PCBLayout规范

1、Subject：PCB Layout UMDoc No :WI-page 1 of 27Revision: 01Pan-International Industrial Corp.China Factory1.0目的：提供PCB Layout畤之依摞，碓保所Layout之PCB符合除生及相襟津，以期降低 生之困接，使PCB生2.0逋用靶圉：本公司生H之 CD-ROM、Mother Board、DVD -Decoder Card、介面卡等所有品皆逾用之。3.0定赛3.1 PCB: Printed Circuit Board3.2 Layout:PCB 段H嚏I 作3.3 Dimension:mm

2、（公制）mil（英制）1mil =0.0254 mm4.0参考资料：4.1 IPC-A-600D印刷电路板允收襟津4.2 本公司SMT生鼓咻！ Manual5.0相位!5.1 R/D 部因：a« pcbis言十及规格制言丁、atme与 PCBiffi作商之作渠要求及技循me,包括提供 所需之文件槽案。5.2 裂造罩位： mest格、之提供及曲题回5.3 品管罩位：A it新行横瞬作H。Content pagePan-International Industrial Corp.China FactoryRevision: 01Subject:PCB LayoutDoc No :WI-p

3、age 2 of 276.0作H内容与程序Content page三洋九洲松下卡四KMAXMINMAXMINMAXMINL460503605036050W360502505025050T2.00.52.00.52.00.56.1 SMT部分6.1.1 PCB尺寸规格mm6.1.2 Fiducial Mark规格段定及位置6.1.2.1 规格 1- BI形D_ D2 kD1: 1.0 mm （±0%）D2: 2.0 mm （±0%）6.1.2.2 熄格2 -正方形D1: 1.0 mm （由0%）D2: 2.0 mm （由0%）6.1.2.3 熄格3 -三角形D1: 1.0 m

4、m （由0%）D2: 2.0 mm （由0%）Subject:PCB LayoutDoc No :WI-page 3 of 276.1.2.4 ®格 4D1: 1.0 2.0 mm (±0%)6.1.2.5 熄格4 -十字形D1: 1.0 mm (±10%)D2: 2.0 mm (±10%)6.1.2.6 熄格5 -置;穿孔作 markD1: 1.0 mm (±10%)D2: 2.0 mm (±10%)6.1.2.7 ®格 6 -PAD 作 markD1: 1.0 mm (±10%)D2: 2.0 mm (

5、7;10%)6.1.2.8 Layout 畤注意事6.1.2.8.1 PCB 上至少J1有三低I Fiducial Mark ,若悬ft面 SMT U每面 各要有三他以上。6.1.2.8.2 Fiducial mark 中心距板遏悬 X=5mm(198mil)以上。6.1.2.8.3 Fiducial mark以中心黑占3mm(120mil)靶H内不得有任何文字， Trace (®路)、PAD、VIA(通孔)，避免生亲隹沁6.1.2.8.4 超遏 100 之 ASIC 如：QFP、BGA、Chip於封角上各加一IBFiducial mark或在IC中心之位置加一 mark黑占。6.1

6、.3 SMD Layout Spec 觑格)Pan-International Industrial Corp.Subject:PCBLayoutDoc No :WI-page 4 ofRevision: 0127China FactoryContent page6.1.3.1 SMD瓷片重容SOLDER LAND/ 焊塾面稹/ 匚 SOLDER PASTEPATTERN金易膏模型SOLDER RESISTPATTERN防焊K模型!OCCUPIED AREA估at面稹TRACKS orDUMMY TRACKS卜表悬在SMT及DIP雨槿情况下之不同规格REFLOW SOLDERING/SMT 流

7、焊SIZEFOOTPRINT DIMENSIONS IN MM/ 引脚尺寸(mm)PROCESSING REMARKS 裂作汴煮串瑁PLACEM. ACC 公差ABCDEFG06032.300.500.900.900.002.701.70+ / - 0.2508052.800.900.951.400.453.202.10+ / - 0.2512064.002.001.001.801.404.402.50+ / - 0.2512104.002.001.002.701.404.403.40+ / - 0.25WAVE SOLDERING /DIP 波峰焊SIZEFOOTPRINT DIMENSIO

