Sum_C200_EVT_DQE Test Plan and Report_10_29_2009.doc

AIO LCD PC DQE Reliability Test Report Summary, C200 EVT(SDV) DQE Test Items Summary NumberItemsResult1.1.1Structure&Function Check1.1.2Dust test (Non-Op only)1.1.3Chassis Storage Test1.1.4Thermal vent blocking test1.1.5Strain Gauge Test1.1.6Over turn test1.2.1Operation Temp/Hum Cycle Test1.2.2High/Low Temperature Power Cycling Test1.2.3System Storage Temp/Hum Test1.2.4Vapor inspection test (35C 90% 48hr only)1.2.5Cold and Warm Boot Test1.2.6 AC Power Line Margin Test1.2.7Guardband test1.2.9PCBA Thermal Shock Test Dye & penetration test (after PCBA Thermal Shock)1.3.1Op Shock Test 1.3.2Non-op Shock Test1.3.3Op Vibration Test1.3.4Non-op Vibration Test1.5.1Altitude test2Hinge correlative test3Durability TestLCD Panel Test=Issues List：NODescription Unit configurationUnit configurationSKU-1SKU-2StageEVT ( SDV)EVT ( SDV)CPUIntel D510Intel D410Unit No.F1, F5, F9, F13, F16, F20, F24, T1F2, F6, FF10, F14, F17, F21, F25, F26, F27, T2PCBAVGANvidia N11M-OP2-DDR RAMHyn_R HY5PS1G831CFP-S6 2GB*1Hyn_S HY5PS1G831CFP-S6 2GB*1Hyn_S HY5PS1G831CFP-S6 1GB*1Hyn_R HY5PS1G831CFP-S6 1GB*1HDDWD WD5000 500GWD1600BEVT-22A23T0 5400RPM160GDVD-ROMHLDS-GT30NSONY-AD-7585HLCDAUO M185XW01 v50B/50CCMO M185B1-L02InverterTouch ScreenE-TurboWandaWLANAzwave AR9285 HB95 BGNLiteon AR9285 HB95 BGNMouseKeyboardAC AdapterWeb CamBison VGA 7725Chicony VGA 7725Unit configurationSKU-3SKU-4StageEVT ( SDV)EVT ( SDV)CPUIntel D510Intel D410Unit No.F3, F7, F11, F18, F22, T3F4, F8, F12, F15, F19, F23, T4PCBAVGANvidia N11M-OP2-DDR RAMMic_S D9JWB 2GB *1Mic_R D9JWB 2GB*1Mic_R D9JWB 1GB*1Mic_S D9JWB 1GB*1HDDSeagate ST9500325AS 500GHitachi HTS545050B9A300 500G 9NBDVD-ROMPLDS-DS-8A4SSONY-AD-7580SLCDAUO M185XW01 v50B/50CAUO:M185XW01InverterTouch ScreenCMO M185B1-L02WandaWLANGtc BCM4313 BGNCbt AR9285 HB95 BGNMouseKeyboardAC AdapterWeb CamChicony VGA 7725Bison VGA 7725NOTE: TOP TEST TEM: Structure&Function Check Unit NoALLLocationFQTesterDQE teamDate2009/12/07ResultPASS / FAILLabradorFQ-TPVn Test Methods(Procedure) 測試方法(步驟)1. 基本功能1.1 開啟機台電源測試及安裝適宜的測試軟體確認測試。1.2 依據報告要求表1下一項一項去檢查基本功能是否能正常動作。1.3 基本功能測試必須使用與出貨相同的OS，如Windows VISTA, Windows 7, Linux.等。2. 亮度要求（Luminance requirements）2.1使用快速鍵（hot key）將明亮度調整到最亮，測量LCD中心點的亮度，其亮度值必須符合LCD的原廠標準2.2若機台有Touch panel，則必須確認Touch panel的透光率，並反推回LCD的正確亮度。3. 電源的強制關閉測試3.1 開啟機台電源進入OS後，持續按下電源鍵直到到電腦關機，並量測其時間。4. BIOS重複燒錄測試4.1 使用BIOS Flash tool重新寫入BIOS到BIOS ROM中。4.2 重覆5次。4.3 確定機台功能正常。n Test criteria 測試標準1. 系統的所有基本功能測試不能有任何的不良2. LCD的亮度必須符合原廠的SPEC.3. 電源強制關閉時間不得小於4秒，不得超過6秒4. BIOS重新寫入後系統不能有任何的不良發生n Check List & Test Report 測試項目與報告這項測試必須在報告裡包含以下的數據及資訊Table - 1 表一ConditionResult記錄開機進入測試所用的OS是否有異常測試功能鍵，包含亮度調整，音量調整，靜音等功能確認有線網路LAN功能確認記憶卡讀卡機功能是否正常確認所有的USB可以正常工作確認所有的PS/2 port可以正常工作確認所有的耳機、麥克風插孔正常工作確認網路攝影機、麥克風可以正常工作確認HDD，ODD、FDD可以正常讀取、寫入確認所有無線裝置可以正常工作，包含無線網路、藍芽、GPRS.