSampleapprovestatus buglistreview C4checklistBOMQVLTimestandardSystemBIOS KBCFWreleaseS WDriver AP Utility DiagnosticReleaseEEEng P RreportSMTWSP RreportPCBAWSP RreportMEEng P RreportEng P RQAreviewreportSchematics jumpersettingTestprogram ProcedureSOPforPCBA FAUsermanualR NPackingstandardCompatibilitytestreportReliabilityandC4ReliabilitytestreportKeyComponentverificationSparepartslist PM PM C0 C1 C2 C3 C4 C5 C6 C6meeting GCSD C6checklistProductphaseoutnotice C5checklistServiceGuideEMCSafetyreportPDP RyieldrateanalysisrptPCBAinspectioninstructionProduct