8、NS IN MM/ 引脚尺寸(mm)PROCESSING REMARKS 熨作汴意事瑁PLACEM. ACC 公差ABCDEFG06032.700.900.900.800.003.202.101+ / - 0.2508053.401.301.051.300.204.302.701+ / - 0.2512064.802.301.251.701.255.903.203+ / - 0.2512105.302.301.502.601.256.304.203+ / - 0.256.1.3.2 SMD 狙重容Pan-International Industrial Corp.China FactoryRe

9、vision: 01Subject:PCB LayoutDoc No :WI-page 5 of 27SOLDER LAND/ 焊塾面稹/SOLDER PASTEPATTERN 金易膏模型SOLDER RESISTPATTERN防焊K模型OCCUPIED AREA估at面稹TRACKS orDUMMY TRACKSContent page卜表悬在SMT及DIP雨槿情况下之不同规格REFLOW SOLDERING/SMT 流焊SIZEFOOTPRINT DIMENSIONS IN MM/ 引脚尺寸(mm)PROCESSING REMARKS 裂作注意事PLACEM. ACC 公差ABCDEFGA

10、4.001.801.101.200.904.402.30+ / - 0.25B4.301.801.252.000.904.703.30+ / - 0.25C6.803.201.802.402.307.204.0+ / - 0.25D8.304.701.803.303.808.705.00+ / - 0.25WAVE SOLDERING /DIP 波峰焊SIZEFOOTPRINT DIMENSIONS IN MM/ 引脚尺寸(mm)PROCESSING REMARKS 裂作注意事PLACEM. ACC 公差ABCDEFGA5.901.902.002.600.756.404.002+ / - 0.

11、25B6.501.902.302.600.757.005.30+ / - 0.25C9.903.303.303.202.1010.46.60+ / - 0.25D11.84.803.504.303.6012.38.0+ / - 0.25Subject:PCB LayoutDoc No :WI-page 6 of 276.1.3.3 SMD MELF 二趣管SOLDER LAND/ 焊塾面稹 匚 SOLDER PASTEPATTERN金易膏模型SOLDER RESISTPATTERN防焊K模型OCCUPIED AREA估at面稹TRACKS orDUMMY TRACKS卜表悬在SMT及DIP雨槿

12、情况下之不同规格REFLOW SOLDERING/SMT 流焊PACKAGE TYPEFOOTPRINT DIMENSIONS IN MM/ 引脚尺寸(mm)PROCESSING REMARKS 裂作注意事PLACEM. ACC 公差ABCDEFGSOD 804.302.301.001.701.904.702.50+ / - 0.25SOD 874.302.301.002.101.904.702.90+ / - 0.25SOD 87S4.302.301.001.601.904.702.30+ / - 0.25WAVE SOLDERING /DIP 波峰焊PACKAGE TYPEFOOTPRIN

13、T DIMENSIONS IN MM/ 引脚尺寸(mm)PREFERED SOLDERING DIRECTIONPLACEM. ACC 公差ABCDEFGSOD 804.902.701.101.702.106.302.90+ / - 0.25SOD 874.902.701.102.102.106.903.50+ / - 0.25SOD 87S4.902.701.101.502.106.002.60+ / - 0.25Pan-International Industrial Corp.China Factorysubject：PCB Layout UMDoc No :WI-page # of 2

14、7Revision: 016.1.3.4 SMD IC Small Outline SOP 8 - SOP 32rFSOLDER LAND/SOLDER PASTE 焊塾面稹/金易膏模型SOLDER RESISTPATTERN防焊K模型OCCUPIED AREA 估at面稹ENLARGED SOLDER LAND （ 大焊黑占面稹）BAF0.301.20LT10.60-2）XGDIP波峰焊"sOlder-lan-T-SOLDER ALND PATTERN焊塾面稹/金易膏模型L!SOLDER RESISTPATTERN防焊K模型OCCUPIED AREA估at面稹BOARD DIREC