等確認觸控銀幕功能正常確認所有按鈕、LED燈號都有正常工作6秒強制關機功能是否正常BIOS re-flash verification檢查機殼外觀及腳座是否有任何變形、GAP過大、烤漆噴漆不良.Table 2 表二Luminance data (Cd/m2,or nits) While maximumUnit -F1Unit -F2Unit -F3Unit -F4Unit -F5Unit -F6Unit -F7Unit F8Unit F9Unit F10Unit F11Unit F12Unit F13Unit F14Unit F15Unit F16Unit F17Unit F18Unit F19Unit F20Unit F21Unit F22Unit F23Unit F24Unit F25Unit F26Unit F27Unit F28Unit F29Unit F30Unit F31Unit T1Unit T2Unit T3Unit T4NOTE：TOP TEST ITEM: Dust test (Non-Op only)Unit NoUnit-T1, T2, T3, T4LocationTaipeiTesterMimi SuDate2009/12/1412/18ResultPASS / FAILLabradorSGSn Test methods(procedure) 測試方法（步驟）測試 1:1. 開機Run Burn-in test 5.3 (100% loading)。2. Dust:飛灰(Standard dust No. 10 defined by JIS); Dust密度: 30mg/m3.3. Temperature: 255; Humidity: 50%10%。4. 測試時間:8小時。測試2 :5. 關機狀態下測試。6. 粉塵類型:滑石粉.直徑範圍50um75um。7. 粉塵密集度:整個Chamber容積的每立方米2kg。8. 風速:2m/s。9. 測試條件:濕度25%。10. 測試時間:8小時。n Test Criteria 測試標準1. 在測試前及測試後都需Run Burn-in Test 5.3去確認系統功能是否正常。如果無法正常開機，需要做問題分析及提供分析報告。2. 在測試前及測試後皆要Run DisplayX 且確認LCD Module無凹陷、突出、牛頓環、水波紋及髒污、白點、黑點、亮點、暗點。3. 無機構上問題，無功能上問題，無腐蝕狀況出現。4. 在Dust test前確認Wireless & Bluetooth信號強度5. 確認是否有粉塵在panel及玻璃之間(Only for system with glass before panel)6. 確認Touch Panel的功能是否正常n Check List & Test Report 測試項目與報告Unit-T1Unit-T2Unit-T3Unit-T4OPNon-OpOPNon-OpOPNon-OpOPNon-OpFunction CheckLCD CheckLCD & Touch Panel check機構件checkNOTE：TOP TEST TEM: Chassis Storage Test Unit NoChassis1&2LocationFQTesterRobin Date2009/12/0708ResultPASS / FAILLabradorFQ-TPVn Test Methods(Procedure) 測試方法(步驟)1. Low Temperature Storage Test (-40) 1.1 Sample 2 pcs.。 1.2 測試前先用肉眼及顯微鏡觀看外觀是否有裂痕,缺損或變形等不良。1.3 將基座、塑膠件及鐵件部份依照SOP組裝起來(不需PCBA版及線材)1.4 置入Chamber內16小時。1.5 測試完畢後將待測物取出chamber，2小時後確認機構件是否正常無裂痕、缺損或變形、斷裂等問題產生。2. High temperature / Humidity Storage test (70 903%HR)2.1 Sample 2 pcs.。 2.2測試前先用肉眼及顯微鏡觀看外觀是否有裂痕,缺損或變形等不良。2.3將基座、面板上的塑膠件及內含鐵件部份，置入Chamber內16小時。2.4測試完畢後將基座及面板塑膠件取出，回溫後確認機構件是否正常無裂痕、缺損或變形、斷裂等問題產生。n Test Criteria 測試標準1. 在Chamber測試結束後，在室溫下放置2小時回溫，再進行檢查。2. 無機構上損壞及變形、爆裂及其他問題，無明顯的gap及外觀上改變，無腐蝕狀況發生。n Check List & Test Report 測試項目與報告Chassis 1Chassis 2-4070 / 90%HR-4070 / 90%HRCheck ResultNOTE：TOP TEST TEM: Thermal Vent blocking testrUnit No F11, F12LocationFQTesterRobin Date2009/12/1415ResultPASS / FAILLabradorFQ-TPVn Test Methods(Procedure) 測試方法(步驟)1. 此項目必須測試2台2. 在待測機台的所有出風口貼上膠帶。3. 執行Burn-in 5.3 直到系統shut down。4. 移除Power，移除所有出風口膠帶，並等待15分鐘。5. 重新接上電源且開機。6. 開機後Run Burn-In 5.3，並確認系統所有元件以及所有的I/O function正常。n Test Criteria 測試標準1. 在移除所有出風口上的阻塞物後，確認測試機台無功能上問題。2. 確認無機構上問題。n Check List & Test Report 測試項目與報告Unit-F11Unit-F12過熱保護是否動作Function check after test機構check after testNOTE：TOP TEST ITEM: Strain Gauge TestUnit NoPCBA-5LocationFQTesterDate2009/12/0711ResultPASS / FAILLabradorFQ-TPVn Test methods(procedure) 測試方法（步驟） 1. 測試樣品至少一台 2. 在測試前應該由聯想的可靠度測試工程師決定量測的位置，或是參考Intel MAS。3. 主機板黏貼好應力測試線4. 依照標準的組裝SOP將整台機台組裝起來。5. 組裝時必須特別注意應力測試線，必須避免壓迫、折死，與拉扯，以免損害線材。