电路板制作流程

1、PCB Process Introduction (Tenting Process)PCB Process Introduction (Tenting Process)PCB Manufacturing Process FlowPCB Manufacturing Process FlowPCB Manufacturing Process FlowPCB Manufacturing Process FlowPCB Manufacturing Process FlowPCB Manufacturing Process FlowApril,20,1999 JOHNNY HSUApril,20,199

2、9 JOHNNY HSUSHEARINGCNC DRILLPTHD/F PHOTO IMAGE(INNER LAYER)LAMINATIONCNC DRILLPANEL PLATINGD/F PHOTO IMAGE(OUTER LAYER)LIQUID SOLDER MASKHOT AIR LEVELINGROUTINGELECTRICAL TESTO .Q. C.徐 振 連JOHNNY HSU流流 程程 圖圖 PCB Mfg. FLOW CHARTUPDATED: 1999,04,16顧 客 (CUSTOMER)工 程 製 前 (FRONT-END DEP.)裁 板 (LAMINATE SH

3、EAR) 內 層 乾 膜 (INNERLAYER IMAGE)預 疊 板 及 疊 板 (LAY- UP )通 孔 電 鍍 (P . T . H .)液 態 防 焊 (LIQUID S/M )外 觀 檢 查 (VISUAL INSPECTION )成 型 (FINAL SHAPING)業 務 (SALES DEPARTMENT) 生 產 管 理 (P&M CONTROL)蝕 銅 (I/L ETCHING)鑽 孔 (PTH DRILLING)壓 合 (LAMINATION)外 層 乾 膜 (OUTERLAYERIMAGE)二次銅及錫鉛電鍍 (PATTERN PLATING)蝕 銅 (O/L

4、 ETCHING)檢 查 (INSPECTION) 噴 錫 (HOT AIR LEVELING)電 測 (ELECTRICAL TEST )出 貨 前 檢 查 (O Q C )包 裝 出 貨 (PACKING&SHIPPING )曝 光 (EXPOSURE) 壓 膜 (LAMINATION)前處理(PRELIMINARY TREATMENT)顯 影 (DEVELOPIG) 蝕 銅 (ETCHING)去 膜 (STRIPPING)黑 化 處 理 (BLACK OXIDE) 烘 烤 (BAKING)預 疊 板 及 疊 板 (LAY- UP ) 壓 合 (LAMINATION)後處理 (PO

5、STTREATMENT) 曝 光 (EXPOSURE) 壓 膜(LAMINATION)二次銅電鍍 (PATTERNPLATING)錫 鉛 電 鍍 (T/L PLATING)去 膜 (STRIPPING)蝕 銅 (ETCHING)剝 錫 鉛 (T/L STRIPPING) 塗 佈 印 刷 (S/M COATING)預 乾 燥 (PRE-CURE) 曝 光 (EXPOSURE)顯 影 (DEVELOPING)後 烘 烤 (POST CURE)多層板內層流程 (INNER LAYER PRODUCT)MLB全 板 電 鍍 (PANEL PLATING)銅 面 防 氧 化 處 理 (O S P (En

6、tek Cu 106A) 外 層 製 作 (OUTER-LAYER)TENTINGPROCESS鍍 金 手指 (G/F PLATING)鍍 化 學 鎳 金 (E-less Ni/Au)For O. S. P. 選 擇 性 鍍 鎳 鍍 金 (SELECTIVE GOLD)印 文 字 (SCREEN LEGEND ) 網 版 製 作 (STENCIL) 圖 面 (DRAWING) 工 作 底 片 (WORKING A/W) 製 作 規 範 (RUN CARD)程 式 帶 (PROGRAM)鑽 孔 , 成 型 機 (D. N. C.) 底 片 (MASTER A/W)磁 片, 磁 帶 (DISK ,

7、 M/T)藍 圖 (DRAWING)資 料 傳 送 (MODEM , FTP) A O I 檢 查 (AOI INSPECTION)除 膠 渣 (DESMER) 通 孔 電 鍍 (E-LESS CU)DOUBLE SIDE前處理(PRELIMINARY TREATMENT)前處理(PRELIMINARY TREATMENT)前處理(PRELIMINARY TREATMENT)全面鍍鎳金 (S/G PLATING)雷 射 鑽 孔 (LASER ABLATION)Blinded Via顯 影 (DEVELOPIG) PCB Manufacturing Process introductionP 2

