PCB术语中英文对照表

1、.Adhesion附着力AnnularRing孔环AOI（automaticopticalinspection）自动光学检测AQL（acceptablequalitylevel）可接受的质量等级B²it(buriedbumpinterconnectiontechnology)埋入凸块焊点互连技术BBH(buriedblindhole)埋盲孔BGA(ballgridarray)球栅阵列Blister起泡BoardEdges板边Burr毛头/毛刺BUM(Build-upmultilayer)积层式多层板BVH（buried/blindviahole）埋/盲导通孔CAD(computera

2、ideddesign)计算机辅助设计CAM(computeraidedmanufacturing)计算机辅助制造Carbonoil碳油CEM(compositeepoxymaterial)环氧树脂复合板材chamfer倒角Characteristicimpedance特性阻抗CNC（computerizednumericalcontrol）计算机化数字控制ConductorCrack导体破裂ConductorSpacing导线间距connector连接器Copperfoil铜箔（皮）Crazing微裂纹(白斑)Delamination分层Dewetting半润湿(缩锡)DFM（designfo

3、rmanufacturing）可制造性设计DIP(dualin-linepackage)双列直插式组件Dk（dielectricconstant）介电常数DRC(designrulechecking)设计规则检查drawing图纸ECN(engineeringchangenotice)工程更改通知ECO(engineeringchangeorder)工程更改指令Eglass电子级玻璃entekOSP处理Epoxyresin环氧树脂ESD(electrostaticdischarge)静电释放EtchedMarking蚀刻标记Flatness翘曲度ForeignInclusion外来夹杂物Fla

4、meresistant阻燃性FR-2(flame-retardant2)耐燃酚醛纸基板FR-3(flame-retardant3)耐燃环氧纸基板FR-4(flame-retardant4)耐燃环氧玻璃布基板FR-5(flame-retardant5)耐燃多功能环氧玻璃布基板ground地面（层）Haloing晕圈HDI(highdensityinterconnection)高密度互连技术HASL(hotairsolderleveling)热风焊料整平（整平）IC(integratedcircuits)集成电路InkStampedMarking盖印标记Insulationresistance绝缘

5、电阻Ioncleanliness离子清洁度IPC(theinstituteforinterconnectingandpackagingofelectroniccircuits)印制电路互连与封装协会ISO(Internationalorganizationforstandardization)国际标准化组织LaminateVoids压合空洞laser激光LDI(laserdirectimaging)激光直接成像legend文字标记、符号LiftedLands焊盘浮起logo标志LPI(liquidphotoimageable)液态感光成像LPISM(liquidphotoimageableso

6、ldermask)液态感光阻焊膜marking标记Measling白斑Microvoids微坑mil密耳（千分之一英寸）MIL-STD(militarystandard)美国军用标准NegativeEtchback欠蚀Nicks缺口Nodules镀镏Nonwetting不润湿(拒锡)open开路OSP(organicsolderabilitypreservatives)表面抗氧化oxides氧化物pad焊盘panel拼板pattern板面图形PCB(printedcircuitboard)印制电路板Pcs(pieces)件、片、只Peeling剥落pinhole针孔PinkRing粉红圈Pit

7、s凹坑pitch中心距PlatingVoids镀层破洞plug塞PositiveEtchback过蚀power电源层prepreg半固化片PTFE(polytetrafluoroethylene)聚四氟乙烯PTH(platedthrough-hole)金属化孔PWB(printed-wiringboard)印制线路板Registration对准QA(qualityassurance)质量保证QC(qualitycontrol)质量控制QE(qualityengineering)质量工程QFP(quadflatpackage)方形扁平组件repair修理RCC(resincoatedcopper

8、)已涂覆树脂的铜箔Referencedimension参考尺寸registration对准度resin树脂rejection拒收revision修订版RF(radiofrequency)射频Ripples纹路rout外形铣scratch划伤ScreenedMarking纲印标记scoring刻槽short短路signal信号Silkscreen丝网SkipCoverage漏印slot开槽SMD(surfacemountdevice)表面安装器件SMOBC(soldermaskoverbarecopper)裸铜覆盖阻焊膜SMT(surfacemounttechnology)表面安装技术smear

9、毛刺solder焊锡S/M(soldermask)绿油solderability可焊性SodaStrawing(汽水)吸管式浮空SPC（statisticalprocesscontrol）统计过程控制spacing间距Tapetest胶带实验TCE（thermalcoefficientofexpansion）热胀系数TDR（time-domainreflectometry）时域反射测试tolerance公差Tenting盖孔TextureCondition显布纹Tg(glasstransitiontemperature)玻璃软化温度THT(throughholetechnology)通孔（插装

10、）技术trace线路（条）UL(underwriterslaboratories)安全实验所NPTH非金属化孔UV(ultraviolet)紫外线辐射v-cutV刻Viahole导通孔（过线孔）void空洞warp板弯Waves波浪WeaveExposure露织物wetting沾锡Wicking灯芯效应（渗铜）Wrinkles起皱五、形状与尺寸：1、导线（通道）：conduction(track)2、导线（体）宽度：conductorwidth3、导线距离：conductorspacing4、导线层：conductorlayer5、导线宽度/间距：conductorline/space6、第一

11、导线层：conductorlayerno.17、圆形盘：roundpad8、方形盘：squarepad9、菱形盘：diamondpad10、长方形焊盘：rectanglepad11、子弹形盘：bulletpad12、泪滴盘：teardroppad13、雪人盘：snowmanpad14、v形盘：v-shapedpad15、环形盘：annularpad16、非圆形盘：non-circularpad17、隔离盘：isolationpad18、非功能连接盘：monfunctionalpad19、偏置连接盘：offsetland20、腹（背）裸盘：back-bardland21、盘址：anchoring

12、spaur22、连接盘图形：landpattern23、连接盘网格阵列：landgridarray24、孔环：annularring25、元件孔：componenthole26、安装孔：mountinghole27、支撑孔：supportedhole28、非支撑孔：unsupportedhole29、导通孔：via30、镀通孔：platedthroughhole(pth)31、余隙孔：accesshole32、盲孔：blindvia(hole)33、埋孔：buriedviahole34、埋/盲孔：buried/blindvia35、任意层内部导通孔：anylayerinnerviahole(alivh)36、全部钻孔：alldrilledhole37、定位孔：toalinghole38、无连接盘孔：landlesshole39、中间孔：interstitialhole40、无连接盘导通孔：landlessviahole41、引导孔：pilothole42、端接全隙孔：terminalclearomeehole43、准表面间镀覆孔：quasi-interfacingplated-throughhol