6. 組裝中應力紀錄器的紀錄頻率為500Hz2KHz。7. Specified strain limit:任何主要的應力值必須低於Test Spec。8. 在所有的機構件與零組件組裝完成後，板上殘留的應力不得高於Spec.n Test Criteria 測試標準1, For Pineview CPU:Strain gages are to be placed at 4 locations on the substrate board at precisely 0.14” +/- 0.02” from the device corner to the gage centerline. The Minimum sample rate is 500Hz; recommended maximum sample rate is 2000Hz. Specified strain limit: absolute strain value for any principal strain must be less than 450 Strain The Strain residue after all mechanical parts assembly and system assembly is less than 350. 2, For Tigerpoint South Bridge & VGA Chip:Strain gages are to be placed at 4 locations on the substrate board at precisely 0.14” +/- 0.02” in from the device corner to the gage centerline; Minimum sample rate is 500HZ; Specified strain limit: absolute strain value for any principal strain must be less than 500 Strain. The Strain residue after all mechanical parts assembly and system assembly is less than 350. Strain GuidanceStrain Range(micro strain, )Associated RiskRecommendation/Commentsmax,min 450LowSolder joint failure is unlikely450max,min 650MediumLarger sample size and failure analysis is suggested for design validation.650max,minHighSolder joint failure is likely, consider design changes or adopt appropriate assembly procedure to improve reliabilityn Check List & Test Report 測試項目與報告Item: Assemble Mainboard InstallationPackage typeGauge LocationSample ProfileCPULocationCorner 1 (A1)Corner 2 (A21)Corner 3 (AA21)Corner 4 (AA1)StrainValuesMax Min Max Min Max Min Max Min Package typeGauge LocationSample ProfileVGA Chip LocationCorner 1 (A1)Corner 2 (A43)Corner 3 (BC43)Corner 4 (BC1)StrainValuesMax Min Max Min Max Min Max Min Package typeGauge LocationSample ProfileSouth Bridge LocationCorner 1 (A1)Corner 2 (A25)Corner 3 (AE25)Corner 4 (AE1)StrainValuesMax Min Max Min Max Min Max Min Item: Mainboard Screws Installation Package typeGauge LocationSample ProfileCPULocationLocationCorner 1 (A1)Corner 2 (A21)Corner 3 (AA21)StrainValuesMax Min Max Min Max Min Max Min Package typeGauge LocationSample ProfileVGA Chip LocationCorner 1 (A1)Corner 2 (A43)Corner 3 (BC43)Corner 4 (BC1)StrainValuesMax Min Max Min Max Min Max Min Package typeGauge LocationSample ProfileSouth Bridge LocationCorner 1 (A1)Corner 2 (A25)Corner 3 (AE25)Corner 4 (AE1)StrainValuesMax Min Max Min Max Min Max Min Item: Memory InstallationPackage typeGauge LocationSample ProfileCPULocationCorner 1 (A1)Corner 2 (A21)Corner 3 (AA21)Corner 4 (AA1)StrainValuesMax Min Max Min Max Min Max Min Package typeGauge LocationSample ProfileVGA Chip LocationCorner 1 (A1)Corner 2 (A43)Corner 3 (BC43)Corner 4 (BC1)StrainValuesMax Min Max Min Max Min Max Min Package typeGauge LocationSample ProfileSouth Bridge LocationCorner 1 (A1)Corner 2 (A25)Corner 3 (AE25)Corner 4 (AE1)StrainValuesMax Min Max Min Max Min Max Min Item: WLAN card InstallationPackage typeGauge LocationSample ProfileCPULocationCorner 1 (A1)Corner 2 (A21)Corner 3 (AA21)Corner 4 (AA1)StrainValuesMax Min Max Min Max Min Max Min Package typeGauge LocationSample ProfileVGA Chip LocationCorner 1 (A1)Corner 2 (A43)Corner 3 (BC43)Corner 4 (BC1)StrainValuesMax Min Max Min Max Min Max Min Package typeGauge LocationSample ProfileSouth Bridge LocationCorner 1 (A1)Corner 2 (A25)Corner 3 (AE25)Corner 4 (AE1)StrainValuesMax Min Max Min Max Min Max Min Item: ODD & HDD STAT connecter & Power connector InstallationPackage typeGauge LocationSample ProfileCPULocationCorner 1 (A1)Corner 2 (A21)Corner 3 (AA21)Corner 4 (AA1)StrainValuesMax Min Max Min Max Min Max Min Package typeGauge LocationSample ProfileVGA Chip LocationCorner 1 (A1)Corner 2 (A43)Corner 3 (BC43)Corner 4 (BC1)StrainValuesMax Min Max Min Max Min Max Min Package typeGauge LocationSample ProfileSouth Bridge LocationCorner 1 (A1)Corner 2 (A25)Corner 3 (AE25)Corner 4 (AE1)StrainValuesMax Min Max Min Max Min Max Min Item: Heat-Sink InstallationPackage typeGauge LocationSample ProfileCPULocationCorner 1 (A1)Corner 2 (A21)Corner 3 (AA21)Corner 4 (AA1)StrainValuesMax Min Max Min Max Min Max Min Package typeGauge LocationSample ProfileVGA Chip LocationCorner 1 (A1)Corner 2 (A43)Corner 3 (BC43)Corner 4 (BC1)StrainValuesMax Min Max Min Max Min Max Min Package typeGauge LocationSample ProfileSouth Bridge LocationCorner 1 (A1)Corner 2 (A25)Corner 3 (AE25)Corner 4 (AE1)StrainValuesMax Min Max Min Max Min Max Min Item: LVDS & Touch Panel connector Installation Package typeGauge LocationSample ProfileCPULocationCorner 1 (A1)Corner 2 (A21)Corner 3 (AA21)Corner 4 (AA1)StrainValuesMax Min Max Min Max Min Max Min Package typeGauge LocationSample ProfileVGA Chip LocationCorner 1 (A1)Corner 2 (A43)Corner 3 (BC43)Corner 4 (BC1)StrainValuesMax Min Max Min Max Min Max Min Package typeGauge LocationSample ProfileSouth Bridge LocationCorner 1 (A1)Corner 2 (A25)Corner 3 (AE25)Corner 4 (AE1)StrainValuesMax Min Max Min Max Min Max Min Item: MIC & SPK connector Installation Package typeGauge LocationSample ProfileCPULocationCorner 1 (A1)Corner 2 (A21)Corner 3 (AA21)Corner 4 (AA1)StrainValuesMax Min Max Min Max Min Max Min Package typeGauge LocationSample ProfileVGA Chip LocationCorner 1 (A1)Corner 2 (A43)Corner 3 (BC43)Corner 4 (BC1)StrainValuesMax Min Max Min Max Min Max Min Package typeGauge LocationSample ProfileSouth Bridge LocationCorner 1 (A1)Corner 2 (A25)Corner 3 (AE25)Corner 4 (AE1)StrainValuesMax Min Max Min Max Min Max Min Item: Power and Brightness control connector Installation Package typeGauge LocationSample ProfileCPULocationCorner 1 (A1)Corner 2 (A21)Corner 3 (AA21)Corner 4 (AA1)StrainValuesMax Min Max Min Max Min Max