15、TION （PCB 流向）Content pageDURING WAVE SOLDERING（It波峰金易墟）Pan-International Industrial Corp.China FactoryREFLOW SOLDERING （SMT 流焊）PACKAGE TYPE（包装形式）ENVELOPE SPEC.（封装规格）NFOOTPRINT DIMENSIONS IN MM（引脚尺寸）PLACEMENT ACCURACY （公差）ABCFGSO-8SOT96-186.604.001.307.005.50+ / - 0.25SO-8LSOT176-1811.008.001.5011.40

16、8.40+ / - 0.25SO-14SOT108-1146.604.001.307.009.30+ / - 0.25SO-16SOT109-1169.005.501.307.0010.50+ / - 0.25SO-16LSOT162-11611.008.001.5011.4010.90+ / - 0.25SO-20LSOT163-12011.008.001.5011.4013.40+ / - 0.25SO-24LSOT137-12411.008.001.5011.4016.00+ / - 0.25SO-28LSOT136-12811.008.001.5011.4018.50+ / - 0.2

17、5SO-28XLSOT213-12812.409.001.7012.8018.60+ / - 0.25SO-32XXLSOT221-13214.8011.801.5015.2021.10+ / - 0.25WAVE SOLDERING（波峰焊）PACKAGE TYPE（包装形式）ENVELOPE SPEC.（封装规格）NFOOTPRINT DIMENSIONS IN MM（引脚尺寸）PLACEMENT ACCURACY （公差）ABCFGSO-8SOT96-188.003.802.109.407.10+ / - 0.25SO-8LSOT176-1811.507.901.8013.0010.90

18、+ / - 0.25SO-14SOT108-1148.003.802.109.4010.80+ / - 0.25SO-16SOT109-1168.003.802.109.4012.10+ / - 0.25SO-16LSOT162-11611.507.901.8013.0013.40+ / - 0.25SO-20LSOT163-12011.507.901.8013.0015.90+ / - 0.25SO-24LSOT137-12411.507.901.8013.0018.50+ / - 0.25SO-28LSOT136-12811.507.901.8013.0021.00+ / - 0.25SO

19、-28XLSOT213-12812.709.001.8514.2021.50+ / - 0.25SO-32XXLSOT221-13215.3011.701.8016.8024.00+ / - 0.25Content pagePan-International Industrial Corp.ChinaFactorySubject:PCB Layout UMDoc No :WI-page 9 of 27Revision: 016.1.3.5 重晶H SOT-23 and SOT-143REFLOW SOLDERING （焊）SOT-23WAVE SOLDERING（波峰焊）SOT-2301Q10

20、02003001QooOt3004；1.10；10：85一32.80.3.20REFLOW SOLDERING （焊）002i.110 J.0 85 .2.80k3 20。50力1加i4.00_4.50WAVE SOLDERING（波峰焊）SOT-143 Ii93.1 50.1 00 .4.004.50: >I: ; >Qoo OT0193 -Pan-International Industrial Corp.China Factory6.1.3.6 重晶H SOT-89 and SOT 223SOLDER LANDPATTERNr：zz:z：jSOLDER RESISTPATTE

21、RNSOLDER PASTEPATTERNOCCUPIEDAREAREFLOW SOLDERING （ 焊）SOT-89Q5.2.202.70OD1QU2REFLOW SOLDERING 网流焊）SOT-2233 80*QN78.00006WAVEtSOT-223I QU4QU9SOLDERING（波峰焊8.70:4.104Pan-International Industrial Corp.China Factorysubject：PCB Layout UMDoc No :WI-page # of 27Revision: 016.1.3.7 SOJ 24 & SSOP 20nSOLDE

22、R LAND/SOLDER PASTEPATTERN焊塾面稹/金易膏模型SOLDER RESISTPATTERN防焊K模型OCCUPIED AREA估at面稹SOJ 24REFLOW SOLDERRING （;® 流焊）PACKAGE TYPE（包装形式）RNVELOE. SPEC.（封装规格）NPFOOTPRINT DIMENSIONS IN MM（ 引脚尺寸）公差ABCDFGSOJ 24SOT 239-1241.2710.55.21.700.609.5016.10+ / - 0.25SSOP - 20REFLOW SOLDERRING （波峰焊）PACKAGE TYPERNVEL