8、顧顧 客客CUSTOMER裁裁 板板LAMINATE SHEAR業業 務務SALES DEP.生生 產產 管管 理理P&M CONTROLMASTER A/W底 片 DISK , M/T磁 片磁 帶藍 圖DRAWING資料傳送MODEM , FTP網版製作STENCIL DRAWING圖 面RUN CARD製作規 範PROGRAM程 式 帶鑽孔,成型機D. N. C.工工 程程 製製 前前FRONT-END DEP.工作底片WORKING A/W( 1 ) Front-end Process (Tooling)PCB Manufacturing Process introduction

9、P 3( 2 ) 多多 層層 板板 內內 層層 製製 作作 流流 程程曝 光EXPOSURE 壓 膜LAMINATION前 處 理 PRELIMINARYTREATMENT去 膜STRIPPING 蝕 銅ETCHING顯 影 DEVELOPING黑化處理 BLACK OXIDE烘 烤BAKINGLAY- UP 預疊板及疊板後 處 理 POST TREATMENT壓 合LAMINATION內層乾膜內層乾膜INNERLAYER IMAGE預疊板及疊板預疊板及疊板LAY- UP 蝕蝕 銅銅I/L ETCHING鑽鑽 孔孔DRILLING壓壓 合合LAMINATION多層板內層流程 INNER LAY

10、ER PRODUCTMLBAO I 檢檢 查查AOI INSPECTION裁裁 板板LAMINATE SHEARDOUBLE SIDE雷雷 射射 鑽鑽 孔孔LASER ABLATIONBlinded Via裁板初初 裁裁破靶捞边PCB Manufacturing Process introductionP 4通通 孔電鍍孔電鍍P . T . H .鑽鑽 孔孔DRILLING外外 層層 乾乾 膜膜OUTERLAYER IMAGE二次銅及錫鉛電鍍二次銅及錫鉛電鍍PATTERN PLATING檢檢 查查 INSPECTION 前 處 理 PRELIMINARYTREATMENT二次銅電鍍PATTER

11、N PLATING蝕 銅 ETCHING全板電鍍全板電鍍PANEL PLATING外 層 製 作OUTER-LAYERO/L ETCHING蝕蝕 銅銅TENTINGPROCESSDESMER除膠 渣 E-LESS CU通孔電鍍 前 處 理 PRELIMINARYTREATMENT剝 錫 鉛 T/L STRIPPING去 膜STRIPPING 壓 膜LAMINATION錫鉛電鍍T/L PLATING曝 光EXPOSURE( 3 ) Outer Layer Process Flow顯 影 DEVELOPINGPCB Manufacturing Process introductionP 5液態防焊

12、液態防焊LIQUID S/M 外觀檢外觀檢 查查VISUAL INSPECTION 成成 型型FINAL SHAPING檢檢 查查 INSPECTION 電電 測測ELECTRICAL TEST 出貨前檢查出貨前檢查O Q C 包包 裝裝 出出 貨貨PACKING&SHIPPING 塗佈印刷 S/M COATING前 處 理 PRELIMINARY TREATMENT曝 光EXPOSUREDEVELOPING顯 影POST CURE後 烘 烤預 乾 燥 PRE-CURE噴噴 錫錫HOT AIR LEVELING銅面防氧化處理O S P (Entek Cu 106A) HOT AIR L

13、EVELING G/F PLATING鍍金手指鍍化學鎳金E-less Ni/AuFor O. S. P. 印印 文文 字字SCREEN LEGEND 選擇性鍍鎳鍍金SELECTIVE GOLD ( 4 ) Surface Finished & Final Inspection全面鍍鎳金GOLD PLATINGPCB Manufacturing Process introductionP 6Typical PCB Manufacturing Process 1. （基板）THIN CORE2. （压膜）Dry Film Resist CoatEtch Etch Photoresist P

14、hotoresist ( (D/F)D/F)LaminateCopper FoilPCB Manufacturing Process introductionP 7Typical PCB Manufacturing Process4. （显影）Develop3. （曝光）ExposeA/W (Photo Tools)A/W (Photo Tools)PCB Manufacturing Process introductionP 8Typical PCB Manufacturing Process 5. （蚀刻）Etch6. （剥膜）Strip ResistPCB Manufacturing P