Min Package typeGauge LocationSample ProfileVGA Chip LocationCorner 1 (A1)Corner 2 (A43)Corner 3 (BC43)Corner 4 (BC1)StrainValuesMax Min Max Min Max Min Max Min Package typeGauge LocationSample ProfileSouth Bridge LocationCorner 1 (A1)Corner 2 (A25)Corner 3 (AE25)Corner 4 (AE1)StrainValuesMax Min Max Min Max Min Max Min Item: LED and Battery connector Installation Package typeGauge LocationSample ProfileCPULocationCorner 1 (A1)Corner 2 (A21)Corner 3 (AA21)Corner 4 (AA1)StrainValuesMax Min Max Min Max Min Max Min Package typeGauge LocationSample ProfileVGA Chip LocationCorner 1 (A1)Corner 2 (A43)Corner 3 (BC43)Corner 4 (BC1)StrainValuesMax Min Max Min Max Min Max Min Package typeGauge LocationSample ProfileSouth Bridge LocationCorner 1 (A1)Corner 2 (A25)Corner 3 (AE25)Corner 4 (AE1)StrainValuesMax Min Max Min Max Min Max Min NOTE: TOP TEST TEM: Over Turn TestUnit NoF20, F21, F11, F12LocationFQTesterRobin Date2009/12/12 & 12/16ResultPASS / FAILLabradorFQ-TPVn Test Methods(Procedure) 測試方法(步驟)1. 測試需包含所有的M/B、CPU、Memory。測試後，系統需測試樣品2 Unit。2. 將機台放在木製桌面上。3. 系統開機且在idle mode。4. 對機台LCD上方中央往前推，直到機台往前傾倒。5. 將機台扶正，並檢查是否有任何外觀上的損壞。6. Run Burn-In 5.3確認所有的功能都正常。7. 對機台LCD上方中央往後推，直到機台往後傾倒。8. 換另一台機台，重複步驟56。9. 4台機台都必須完成相同的測試。n Test Criteria 測試標準1. 測試完成後，確認無結構上損壞 ，功能異常或Safety問題。n Check List & Test Report 測試項目與報告 Unit F20Unit F21Unit F11Unit F12Obverse SideReverse SideObverse SideReverse SideObverse SideReverse SideObverse SideReverse Side外觀檢察Function CheckNOTE: TOP TEST TEM: Operation Temp/Hum Cycle Test Unit NoF5, F6, F7, F8LocationFQTesterDate2009/12/12 & 12/15ResultPASS / FAILLabradorFQ-TPVn Test Methods(Procedure) 測試方法(步驟)1. 將待測機台放入可程式溫溼度控制箱內2. 帶測機台Run Passmark BurnInTest5.3(100%loading). 3. Temp: 040; Humidity: 10%90%; 4. Temp ramp rate : 20/ Hr 5. Total test time: 80 Hours 6. Test Cycles : 2 cycles。7. After the test ,all the samples to do High/Low Temperature Power Cycling Test testn Test Criteria 測試標準1. Recover time 2hrs after test, Run Passmark BurnInTest5.3(100%loading 20mins), no error occur. 2. Run DisplayX to check LCD before test & after test, no dent, no bleb, no newton ring, no water ripple, no dirty/white/black/bright/dark dot. 3. Check wireless & Bluetooth signal intensity before test & after test.4. No changes at the materials, paintings and size; Mechanical parts should be unbroken without any deformation;Visible corrosion or oxidation is not acceptedVisible oxidation is accepted e.g. in screws5. Without visible adhesive bubble, spots & deformation in the glass and outline border paste parts(Optional).n Check List & Test Report 測試項目與報告 Table-1 Unit-F5 ItemConditionResultTemp. /Humid. CyclesBurn-In Test 是否有任何Fail是否有外觀或結構上的不正常 例如:有龜裂.歪曲等是否有功能上的異常(LCD，WLAN，BH，touch panel)是否有安全性狀況發生 例如: 短路.電阻損壞,當機，等Table-2 Unit-F6 ItemConditionResultTemp. /Humid. CyclesBurn-In Test 是否有任何Fail是否有