23、OE.SPEC.NPFOOTPRINT DIMENSIONS IN MM公差ABCDFGSSOP - 20SOT 266-1200.656.904.701.100.357.307.00+ / - 0.25Content pagePan-International Industrial Corp.ChinaFactorySubject:PCB Layout UMDoc No :WI-page 12 of 27Revision: 016.1.3.8 IC Quad Flat Pack QFP 44 - QFP 208SOLDER LAND/SOLDER PASTEPATTERNSOLDER RES

24、ISTPATTERNP(Nx-1)XOCCUPIEDAREAContent pagePan-International Industrial Corp.China FactoryRevision: 01Content pageREFLOW SOLDERING /SMT 退流焊PACKAGE TYPEENVELOPE SPEC.NXNYFOOTPRINT DIMENSIONS IN MM/ 尺寸规格PLACEMACC./公差PAXAYBXBYCDQFP44SOT20311110.8015.0015.0010.8010.802.100.40+ / - 0.15QFP44SOT20511111.00

25、19.4019.4014.7014.702.350.50+ / - 0.25QFP48SOT19612120.7515.7015.7010.5010.502.600.40+ / - 0.15QFP64SOT20819131.0025.4019.4021.5015.501.950.50+ / - 0.25QFP80SOT21924160.8025.4019.4021.5015.501.950.40+ / - 0.15QFP100SOT21030200.6525.4019.4021.5015.501.950.35+ / - 0.10QFP120SOT22030300.8033.4033.4029.

26、7029.701.850.40+ / - 0.15QFP 128SOT24432320.8033.4033.4029.7029.701.850.40+ / - 0.15QFP128SOT28032320.8032.6032.6029.7029.701.450.40+ / - 0.15QFP160SOT22540400.6533.4033.4029.7029.701.850.35+ / - 0.10QFP20852520.533.0033.4029.7028.701.850.25+ / - 0.106.1.3.9 IC PLCC 20 PCLL 84AXI I Ii!IFSubject:PCB

27、LayoutDoc No :WI-page 14 of 27REFLOW SOLDERINGPACKAGE TYPEENMEL OPESPEC.NXNYFOOTPRINT DIMENSIONS IN MMPLACEM.ACC.AXAYBXBYCFGPLCC-20AL15510.3010.306.606.601.8510.7010.70+ / - 0.25PLCC-28AQ17712.8012.809.109.101.8513.2013.20+ / - 0.25PLCC-32AE29715.4012.8011.709.101.8515.8013.20+ / - 0.25PLCC-44AX1111

28、117.9017.9014.2014.201.8518.3018.30+ / - 0.25PLCC-52AA1131320.4020.4016.7016.701.8520.8020.80+ / - 0.25PLCC-68AB1171725.5025.5021.8021.801.8525.9025.90+ / - 0.25PLCC-84AC1212130.6030.6026.9026.901.8531.0031.00+ / - 0.256.1.3.10 SMD RP (RN)Pan-International Industrial Corp.China FactoryRevision: 01Su

29、bject:PCB LayoutDoc No :WI-page 15 0f 27Mil (mm)PitchP31.5 (0.80)25.6 (0.65)19.7 (0.5)Body SizeX0一Y0PAD SizeX16 (0.40)13 (0.33)10 (0.25)Y40 (1.0)40 (1.0)40 (1.0)Mask SizeX16 (0.40)13 (0.33)10 (0.25)Y40 (1.0)40 (1.0)40 (1.0)Paste SizeX16 (0.40)13 (0.33)10 (0.25)Y40 (1.0)40 (1.0)40 (1.0)SHAP SizeX194.

