PCB相关专业术语英汉对照.xls

PCB相关专业术语英汉对照 安装孔mounting hole跨接线jumper wire 凹痕dents跨距离span 凹蚀etchback拉出强度pullout strength 凹蚀死角etchback拉尖solder prejection 白斑measling拉离强度pull strength 白度whitenness拉伸弹性模量tensile modules of elasticity 板边连接器edge board connector拉脱强度pull off strength 板厚孔径比aspect ratio冷冲cold punching 半加成法semi additive process冷流cold flow 半润湿dewetting离子清洁度cleanliness ionic 半润湿dewetting离子污染ionizable contaminant 包装packing连接盘land 背板backplance连接盘起翘lifted lands 边距edge spacing连接盘图形land pattern 边缘edges连接器区connertor area 边缘腐蚀试验electrolytic corrcosion test at edge连通性continuity 扁簧式接触件bellows contact连线表from to list 扁平封装flat package裂缝split 标记marking 裂缝 镀铜 cracking 标志mark零省略zero suppression 表面安装技术surface mount technology SMT 领先产品leading edge product 表面安装元 器件 surface mount component device 笼状缺陷birdcage 表面电阻surface resistance露纤维fibre exposure 表面电阻率surface resistivity露织物weave exposure 表面腐蚀试验surface corrosion test绿油窗clearance 表面间连接interfacial connection逻辑图logic diagram 表面空洞void in surface裸铜覆阻焊工艺 SMOBC solder mask on bare copper 表面铜导线厚度conductor thickness external麻点pit 丙烯酸树脂acrylic resin盲埋孔blind buried via 波峰焊waye soldering毛刺burrs 玻璃布glass fabric毛刺 箔 foil burr 玻璃化温度glass transition temperature毛圈 长feather length 玻璃纤维 E E glass fibre铆钉rivet pin 玻璃纤维突出glass fiber protrusion密 脚 距式脚格列封装品BGA 剥离强度peel strength密度 光密度 density 箔 剖面 轮廓foil profile模拟返工rework simulation 薄层压板thin laminate母板mother borad 薄铜箔thin copper foil目检visual examination 不饱和聚酯unsaturated polyester内部识别标志internal identification mark 不饱满焊点insufficient solder connection内层internal layer 不润湿nonwetting内层分离innerlayer separation 布局placement内层夹杂物inclusion innerlayer 布局效率layout efficiency内层孔环annular ring internal 布设总图master drawing 内层曝光inner layer fully auomatic exposure 布线routing内层铜箔裂缝crack of internal foil 布线密度circuit density内审internal audit 步进重复step and repeat耐电镀抗蚀剂plating resist 材料检验materials inspection耐电弧性arc resistance 参考尺寸datum dimension耐电压dielectric withstanding voltage 参考基准datum reference耐化学性chemical resistance 残余铜estraneous copper耐热性thermal porformance 测试板test board耐热性heat resistance 测试图形test pattern耐震动vibration 側蚀undercut挠性覆铜板flexible copper clad laminate 层间距layer to layer spacing挠性覆铜箔绝缘薄膜flexible copper clad dielectric film 层间连接internalyer connection挠性印制板flexible print circuit FPC 层压 复合 laminating挠性印制板flexible printed borad 层压板laminate捻度裂缝twist of yarn 层压板裂缝crack of laminate凝胶时间gel time 层压板面unclad laminate surface凝渍体gel 层压板缺陷laminate imperfections偶联剂coupling agent 层压板完整性laminate integrity排气outgassing 层压膜板laminate moulding plate盘址anchoring 插 贴 装mounting喷嘴spary nozzle 差分驱动differentia drive坯布grey fabric 差分蚀刻法differential etching坯料blank 差示扫描量热法differential scanning caborimetry 偏移excursion 潮湿和绝缘电阻moisture and insulation resistance偏址连接盘offset land 成品板production board偏置定位polariztion 成像imaging拼板multiple printed panel 尺寸稳定性dimensional stability拼底版multiple image production master 尺寸要求dimensional requirements拼图multiple pattern 冲切punching品质因素Q factor Q值 抽查spot check平纹组织plain weave 出厂交收条件inspectin of product for delivery破坏hole breakout 储存storage曝光exposure 储存期storage life曝光灯UV lamp 处理剂含量finish level曝光机能量计uv meter 处理面treated side齐平导线flush conductor 处理物转移treatment transfer齐平印制板flush printed borad 处理织物finished fabric起泡blister 触变性thixotopic气孔blow hole 穿线弯连clinched wire through connection气相再流焊vapor