RAMAXEL内存命名规范.doc

Ramaxel记忆科技（深圳)有限公司材料及产品名称编号系统作业指导书文件编号RDWI01版本生效日期 页11.目的: 1.1规范公司产品及材料的编号方法,便于识别产品及原料; 1.2对公司的产品及材料进行正确的编号.2.操作程序: 2.1阻容件编号说明:元件类型：C: 电容R: 电阻RN: 排阻 X - XXX X XXXX XXXXX供应商编号电压：0=不适用 16v=16 25v=25 50v=50尺寸：0402 0603 0805 1206容量值： 0.1uf=104 0.22uf=224 0.33uf=3343.3pf=3R3 10pf=100 15pf=1500 ohm=000 10 ohm=100 100 ohm=101 10k ohm=10347k ohm =473 etc.公差：B=0.1pf C=0.25pf D=0.5pf F=1% G=2% J=5% K=10% M=20% Z=+80-20% X:适用于所有容差阻容件编号示范表：元件型号元件描述C-104Z-0805-50-XXXChip Cap 0.1uf 50v +80-20% Size 0805C-104Z-0603-50-XXXChip Cap 0.1uf 50v +80-20% Size 0603C-334Z-0805-16-XXXChip Cap 0.33uf 16v +80-20% Size 0805C-334Z-0603-16-XXXChip Cap 0.33uf 16v +80-20% Size 0603C-100D-0603-50-XXXChip Cap 10pf 50v0. 5pf Size 0603C-3R3C-0603-50-XXXChip Cap 3.3pf 50v0.25pf Size 0603C-150D-0603-50-XXXChip Cap 15pf 50v0.5pf Size 0603R-000J-0805-0-XXXChip Res 0 ohm 5% Size 0805R-000J-0603-0-XXXChip Res 0 ohm 5% Size 0603R-100J-0805-0-XXXChip Res 10 ohm 5% Size 0805R-100F-0805-0-XXXChip Res 10 ohm 1% Size 0805R-100J-0603-0-XXXChip Res 10 ohm 5% Size 0603R-103J-0805-0-XXXChip Res 10k ohm 5% Size 0805R-103J-0603-0-XXXChip Res 10k ohm 5% Size 0603R-473J-0805-0-XXXChip Res 47k ohm 5% Size 0805R-473J-0603-0-XXXChip Res 47k ohm 5% Size 0603RN-100J-1206-0-XXXChip Res.Network 10 ohm 5% Size 1206EEprom-sop-XXX24C02(Big Size)EEprom-Tssop-XXX24C02(Small Size)注：上表中的“XXX”代表供应商编号。制定审核批准日期日期日期Ramaxel记忆科技(深圳)有限公司材料及产品名称编号系统作业指导书文件编号RDWI01版本生效日期 页22.2 IC型号编号说明: IC 编号系统IC设计:R: Ramaxel 模式: 1：3-2-2 2: 2-2-23：3-3-3 X X XX X XXX X X - XXX- X速度:8:100MHz 7: 133MHz10: 66MHz 400:400MHZ266:266MHz IC 类型：5.SDRAM6.Rambusetc.结构4, x48, x816,x1618,x18包装: T: Tsop F:FBGA P:PBGA u:uBGA版本：A: 1st B: 2nd C: 3rd 特征模式：B: 3.3V SDRAM C:2.5V容量：32: 32M 64: 64M 72:72M128:128M 16: 16M 144:144M 256:256M 288:288M 512:512M etc.2.3 PCB型号编号说明:RAMAXEL品牌 Unbuffered DIMM PCB 编号系统版本:1: 1st 2: 2nd 3: 3rd RP X X XXX X XX X X XRamaxel品牌 PCB 内存类型:A: 144Pin SO-DIMMB:168Pin Unbuffered 层数:2:2层 4: 4层 6: 6层 8：8层 结构:0: 无 ECC 1: 有 ECC 设计:R: Ramaxel U: UMC I: Intel L:LGS 最大容量 32：32M 64:64M128:128M 16:16M256:256M 512:512M 1G:1G etc.IC 类型: 2: 2Mx8 4:4Mx4 6:4Mx8 8:8Mx8 16:4Mx16 18:16Mx826:8Mx16 32:16Mx4 28:32Mx8 36:16Mx16 38:64Mx8 46:32Mx1624:32Mx4 34:64Mx4 etc.BANK:1:1Bank, 2:2Banks 制定审核批准日期日期日期Ramaxel记忆科技(深圳)有限公司材料及产品名称编号系统作业指导书文件编号RDWI01版本生效日期页3RAMAXEL品牌其他 PCB 编号系统版本:1: 1st 2: 2nd 3: 3rd RP X X XX X XX X X X XRamaxel品牌 PCB 层数:2:2层 4:4层 6: 6层 8：8层内存类型:C: 184 Pin RambusD:168 Pin RegisteredE:184 Pin DDRF:184 Pin Registered DDR 结构:0: 无 ECC 或X16(Rambus)1: 有 ECC 或X18(Rambus)设计:R: Ramaxel U: UMC I: Intel L:LGS 封装: 0：Tsop 10:BGA&Center 11:BGA&Edge 20:Fanout CSP&Center 