半导体整体工艺流程.doc

Semiconductor manufacturing process (半导体工艺流程)Semiconductor manufacturing process処理工程(前工程)硅片处理工序(前工序)基板工程基板工序配線工程配线工序組立工程(後工程) 组装工序(后工序)芯片，切片検査工程测试工序製品产品出荷发货基板工程基板工序Cleaning (洗净) Silicon waferDeposition (成膜)(CVD法/熱酸化法等)Photoresist Coating(涂怖光阻)(Spin coater)光 光Photo maskExpouse (暴光)光掩膜(Stepper)Developing (显影)(Developer)Etching (蚀刻)不純物注入(离子(ion)注入法、拡散法)Resist stripping (剥离)(Stripper)以上()、繰返、回路Pattern形成。反复操作以上1到(7)，8程序，形成回路Pattern。Pre-diffusion cleaning process清洗工序Diffusion (成膜)前cleaning processsample。成膜前的清洗工序的例子。Silicon wafer LoadOnly pre gate cleaningChemical：H2SO4、液温120140Pump：FH-10/20R、FF-10/20/40HTFW-20/40HT、FS-15/30/60HTH2SO4 (SPM) Chemical：HF、常温Pump：FF-10/20BT、FF-10/20CTFW-20/40T、FS-15/30/60HTHF Chemical：NH4OH、液温6080Pump：FF-10/20BTFW-20/40T、FS-15/30/60HTNH4OH (SC-1)Chemical：NH4OH、液温6080Pump：FF-10/20BTFW-20/40T、FS-15/30/60HTHCl (SC-2)DryerUnload Silicon wafer6、8” Silicon waferFF-20BT/CTFF-20HTFH-20RFW-20T/HTFS-30HTWet benchWet station12” Silicon waferFF-40HTFW-40T/HTFS-60HTEtching process蚀刻工序Etching process 中、窒化膜除去process(SN-Remove process)。Nitride stripping Nitride etching 呼。 process 下記示。SN-Remove process窒化膜(SiN)除去processsample。氮化硅(SiN)去除流程的例子Silicon wafer LoadChemical：HF、液温23Pump：FF-10/20BT、FF-10/20CTFW-20/40T、FS-15/30/60HTHFChemical：H3PO4、液温160165Pump：FH-10/20RFF-10/20/40HTFW-20/40HTFS-15/30/60HTH3PO4処理時間約60分長、H3PO4槽2槽、3槽場合。处理时间大约60分那么长，有时候使用2个，3个H3PO4槽(桶)H3PO4H3PO4DryerUnload Silicon waferEtching process蚀刻工序Etching process 中、Oxide etching process。 process 下記示。Oxide etching processsample。Oxide除去process?去除流程Silicon wafer LoadChemical：HF or BOE、液温23Pump：FF-10/20BT、FF-10/20CTFS-15/30/60HTHF or BOEDryerUnload Silicon waferPhotoresist stripping process (sample)Silicon wafer LoadHFSPMSC-1DryerUnload Silicon waferPolymer remove process (sample)Silicon wafer LoadEKCDryerUnload Silicon waferSemiconductor manufacturing in china中芯国際集成電路制造有限公司（SMIC）FAB123(200mm)、FAB8(300mm)上海FAB4(300mm)北京Fab7(200mm)天津FAB11(200mm)成都FAB12(300mm)武漢上海宏力半導体製造公司（GSMC）FAB1(200mm)上海華虹NECFAB1(200mm)上海FAB2(200mm)上海和艦科技（He Jian）FAB1(200mm)蘇州FAB2(300mm)蘇州Hynix-STC1(200mm)無錫C2(300mm)無錫華潤上華半導体(CSMC)FAB1(150mm)無錫FAB2(200mm)無錫上海先進半導体製造(ASMC)FAB1(125mm)上海FAB2(150mm)上海FAB3(300mm)上海台湾積体電路（TSMC）上海FAB1(200mm)上海松江首鋼日電電子(SG-NEC)FAB1(150mm)北京南緑山集成電路(GMIC)FAB1(200mm)蘇省海安新進半導体(SIM-BCD)FAB1(100mm)上海FAB2(125mm)上海