30、5102.498.5Y1656565Silk SizeL0150.5145.4148.5W0145145145Place SizeL1150.5145.4148W1165165165Unit : mil (mm)6.1.3.11 BGAContent pageOrigion Mark +:定 於Body中心.BGA Body 下之 VILHole皆须覆JO录漆VLA Hole翥量外拉L1PITCHP50 (1.27)Body SizeX0Y0PAD SiZEX20 (0.51)Y20 (0.51)Mask SizeX26 (0.66)Y26 (0.66)Paste SizeX20 (0.51)

31、Y20 (0.51)SHAP SizeX1(N-1)*PY1(N-1)*PSilk SizeL0X1+X+20 or X0+20W0Y1+Y+20 or Y0+20Place SizeL1X1+X+200 or X0+200W1Y1+Y+200 or Y0+200Note : + N Pin 数Unit : mil (mm)S Silk Size & Place Size的数值取敕大值Subject:PCB LayoutDoc No :WI-page 17 of 276.2. EMI (甯磁干摄)部份:6.2.1 隔离隹(Moat)：6.2.1.1. Moat 规格：(1) .板源唇内

32、缩，防止短路用，最小度 50mil(See A)?(2) .板内隔离隹不同雷源畤，最小宽度 30mil(See B)?(3) .板内隔离隹亲储ft畤，最小SE度 30mil(See C)?(4) .板内霜源唇走信虢畤，隔离隹用Moat典Trace遏最小宽度12mil(See D).(5)隔离隹H典外界相通之通路，最小度 30mil(See E)?6.2.1.2. Moat 使用畤(1) .板JTB源唇内缩，防止PCB裂作畤，短路用?.板内隔1a背也畤？(3) .板内隔离隹唇走信虢畤，隔离隹用？(4) .板内隔离隹不同雷源畤？subject：PCB Layout UMDoc No ： WI-pa

33、ge # of 27Revision: 01Pan-International Industrial Corp.China Factory6.3 横部分1.1.1 短易孔（PTH）:置:孔零件之Drill Hole（ 孔）以Pin之封角或直彳至加上 0.3 0.4 mm悬原JWContent pageDrill Hole Size :外形状：正方型BI型扁平型竟度加 0.3 mm (12mil.) =DH. (孔)直彳至加 0.3 mm (12mil.) =DH. (孔)晨度加 0.2 mm (8mil.) =DH. (孔)PAD Size : Drill Hole + 12 mil. (Mi

34、n Size).Power Size : PAD Size + 20 mil.Mask Size : PAD Size + 10 mil.DH （PTH）数St参考表外扁平外形外方形Drill SizePAD Size0.6 (24)0.5 (20)0.8 (32)1.27 (50)0.7 (28)0.6 (24)0.9 (36)1.27 (50)0.8 (32)0.7 (28)1.0(39)1.37 (54)0.7 (28)1.05 (41)1.37 (54)0.8 (32)1.1 (43)1.5 (60)0.9 (36)1.2 (48)1.6 (63)13 (51)1.6 (63)2.54

35、 (100)2.9 (114)3.2 (125)4.0 (158)Pan-International Industrial Corp.China FactoryRevision: 01Subject:PCB LayoutDoc No :WI-page 19 0f 271.1.2 非通孔(NPTH )塑月蓼柱直彳至加0.05mm (2mil) = DH例:EISA Slot 2.54mm + 0.05mm = 2.59mm 100mil + 2mil = 102 milPCI Slot 2.44mm + 0.05mm = 2.49mm(96mil + 2mil = 98mil)Drill Hol

36、e Size : Lead(外) Size + 2mil.PAD Size : Drill Hole .Power Size : PAD Size + 20mil.Mask Size : PAD Size + 10mil.Content pagePan-International Industrial Corp.China Factorysubject：PCB Layout UMDoc No :WI-page # of 27Revision: 016.4 PCB Component Place（零件布置）限制:6.4.1 PCB板遏5mm(197mil)内不得有零件脐及 SMT PAD6.4.