phase feflow soldering VPS 传输线transmission line铅lead 串扰crosstalk桥接solder bridge 垂直度rectangularity切削量chip load 粗糙面matte side 清晰度definition 粗化面matt finish 去毛刺deburr 大众化产品commodity product去铜箔面foil removal surface 带载式元件taped components去钻污smear removal 带载自动安装tape automated bonding TAB 缺胶区resin starved area 带状线stripline缺口nick 单板底版single image production master缺纬mis picks 单面印制板single side printed board绕接solderless wrap 单体simple substance热冲击thermal shock 刀具标记tool marks热导率thermal conductivity 刀片blade热风整平hot air leveling line 导电箔conductive foil热风整平HASL 导电图形conductive pattern热隔离heat shield 导通孔via热机分板thermal machanical analysis 导线conductor热膨胀系数coefficient of thermal expansion 导线 体 层conductor layer热熔fusing 导线底距conductor base spacing热熔液fusing fluid 导线底宽conductor base width热态强度保留率hot strength retention 导线厚度conductor thickness热应力方法thermal stress method 导线厚度conductor thickness热应力试验thermal test 导线厚度减少conductor thickness intermal copper foil人力资源部human resource department 导线间距conductor spacing乳胶面emulsion side 导线间距缩小conductor spacing reduction润湿剂wetting agent 导线精度conductor definition三级封装 各种电子整机产品 electronic equipment 导线宽度conductor width三聚氰胺甲醛树脂melamine formaldehyde resin 导线宽度减少conductor width reduction散热层heat sink plane 导线面conductor side 扫描式电子显微镜SEM 导线缺陷conductor imperfections闪镀strike 导线设计间距design spacing of conductor烧焦镀层burned palting 导线设计宽度design of conductor烧灼cauterization 倒角chanfer设计规则检查design rule checking 等离子体显示器PDP射频干扰RFI 低压压制10W Pressure moulding伸长率elongation 第一 导线层conductor layerNo 1渗出bleading 电磁干扰EMI生产底版production master 电磁屏蔽electromagnetic shielding生物制品biological product 电镀palting施工质量construction quality 电解清洗electrolytic cleaning湿法贴膜wet lamination 电解铜箔electrodeposited copper foil湿强度保留率wet strength retention 电路层circuit lager湿热后绝缘电阻insulation resistance anter exposure to moisture 电路绝缘性insulation resistance蚀刻etching 电路修复repair circuit蚀刻剂etchant 电木板riser plate蚀刻系数etch factor 电气性能electronic characteristics蚀刻指示图etching indicator 电桥接electrical bridging食品food 电容耦合capacitive coupling适用期pot life 电源层voltage plane术语terms 电源层隔离voltage plane clearance树脂凹缩resin recession 电子制造服务EMS树脂含量resin content 垫内孔via in pad树脂流动度resin flow 叠层layup树脂塞孔resin fill 钉头nail heading树脂钻污resin smear 定位特征tooling feature数字化digitizing 定义definitions双列直插式封装dual in line package DIP 镀层分离plating separation双马来酰亚胺三嗪树脂bismaleimide triazine resin 镀层附着力plating adhesion双面印制板double side printed borad 镀层裂缝crack of plating双氰胺dicyandiamide 镀层突沿voerhang水平显微剖切horizontal microsection 镀层完整性plater intrgrity撕裂强度tear strength 镀层增宽outgrowth损耗因数dielectric dissipation factor 镀层折叠plating folds探测点probe point 镀覆plating陶瓷印制板ceramic substrate printed borad 镀覆孔plated throughhole特性阻抗characteristic inpedance 镀覆孔结构检验plated through hole structure test体积电阻volume resistance 镀通孔palted through体积电阻率volume resistivity 镀屑sliver贴膜roller coater 断经end missing贴膜机热压辘hot roll 断裂长breaking length贴装装连SMT 对位registration通孔安装through hole mounting 对准标记register mark通孔孔径via diameters 多层次印制板multilayer printed borad铜箔copper foil 多层叠层mutilayer lay up铜箔面copper clad surface 多层线路板multilayer PCB铜纯度copper purity 多层压制multilayer laminating凸瘤bump 多官能环氧树脂polyfunctional epoxy resin凸起bulge 多重布线印制板multi wring printed borad图形pattern 返工rework图形电镀pattern plating 防静电用品anti static electricity product图形转移imaging 防霉性fungus resistance图形转移pattern