最大IC个数 04：4 06:6 08：809:9 12:12 16：1618:18 36:36 etc.BANK:1:1Bank, 2:2BanksRambus IC管脚：0: 54 1：62 2:743: 84IC 类型: 04：x4 08:x8 16:x16 18:x18 2.4 产品的编号说明:速度:8:100MHz 7: 133MHz10: 66MHz 400：400MHz266:266MHzRAMAXEL品牌 MODULE 编号系统Ramaxel品牌Module RM X XX X X XX X X X X- XXX 版本: Blank:Initially A: 1st B:2nd C: 3rd D:4th E:5th内存类型:A: 144Pin SO-DIMMB:168Pin Unbuffered C: 184 Pin RambusD:168 Pin RegisteredE:184Pin DDRF:184 Pin Registered DDR包装: T: Tsop u:BGA C:Fanout CSP PCB 序号.: 见下表容量:1: 16M , 2: 32M 3: 64M 4: 128M5: 256M 6: 512M 7:1G特征模式：B: 3.3V SDRAM C:2.5VIC设计:R: Ramax U: UMC I: Intel L:LGS S:Siemens H: Hyundai M:Micron K:Samsung V:Mosel T:Toshiba N:NecB:Mitsubishi W:Winbondetc. 结构:0: without ECC1: with ECCIC 类型: 2: 2Mx8 4:4Mx4 6:4Mx8 8:8Mx8 9:4Mx18 16:4Mx16 18:16Mx8 19:8Mx18 26:8Mx16 32:16Mx4 28:32Mx8 29: 16Mx1836:16Mx16 38:64Mx8 39:32Mx1846:32Mx16 24:32Mx4 34:64Mx4 etc.制定审核批准日期日期日期Ramaxel记忆科技(深圳)有限公司材料及产品名称编号系统作业指导书文件编号RDWI01版本生效日期页42.5根据PCB型号查找相应的技术文件(BOM, 装配图)， PCB序号对应说明如下表: 序号PCB型号设计公司容量范围适用IC规格备注0-适用于所有非我公司生产的退货板4B6781A(b)台湾BP64M/128M/256M8Mx8/16Mx85B6483B台湾BP16M/32M2Mx86B6662A(b)台湾BP32M/64M/128M4Mx16/8Mx167RPB06426L41Ramax32M/64M/128M/256M4Mx8/8Mx8/16Mx88RPB064116U41Ramax32M/64M/128M4Mx16/8Mx169RPB16418L61Ramax64M/128M8Mx8/16Mx810RPB112828I61Ramax64M/128M/256M8Mx8/16Mx811RPB164216I61Ramax32M/64M/128M4Mx16/8Mx1612B4661A台湾BP32M/64M/128M4Mx16/8Mx16So-dimm13RPB06418R41Ramax64M/128M8Mx8/16Mx814RPB06426R41Ramax32M/64M4Mx815RPA064216R41Ramax32M/64M/128M4Mx16/8Mx16So-dimm16RPB012828R41Ramax64M/128M/256M8Mx8/16Mx8PC13317RPB064216R41Ramax32M/64M/128M4Mx16/8Mx16PC13318RPB064216R61Ramax32M/64M/128M4Mx16/8Mx16PC13319B6261A台湾BP8M/16M1Mx1620RPD1182080R61Ramax64M/128M/256M8Mx8/16Mx8Registered21RPB06426R42Ramax32M/64M4Mx84Mx16Halfchip-低8位22RPA06418R41Ramax64M/128M8Mx8/16Mx8So-dimm23RPB06426R43Ramax64M4Mx84Mx16Halfchip-高8位24RPB012828R61Ramax64M/128M/256M8Mx8/16Mx8制定审核批准日期日期日期Ramaxel记忆科技(深圳)有限公司材料及产品编号系统作业指导书文件编号RDWI01版本生效日期页5序号PCB型号设计公司容量范围适用IC规格备注25RPA064216R61Ramax32M/64M/128M4Mx16/8Mx16So-dimm26RPA06418R61Ramax64M/128M8Mx8/16Mx8So-dimm27RPC008010I81Ramax128M/144M128Mbits/144MbitsRambus28B6661A(b)台湾BP32M/64M/128M4Mx16/8Mx1629RPB0256236R41Ramaxel32M/64M/128M/256M/512M4M16/8Mx16/16Mx16/32Mx16PC13330RPB0512228R41Ramaxel64M/128M/256M/512M/1G8Mx8/16Mx8/32Mx8/64Mx8PC13331RPD1182080R62Ramaxel64M/128M/256M/512M/1G8Mx8/16Mx8/32Mx8/64Mx8Registered32RPE1182080R61Ramaxel128M/256M8Mx8/16Mx8DDR33RPC104010I81Ramaxel64M/72M128Mbits/144MbitsRambus34RPE1182080R62Ramaxel64M/128M/256M8Mx8/16Mx8DDR35B6981A(b)台湾BP64M/128M/256M/512M/1G8Mx8/16Mx8/32Mx8/64Mx8PC1332.6包装材料编号： 序号型号原编号新编号说明1外箱Carton-1RCT-1-XXX五盒装2外箱21RCT-