认识Mask以及其制作流程

1、认识Mask以及简要的制作流程,TM,The Role of Mask in IC Industry,DESIGN,MASK,WAFER,TESTING,ASSEMBLY,How Does Mask Work in Wafer FAB,Stepper,How Does Mask Work in Wafer FAB,Scanner,Raw Material of Mask,Blank,BIM (binary mask) PSM (phase shift mask) A. KRF-PSM B. ARF-PSM,Size of Blank,5inch 90mil(5009) 5inch 180mil

2、(5018) 6inch 120mil(6012) 6inch 250mil(6025) 7inch 250mil(7015,What kind of mask SMIC FABs use,Blank Component,Binary Blank,PSM Blank,Photo Resist(3K,4K,4650A,CrO&Chrome(1050A,700A,Quartz,Photo Resist(2K,3K,4KA,CrO&Chrome(1000,550A,Quartz,MoSi Film,Photo Resist Opaque Metal Film Substrate,Photo Resi

3、st Opaque Metal Film Phase Shift Layer Substrate,Blank Qz Characteristic,Rigidity,Heat Expansion(ppm/oC,Blank Qz Characteristic,Optics Character,Transmission ( ,200,300,400,0,20,40,60,80,100,Quartz,Silicon-Boride,Soda Lime,Wave Length(nm,Thats why we choose Quartz as the substrate of blank,How to Tr

4、ansfer Design to Mask,Writer,Process,Metrology,Vis-Inspect,Clean/Mount,AIMS,Repair,1st Inspect,Thr-Inspect,STARlight,Shipping,Develop,Strip,Etch,Front-end Process,Blank configuration,Photo-resist,Cr film,Quartz,Exposure,Photo-resist develop,Wet etch,Photo-resist strip,AEI,ASI,Re-Etch ,AEI: After Etc

5、h CD measure ASI: After Strip CD measure,Step1,Step2,Step3,Step4,Step6,Step5,Step7,Front-end Process,Dry process,Resist,Cr,Qz,H,H,H,H,H,H,H,Exposure(EB1,EB2,EB3DUV,LB5,LB6,PEB (Post Exposure Bake) SFB2500,APB5500,PAG,Acid generation,Acid diffusion,Deprotection reaction,Development(SFD2500,ASP5500,H,

6、Dry Etch(Gen3,Gen4)AEI, Re-etch,Strip, ASI,Pellicle Component,Pellicle Membrane,Frame(Aluminum Alloy,Adhesive Tape,Pellicle Membrane (25 um,Pellicle Frame,Double Side Adhesive Tape,Cr,Glass,What Pellicle Do,Particle Immunity Control,Particle size (D) V.S. Minimum Stand-off (T,T = (4M/N.A.)D,M - Magn

7、ification N.A.- Numerical Aperture of the Lens,For glass side particle, T = 2.3mm,D1,T1,T2,D2,Mask Quality Control,C.D. Defect Registration,CD (critical dimension) measurement,Defect Type,Hard Defect Soft Defect,Miss Size,How to Do Mask Defect Inspect,Mask Layout Exemplification,Normal,Fiducial,Test

8、 Key,Test Line,Main Pattern,Scribe Line,Global Mark,QA Cell,Barcode,Multi-Chip,Fiducial,Test Key,Test Line,Scribe Line,Global Mark,QA Cell,A Chip,B Chip,C Chip,D Chip,The Principle of STARlight Inspect,The Model in SMIC Mask Shop(SL3UV) can only detect pattern side,STAR: Synchronous Trans. And Refle

9、cted,What is Registration,Registration Result Exemplification,Mask:6”, t=0.25”Quartz Measurement Area:67.2*92.2mm Array:8*10 Variation Quantity: nm Maxmin X7.20.0 Y22.00.2,How Does OPC Work,comparison,design/mask,With OPC,wafer,OPC Pattern on Mask,0.64 um Line Pattern,0.25 um Serif for 0.6 um Contact,0.57 Line Pattern,0.27 um assistant bar for 0.72 um Line,Over-all flow,Customer,FTP,Note: Yellow box is activities custom