tranfer 防锈处理stain proofing 涂胶铜箔adhesire coated foil 防粘膜release film涂胶粘剂绝缘薄膜adhesive coated dielectric film 放气degassing退火铜箔annealed copper foil 飞针测试机flying prode tester拖焊drag soldering 非导电图形non conductive pattern脱膜剂release agent 非功能表面间连接nonfunctional interfacial connection外层external layer 非功能连接盘nonfunctional land外层孔环annular ring external 非支撑孔unsupported hole外层铜箔裂缝crack of external foil 非支撑孔孔环annular ring of unsupoportedhiole外镀层overplate 非织布non woven fabric外观检查externally inspection 分辨率resolution外来夹杂物foreign inclusions 分步层step drilling外形线trim line 分部焊接step soldering弯度camber 分层delamination弯曲强度flexural strength 分流阴极plating thief网版stencial 分散能力throwing power网表net list 酚醛树脂phenolic resin网格grid 粉红环pink ring网印screen printing 封装package网状残锡solder webbing 敷形涂层conformal coating微带线microstrip 敷形涂层微裂纹crazing of conformal coating微导通孔micro viahole 浮焊试验solder float teat微电子microelectronics 辅面secondary side微裂纹crazing 负凹蚀negative etchback微蚀soft etching 负像negative微蚀刻microetch 负像图形nagative pattern纬向weft wise filling wise 负性抗蚀剂negative acting resist纬斜bias 附加连线haywire位置定位槽polarizing hot 附连测试板test coupon温度指数temperature index TI 附着力adhesion无连接盘孔landless hole 复合层压板composite laminate无卤型halogen free 复合金属箔composite metallic material无支撑粘剂膜unsupported adhesive film 富胶区resin rich area吸水高度height of capillay rise 覆箔clad稀松织物woven scrim 覆箔板厚度metal clad laminate thickness锡珠solder plugs 覆盖层cover layer洗孔hole cleaning 覆盖检验板inspection overlay显布纹weave texture 覆金属箔基材metal clad base material显微剖切mircosectioning 覆铜箔层压板copper clad laminate显微剖切技术microsection technology 干膜光致抗蚀剂dry film photoresist相比起痕指数comparative tracking index 干扰信号interference signal相对坐标incremental 刚挠印制板flex rigid printed borad消除应力stress relief 刚性单面印制板rigid single sided printed borad斜孔splay 刚性多层印制板rigid multilayer printed board芯板core 刚性双面印制板rigid double sided printed borad芯带拆焊solder wicking 刚性印制板rigid printed board芯片尺度级封装品CSP 高层印制线路板high layer count PCB芯片载体chip carrier 高可靠性high reliable芯片直装chip on board COB 高密度互连high density interconnect HDI 芯吸wicking 高频电子机器high frequency electronic machine芯吸作用wicking 高压压制high pressure moulding信号层signal plane 隔离孔clearance hole修复repair 工程管理project management修复repairing 工程设计engineer designing修整tuching up 工程图engineering drawing 溴化环氧树脂brominated epoxy resin 工业除湿加湿eliinating or adding damp system虚焊点cold solder connection 工艺导线plating bar讯号完整性signal integrity 弓曲和扭曲bow and twist压板press platen 弓纬bow of weave压板间距daylight 固化cure压垫材料cushion 固化剂curing agent压痕dent 固化时间curing time压配合接触件press fit contact 拐角corner压延铜箔rolled copper foil 关键工序key process压制周期moulding cycle 管位钉stack pin掩蔽法tenting 光绘图photo plotting验收态as received 光亮剂brightener验收态表面绝缘电阻insulation resistance as rec 光密度尺gray scale氧指数oxygen index OI 光面shiny side液体光致抗蚀剂liquid photoresist 光梯尺step scale液体光致阻焊剂liquid photorseneitive solder resist 光致抗蚀剂photo resist一级封装 集成电路 IC packaging 过量焊点excess solder connection医药medicine 过量松香焊点resin solder connection仪器检验equipment calibration 过热焊点overheated solder connection移位焊点disturbed 海棉吸水辘sponze roller异物inclusion 焊点solder connection银盐底片silver film 焊缝solder filet引线伸出长度lead projection 焊膏solder paste印制printing 焊剂flux印制板printed board 焊接连接区solder connection areas印制板尺寸board dimensions 焊接面solder side印制板厚度printed board thickness 焊料solder印制板计算机辅助设计printed board computer aided design 