00138-Lead-Free Electronics：They’re Here to Stay.ppt

lead-freeelectronics:theyreheretostay,chrisjorgensenipctechnicalprojectmanagerlead-freeelectronics:positioningmassachusettscompaniesasindustryleadersnorthandover,mass.april13,2000,overview,10,000tonsofsnpbsolderusedannuallypbindicatedasahazardouselementlegislativeactionhaspushedforitsremovalplumbingsoldersandtincanshouseholdpaintsbulletsuselectronicsindustrycurrentlyexemptedfromlegislationindustrylulledtosleep.,overview,wakeupcall!europeanlegislationstepped-upeffortsbyjapaneseoemsnist-usindustrystandstolose$420billioninthree-yearperiodfollowing2002unlessithasacompetitiveedge(nistatpwebsite)nowwhat?,overview,ipcboardofdirectorspositionstatementtheuselectronicinterconnectionindustry,representedbytheipc,useslessthan2%oftheworldsannualleadconsumption.furthermore,allavailablescientificevidenceandusgovernmentreportsindicatethattheleadusedinusprintedwiringboard(pwb)manufacturingandelectronicassemblyproducesnosignificantenvironmentalorhealthhazards.nonetheless,intheopinionofipc,thepressuretoeliminateleadinelectronicinterconnectionswillcontinueinthefuturefromboththelegislativeandcompetitivesides.ipcencouragesandsupportsresearchanddevelopmentoflead-freematerialsandtechnologies.thesenewtechnologiesshouldprovideproductintegrity,performanceandreliabilityequivalenttolead-containingproductswithoutintroducingnewenvironmentalrisksorhealthhazards.ipcprefersglobalratherthanregionalsolutionstothisissue,andisencouragingacoordinatedapproachtothevoluntaryreductionoreliminationofleadbytheelectronicinterconnectionindustry.,worldwideactivities,politicalactivities,japanmititake-backlegislation1997japanesehomeelectronicrecyclinglawrevisedin1998householdappliancerecyclinginfullforcebyapril2001swedenrecommendsleadphase-outby2020denmarkprohibitsimport,saleandproductionofproductscontainingmetalliclead,politicalactivities,europeancommission(ec)wasteelectricalandelectronicenvironment(weee)directivecallsforleadbaninmostelectronicsby2004delegategeneral(dg)-environment:industryistheproblemandthesolutionfourthdraftstalledduetochangesineuropeancommission(ec)fourthdraftscheduledforavailabilitylateapril2000,politicalactivities,weeedirectiveexemptionsleadasanelementinsomealloyssteel-containingupto0.3%leadbyweightaluminum-containingup0.4%byweightcopper-containingupto4%leadbyleadinelectronicparts,politicalactivities,usreidbill-1991leadexposurereductionact-1993epaproposedreportingrequirementsforleadusagelimitsfrom25,000lbs.to10lbs.-1999ipcopposesthisproposalcouldproveverycostlytosmallercompaniesreconsideringsmallbusinessimpactstayingfocusedontheseactivities,politicalactivities,usstatescaliforniaproposition65-safedrinkingwaterandtoxicenforcementactof1986connecticutdepartmentofenvironmentalprotection(dep)planstoissuegeneralpermitforrecyclingelectronicsthisyearsouthcarolinastatelegislatureevaluatedabilltoestablishastatewideelectronicequipmentrecyclingprogram.,marketing/competitivepressures,japanhitachileadusagein199950%ofthatof1997allproductsleadfreeby2001investing1.2billionyen($11.2million)toexpandproductionoflead-freesoldermatsushita(panasonic)leadsoldertoberemovedin2000fromconsumerelectronicsallconsumerelectronicstobeleadfreeby2001willbeginmarketingproductsinustoshibaleadremovedfromallcellphonesby2002,marketing/competitivepressures,japansonyleadusagein199950%ofthatof1996leadremovedfromallproductsexcepthigh-densitypackagingby2001toldits500supplierstoprovidelead-freeproductsnecleadusageby200250%ofthatusedin1997currentlyusinglead-freesemiconductorsbeganshippinglead-freeproductinjanuarylabelinglead-freefromleadbearingproducts,marketing/competitivepressures,usmonitoringjapaneseandeuropeanactivitiesresearchingalternativespreferproduct-by-productswitchratherthanoverallrequirementdontwantmarketingtodrivelegislation,organizationalactivities,ipcover4000visitorssinceaugust1999leadfreegrapevinetechnicalpapersandarticleshosttoipcroadmapforlead-freeelectronicsassemblies2ndand3rddraftsdownloadedover2000timesle-mailforumforpeerinteraction500+subscribersannouncementsforfutureroadmapmeetings,organizationalactivities,ipcinternationalsummitonlead-freeelectronicsassemblies500+attendees35presentationsoverfivesessionsinitialroadmapdevelopmentproceedingsincludeupdatedpresentationsapex2000technicalforums,conferenceandroadmapwork,organizationalactivities,eiasupportsfurtherresearchthatcouldleadtominimizingleaduseintheelectronicsindustry,includingthefundingofauniversity-affiliatedresearchprogramnist-atplucentec&sprojectfordrop-inreplacement-1999ontargetfor2001completion,organizationalactivities,ncmslead-freesolderproject-1997collaborativeeffortofoems,academiaandlaboratoriestested27candidatealloysfoundnodrop-inreplacement,butresultedingooddatahigh-temperaturesolderprojectneminorthamericaneedstopreparetodeliverlead-freeproductsby2001,withan“eye”fortotalleadeliminationfor2004.proposedreplacementalloys,organizationalactivities,internationaltinresearchinstitute(itri)-soldertecstandardizelead-freematerialscollaborativeresearcheffortsover10yearsoflead-freeresearchsponsorsincludealloysuppliersandoemsidealsprojectconductedbyeuropeancompaniesproduction-readyprocessesforlead-freeelectronicsreliabilityoffinalassemblies,organizationalactivities,japaninstituteforelectronicpackaging(jiep),ipcroadmapfindings,lead-freesolderselection,snagcuappearstobemostpopularcandidate-withorwithouttheadditionofa4thelementchosenasbenchmarkfortesting-snpbisthebaselineconcernshigherprocessingtemperatureshighertemperaturesleadstomoreenergyused-addedcostcompatibilitywithsomeleadbearingfinishestoxicityofag,lead-freesolderselection,snculow-costalternativeforwavesolderingcompatiblewithmostleadbearingfinishesconcernshigherprocessingtemperaturesthanmostsnagcualloyssnagbicandidateforsmtapplicationsncmsstudyshowedbetterthermalcyclereliabilityforcertainsmtthansnagcuconcernstoxicityofbiandagfilletlifting,lead-freesolderselection,snznlowmeltingtemperaturelong-termdataneededconcernsznoxidationlong-termcorrosionofsolderjointrequiresspecialfluxchemistrieswettingcharacteristicsnotasgoodassnagcu,lead-freesolderselection,snaglonghistoryofusageextensivedata-attractivetomostcompaniesconcernshighermeltingtemperaturesthansnagcutoxicityofag,lead-freesolderselection,alloysbyareaofindustryused,lead-freesolderselection,fluxesselectionoflead-freealloymeanschangesinfluxchemistriesdontplanonpluggingcurrentfluxintonewprocesswillhavetotweakchemistriesforhigh-temperaturesolderingwillneedtotallynewfluxifusingsnznchangingfluxchemistryaffectscleaningprocesses,soldermaskandcoatings,lead-freecomponents,moldedcomponentsconcernswithpopcorninganddelaminationneedtimequalificationofnewcomponentsdefinitionofnewmaterialsnewmoldingcompoundsnewcompoundsneedtomeethigh-temprequirementscompoundsshouldmeetweeehalogenfreerequirementsj-std-020andj-std-033revisionsinprocess,lead-freecomponents,moldedcomponentsmanufacturingexperiencesandconcernsoffinishes,lead-freecomponents,dieattachausieutecticnotapplicabletolargediebecauseitsbrittletendstocracklargesilicondiesausneutecticmeltsat180definitionofnewmaterialsfornewmoldingcompoundsnewcompoundsneedtomeethigh-temprequirementscompoundsshouldmeetweeehalogenfreerequirementsorganiccanuseag-filledepoxy,lead-freecomponents,flipchip/cspnoknownsolutioninternaltopackagetemperaturehierarchypotentialforuseofpatentedindiumalloyorsnagcufordirectchipsomeinindustrymayproposeexemptionfortheseparts,lead-freecomponents,connectorsandthroughholematerialssameasmoldedcomponentsmoredataneededbeforemakingspecificdeterminationsbgaformballswithsnagcuneedtopayattentiontoaffectsofhigh-temperaturesolderconcernswithwarpageofbgasverylittledatacurrentlyavailable,butbeinggatheredbynemiandothers,pwbs,organicsolderabilitypreservatives(osps)viablecandidateeasilyprocessablerelativelyfreeofioniccontaminantsflatterthanhaslgoodsolderabilityconcernsstoragelifeneedtohandlewithcaredurabilitywithhighmeltingtemperaturesneedtoassessfluxchemistriesused,pwbs,lead-freehotairsolderleveling(hasl)viablecandidateworkswellwithmostalternativesolderswetsfasterthanmostplatedfinishesandcoatingsconcernswarpageduetohigherprocessingtemperaturespwb-absorbedprocesschemistriesroundnessoffinishmakesithardtousewithsmallleadssafetyissueswithhigh-temperaturesolderssomemanufacturersmaymoveawayfromhaslaltogetherifrequiredtogoleadfree,pwbs,immersionfinishes(preciousmetals)viablecandidatesurfaceflatnessavailabilityeaseofprocessconcernswiththinnessofcoatingshighsolderingtemperaturesmayresultinout-diffusionofbasemetalsandoxidationreducedsolderability,pwbs,electrolessniauviablecandidateresistanttodamageduringhandlingimprovedshelflifeoverotherfinishesfreeofioniccontaminantscompatiblewithmostfluxchemistriesflatterthanhasl,pwbs,materialsconsiderationsreliabilityinprocessingwarpageofpwbmustbeabletosurvivemultiplereflowshightgdoesntnecessarilymeanlaminatecansurvivehighsolderingtemperaturespthreliabilityhigh-temperaturereflowsalsoaffectinks,adhesivesandmarkings,equipment,newequipmentconsiderationssolderpotsreflowovensconcernscostofnewequipmentdowntimefortransitionandtrainingstaffspacelimitationsmaynotbenecessaryinallcases,whengivenlemons,makelemonade,roadblocksandresolutions,lackofsingularityofalloyindustryneedstocontinueconsortiaeffortsindown-selectionofalloysreworkandrepairimpactneedmarkingstoindicateboardisleadfreerecyclingrequirementsmonitorstate-levelactivitiescalluponconsortiatomakerequirementsworkersafety/exposureissuesneeddatafromepasdfeasfproject,roadblocksandresolutions,nodefinitionforleadfreecallonipcmembershiptotakeinitiativepossibly0.1%?lackofindustrypartnershipcontinueeffortsthroughconsortiaactivities,suchasroadmapdevelopmentneedtoknowprocessrequirementsindustrymustshareexperiencesgotosuppliersforinformationindustry-sponsoredlead-freeassemblytraining,roadblocksandresolutions,needtoknowprocessrequirementsindustrymustshareexperiencesgotosuppliersforinformationindustry-sponsoredlead-freeasse