pcb基板厚度包括芯板及半固化片)

1、PCBfe材厚度规格:0.5mm,0.7mm,0.8mm1.0mm1.2mm,1.5mm1.6mm2.0mm2.4mm,3.2mm,6.4mmPCBfe上铜箔的厚度规格：18um,25um,35um,70um和105um常用半固化片规格：型号10802116L:>116A2116H1500:'628L7628A7628H7628M厚mil344.55677.59.38板厚一般分为含铜和不含铜两种厚度.含铜厚度:规格配料结构规格配料结构0.1H/H1X1061.31/16X76280.21/11X2116H/H7X7628H/12X10801.42/27X7628H/H1X1506

2、1/17X7628T/T1X7628H/H7X76282/21X1061.52/27X76280.32/21X15061/18X7628H/21X7628H/H8X76281/12X2116T/T8X7628H/12X21161.62/28X7628H/H1080+2116+10801/18X7628T/T1080+2116+1080H/H8X76280.42/21080+2116+10801.72/28X76281/11080+7628+1080H/H2X76281/19X7628T/T2X7628H/H9X76280.52/22X76281.82/29X76281/17628+1080+7

3、6281/19X7628H/H7628+1080+7628H/H9X76280.62/27628+1080+76281.92/29X76281/13X76281/110X7628H/H3X7628H/H10X76280.72/23X76282.02/210X76281/12116+2X7628+21161/110X7628H/H1080+3X7628+1080H/H11X76280.2/21080+3X7628+10802.1/111X762881/14X76282H/H12X7628H/H4X76282.32/212X76280.92/24X76281/112X76281/12X7628+1

4、080+2X7628H/H12X7628H/H2X7628+2116+2X76282.42/212X76281.02/22X7628+2116+2X76281/113X76281/15X7628H/H13X7628H/H5X76282.52/213X76281.12/25X76281/113X76281/15X7628H/H13X7628H/H6X76283.02/216X76281.22/26X76281/116X76281/16X7628H/H16X7628H/H6X76283.21/117X76282/217X7628.不含铜厚度厚度mil厚度mm配料结构备注20.0501X106不含2

5、OZ铜箔30.0750.076主:1X1080次:1X1086不含2OZ铜箔厚度mil厚度mm配料结构备注40.100.102主:1X2116次:1X3313或2X106或1X2113或1X2313或1080+10650.127主:1X2116次:2X108060.1500.152主:1X1506次:2X108070.178主:1X7628次:1080+211680.2000.203主:1X7628次:2X2116或2X211390.2280.2302X2116100.250.2542X2116110.280主:1080+2116+1080次:2X2165120.3000.305主:2X150

6、6次:2116+1080+2116130.33主:1080+7628+1080次:2X1506140.3560.362X7628150.382X7628160.4060.41主:2X7628次:3X2116170.43主:7628+1080+7628次:2X7628180.4570.467628+1080+7628190.487628+2116+7628200.5080.51主:7628+2116+7628次:7628+2X1080+7628或3X7628210.533X7628220.563X7628230.583X7628240.600.61主:3X7628次:2116+2X7628+21

7、16250.64主:3X7628次:2116+2X7628+2116260.661080+3X7628+1080270.691080+3X7628+1080280.710.711主:4X7628次:4X7628300.764X7628310.790.804X7628友情备注:1foot=12inch=304.8mmlinch=25.4mm1mil=0.0254mm1inch=1000mil1OZ=28.375g1OZ铜箔其真正厚度为1.38mil或35m一、芯板、半固化片规格:1. 生益芯板常见规格：0.1mm（含铜厚）0.2mm5.120.3mm9.060.4mm12.990.5mm16.9

8、30.6mm20.870.7mm24.80.8mm28.740.9mm36.611mm44.491.2mm52.361.5mm56.31.6mm60.242mm75.982.4mm91.732. 半固化片：10803.0mil21164.2mil76287.0mil3.流胶厚:10802.5mil76286.5mil0.14mm=2*10800.21mm=2*21160.24mm=7628+10800.36mm=2*76280.4mm=2*7628+1080二、常用半固化片在不同铜厚、不同图形厚度变化1.HOZCopper/gndGnd/gndCopper/signalGnd/signalSi

9、gnal/signal76287.37.06.86.76.621164.64.44.24.03.833133.93.83.73.53.310802.82.62.52.42.27628H7.67.37.17.06.92116H4.94.74.54.34.13313H4.14.03.93.73.51018H2.92.72.62.52.37628C7.16.86.66.56.43313C3.73.63.53.23.12. 1OZCopper/gndGnd/gndCopper/signalGnd/signalSignal/signal76287.16.86.66.56.421164.54.34.13.

10、93.733133.83.73.63.43.210802.82.62.52.42.27628H7.47.16.96.86.72116H4.84.64.44.24.03313H4.03.93.83.63.41018H2.92.72.62.52.37628C6.96.66.46.36.23313C3.63.53.43.23.03. 2OZCopper/gndGnd/gndCopper/signalGnd/signalSignal/signal76286.86.56.36.16.021164.24.03.83.53.333133.53.43.33.12.810802.62.42.32.11.9762

11、8H7.16.86.66.46.32116H4.54.34.13.83.63313H3.73.63.53.33.01018H2.72.52.42.22.07628C6.66.36.15.95.83313C3.33.23.12.92.64. 3OZCopper/gndGnd/gndCopper/signalGnd/signalSignal/signal76286.56.26.05.75.621164.03.83.63.23.033133.33.23.12.82.510802.42.22.11.81.67628H6.86.56.36.05.92116H4.34.13.93.53.33313H3.5

12、3.43.33.02.71018H2.52.32.21.91.77628C6.36.05.85.55.43313C3.13.02.92.62.3注：Gnd为65恕上的大铜箔，H为高树脂含量，C为低树脂含量S0401粘结片压合厚度（100%残铜率）标树脂含量压合厚度小m/±20pm压合厚度Mil10671±3502.0土0.41080L61土3712.8土0.41080A64土3783.1土0.41080H68土3903.5土0.42116L50土31134.4土0.62116A52土31204.7土0.62116H56土31335.2土0.6331355土31004.0土0

13、.67628L41土31857.3土0.87628A43土31957.7土0.87628M46土32108.3土0.87628H50土32309.1土0.81506A45土31606.3土0.81506H49土31756.9土0.8S0701粘结片压合厚度（残铜率100%树脂含量压合厚度小m/±20pm压合厚度Mil10671±3512.0土0.41080L61土3722.8土0.41080A64土3803.1土0.41080H68土3923.6土0.42116L50土31154.5土0.62116A52土31214.8土0.62116H56土31355.3土0.63313

14、55土31024.0土0.67628L41土31887.4土0.87628A43土31987.8土0.87628M46土32138.4土0.87628H50土32359.3土0.81506A45土31626.4土0.81506H48土31756.9土0.8S1000B粘结片压合厚度（残铜率100%标树脂含量压合厚度小m/±20pm压合厚度Mil10671±3471.9土0.41080L63土3712.8土0.41080A66土3783.1土0.41080H68土3833.3土0.42116L52土31124.4土0.62116A55土31214.8土0.62116H58土31325.2土0.6331355土3943.7土0.67628L43土31857.3土0.87628A46土31987.8土0.87628M48土32078.1土0.87628H50土32188.6土0.81506A45土31515.9土0.81506H48土31626.4士0.8S0155粘结片压合厚度（100嗾铜率）树脂含量压合厚度小m/±20pm压合厚度Mil10671±3491.9土0.41080L62土372