15、rocess introductionP 9Typical PCB Manufacturing Process7. （叠合）Lay-up8. （压合）LaminationLAYER 2LAYER 3LAYER 4LAYER 5LAYER 1LAYER 6PCB Manufacturing Process introductionP 10Typical PCB Manufacturing Process9. （钻孔）Drilling (Primary)10. （PTH&镀铜）PTH & Copper DepositionPCB Manufacturing Process intr

16、oductionP 11Typical PCB Manufacturing Process11. （外层压膜）Dry Film Lamination (Outer layer)12. （曝光）ExposePCB Manufacturing Process introductionP 12Typical PCB Manufacturing Process13. （显影）Develop14. （镀二铜）Pattern PlatingPCB Manufacturing Process introductionP 13Typical PCB Manufacturing Process15. （镀锡铅）

17、Tin Plating16. （剥膜）Film StrippingPCB Manufacturing Process introductionP 14Typical PCB Manufacturing Process15. （蚀刻）Etch16. （剥锡铅）Tin Stripping PCB Manufacturing Process introductionP 15Typical PCB Manufacturing Process18. （表面处理）Surface Finished (Electroless Ni/Au , HAL)17. （防焊）Solder Mask (Spray Coa

18、ting) PCB Manufacturing Process introductionP 16Lay-up Structure.COPPER FOIL 0.5 OZCOPPER FOIL 0.5 OZThin Core ,FR-4Thin Core ,FR-4prepreg prepreg COMPCOMPS0LD.S0LD.prepreg prepreg Thin Core ,FR-4Thin Core ,FR-4prepreg prepreg COPPER FOIL 0.5 OZCOPPER FOIL 0.5 OZCaul Caul PlatePlateCaul Caul PlatePl

19、ate10-12 10-12 BookingBookingHot PressHot PressHot PressHot PressCOPPER FOIL 0.5 OZCOPPER FOIL 0.5 OZThin Core ,FR-4Thin Core ,FR-4prepreg prepreg COMPCOMPS0LD.S0LD.prepreg prepreg Thin Core ,FR-4Thin Core ,FR-4prepreg prepreg COPPER FOIL 0.5 OZCOPPER FOIL 0.5 OZCaul Caul PlatePlateCaul Caul PlatePl

20、atePCB Manufacturing Process introductionP 171.1.下料裁板下料裁板 Laminate ShearLaminate Shear ( (Panel Size)Panel Size) COPPER FOILCOPPER FOILEpoxy GlassEpoxy GlassPhoto ResistPhoto Resist2.2.內層板壓乾膜內層板壓乾膜 Dry Film Resist Coat Dry Film Resist Coat (Inner Layers)(Inner Layers) PCB Manufacturing Process intro

21、ductionP 183.3.曝光曝光 ExposeExpose 4.4.曝光後曝光後 After ExposeAfter Expose ArtworkArtworkArtworkArtworkPhoto ResistPhoto ResistUV LightPCB Manufacturing Process introductionP 195.5.內層板顯影內層板顯影 DevelopDevelop Photo ResistPhoto Resist 6. 6.酸性蝕刻酸性蝕刻 Power/GroundPower/Ground/ /SignalSignal (Etch)(Etch) Photo R

22、esistPhoto ResistPCB Manufacturing Process introductionP 208.8.黑化黑化 Oxide TreatmentOxide Treatment 7.7.去乾膜去乾膜 Strip ResistStrip Resist PCB Manufacturing Process introductionP 219.9.疊板疊板 Lay-upLay-up Layer 1Layer 1Layer 2Layer 2Layer 3Layer 3Layer 4Layer 4Copper FoilCopper FoilInner LayerPrepregPrepr

23、egPCB Manufacturing Process introductionP 2210.10.壓合壓合 LaminationLamination11.11.鑽孔鑽孔 ( (Drill & Drill & DeburrDeburr) ) ( (P.T.H.& P.T.H.& Blind Via)Blind Via)Back-UpEntry MaterialPCB Manufacturing Process introductionP 2312.12.鍍通孔及一次電鍍鍍通孔及一次電鍍 DesmearDesmear & Copper Deposition & Copper Deposition13.13.外層壓膜外層壓膜 D/F Photo Resist CoatD/F Photo Resist CoatPhoto ResistPCB Manufacturing Process introductionP 2414.14.外層曝光外層曝光 Expose