焊料润湿wetting印制板总厚度total board thickness 焊料塞solder plugs印制板组装件printed board assembly 焊料整平solder leveling印制板组装图printed board assembly drawing 焊盘pad印制插头edge board contact 焊盘起翘lifted lands印制电路printed circuit 焊渣dross印制脚 贴装焊盘 foot print 黑化black oxidation印制接触片printed contact 横向cross wise direction印制线路printed wiring 红化red oxidation印制线路布设printed wiring layour 红外再流焊infrared reflow soldering IRS 印制元件printed component 后固化post cure永久性保护层permanent resist 厚薄段mark用途application 互串杂讯crosstalk noise优质焊点preferred solder connection 互连缺陷interconnecting defect有机污染organic contamination 化学蚀刻chemical etching有焰燃烧flaming combustion 划痕scratch余隙孔access hole 环境试验environment testing鱼眼fish eye 环形断裂circumferential separation预浸材料prepreg 环氧树脂epoxy resin预浸材料固化厚度prepreg cured thickness 环氧值epoxy value预制内层覆箔板mass lamination panel 黄菲林diazo film元件插脚component pin 挥发物含量volatile content元件孔component hole 汇流条bus bar元件露出端lead extension 混合安装技术mixed component mounting technlogy元件密度component density 活化activating元件面component side 火山灰磨辘pumic brush元件引线component lead 机械缠绕mechanical wrap原理图schematic diagram 机械冲击mechanical shock原始光洁面plate finish 机械加工性machinability云织waviness 基材base material运输shipment 基材厚度base material thickness晕圈haloing 基础知识培训elementray knowledge杂讯noise 基膜面base film surface载流量current carrying capacity 基准边reference edge载体箔carrier foil 基准尺寸basic dimension 再流焊reflow soldering 激光钻孔机laser drilling在线测试in line test 挤压引线swaged lead在制板panel 计算机辅助设计技术CAD脏污stain 计算机辅助制造技术CAM增强材料reinforcing material 技术服务technical services摘要abstract 加成法additive process粘合力增强处理adhesion promotion 加成法用层压板laminate for additive process粘合强度bond strength 加工规范manufacturing specification粘接片bonding sheet 加工图manufacturing drawing粘接增强处理 目检 bond enhancement treament visual 加工质量workmanship粘结层bonding layer 加工中测蚀undercut in process粘结剂binder 夹杂物inclusion粘结增强处理bond enhancing treatment 减成法subtractive peocess粘性时间tack time 剪切板cut tosize panel照相底版artwork 剪切强度shear strength照相底片photographic film 检验分类categories for inspection照相底图artwork master 检验条件inspection conditions照相缩小尺寸photographic reduction dimesion 检验职责responsibility for inspection照相原版original production master 键key遮光剂opaquer 键槽keying solt折痕crease 胶化颗粒gelation particle折弯引线clinched lead 胶粘剂adhesive针孔pinhole 胶粘剂adhesive针孔pin hole 胶粘剂面adhesive face真空吸锡法pulse vacum tin removal 角标corner mark整板电镀panel plating 阶树脂 A阶 A stage resin整平剂leveling agent 接触电阻contact resistance正向right reading 接触脚contact angle正像positive 接触面积contact area正像图形positive pattern 接触压力kiss pressure正性抗蚀剂positive actiong resist 接地ground支撑孔supported hole 接地层ground plane支撑面supporting plane 接地层隔离ground plane clearance织物经纬密度thread count 节距pitch织物组织weave structure 结构完整性structure tolerance直角板边连接器right angle edge connector 结瘤nodules制作工艺manufacturing technology 结瘤nodule质量保证条款quality assurance provisions 介电常数dielectric constant质量一致性检验电路quality conformance test circuit 介电击穿dielecric breakdown中心距center to center spacing 介电强度dielectric strength重氮底片diazo film 介质层厚度dielectric thickness重合度registration 介质耐电压dielectric withstanding voltage轴向引线axial lead 金属箔裂缝crack of foil皱褶wrinkle 金属化metallization主面primary side 金属芯matal core注尺寸孔dimensioned hole 金属芯覆铜箔层压板metal core copper clad laminate装联构件packaging and interconnecting structure 金属芯印制板 metal core printed board装联件packaging and interconnecting assembly 进给速率feed rate锥口孔