37、2 PCB四低I角，以Tooling Hole悬BI心,半彳至10mm内不可有A/I插件之 零件脐及SMD PAD.6.4.3 OSC之方向性需要典 SMD IC& DIP IC 一致且於同一片 PCB上全部方向需一致，以插件方向最好Pin1朝上或朝左？除此 OSC,SocketJ#避免Layout於Slot或其他敕高之零件旁遏， 以利月蓼带固定OSC作H?6.4.4 排阻方向需一致，以作渠方向最好 Pin1朝上或朝左？6.4.5 有趣性之零件，如霜解霜容、IC、二趣H、雷品醴等方向需一致？6.4.6 彳纷循装之零件,如:BIOS,PAL,OSC等,最好距Slot或SIMM Socke

38、t& DIMM Socket 在 10mm(39mil)以上？6.4.7 零件IW之最小IW距，悬雨PAD 之距离隹至少悬0.5mm?6.4.8 外段接地之零件，如：OSC,Crystal 等，其Component BODY距任何Trace 或 VIA 需大於 0.5mm(20mil)?6.4.9 DIP零件其方向需於金易波方向平行 ？tt面板有SMD零件不必。若曼面有SMD零件畤符金易波面之 SMD之PAD房竟加大20%。6.4.10 CPU Socket之拉捍半彳至X=10mm(120mil),不得有高於3mm(120mil)之零件摆放。6.4.11 BGA零件翥可能不要Layou

39、t在PCB中央，若11面有SMD零件畤BGA正下方不要有任何 零件。6.4.12 Slot 或外接Cable之零件旁翥量不要置放敕高之零件，以方便黜装之作H。6.4.13 PCB SMT 作渠流向：6.4.13.1 K片：若金手指遏之PCB法度小於250mm, U金手指方向舆PCB流向一致；若PCB 法度大於250mm,即侬舆PCB流向垂直。PCB流向Content pagePan-International Industrial Corp.China FactoryRevision: 01CB流向PCb流向W<250mm6.4.13.2 排版：金手指方向舆PCB流向一致，且排版彳爰金手

40、指遏之PCB辰度不彳#大於250mmPCB流向Content page6.4.14 .PCB 走 限制6.4.14.1 PCB板遏 1mm(39mil)内不得有 Trace & VLA。6.4.14.2 Tooling Hole 蜃短外 1mm(39mm)内不得有 Trace Solder mask, 5mm 内不得有 SMD PAD。6.4.14.3 四唇板以上之内屑VCC & GND之醇通通道，不可被穿孔或零件脚分割成断路或厚通不完全，其Thermsl PAD之四低I醇通通道必须保留三僚。6.4.14.4 Trace 翥量走 45 度角。6.4.14.5 SMD PAD若相

41、舜B雨Pin有逋接拉Trace畤鹰拉出PADSubject:PCB Layout 烷Doc No :WI-page 22 of 276.5 .自行黑占部份:6.5.1 浏副裸占的规格:籍孔尺寸参考醇通(VIA)PAD Min=30milPAD Max 三 100mil的孔彳至或使用SMD的PAD6.5.2 测就黠置放的船W及限制：(1) .测IS黑占典测IS黑占之中心距离隹至少要大於 75mil,最佳建100mil以 上，其次悬75mil以上，7550mil 之测流!岭H先行知1r ATE部吗 方可迤行置放？(2) .Tooling Hole ®H 200mil 内不可有测IS黑占？

42、(3) .醇通孔大於100mil者，不可以作悬测副停占，需有额外定羲之测副停占(例 Power Connector在SMT测前存，因孔彳至大需使用比100mil更大直彳至的 探金七 且因探金十特殊所以曾增加裂造成本？(4)侧翻嘉品青段言十在焊金易面(背面)，减少治具樊展畤及费用？(5)侧翻裸占悬尺寸30mil之正方形焊金易塾，attS定元件名耦(Device),(例:TP1, TP2)，G青翥可能段言十测就此I®策测流!占)?(6) .以VIA孔四U曲黠畤，VIA需Device名耦(例:TOP,TIP2X1其测 就面(背面)的尺寸必须大於30mil,阳»防焊屑(Solder

43、 Mask)打H?(7) .距板遏50mil内不可IS言十四UIS黑占？(8)侧翻嘉品青翥量均匀分怖於械板上，避免局部探金十密度谩高？(9) .Toolig Hole ig#,襟型悬四方各有一他I,才能举碓及平稳下屋，小板子 若因空的题瓢法段言十四(0,吉青段言十至少雨(0,建S!置於11遏，但以 SMT 部分悬主？(10) .BGA Body之背面不可有测副停占，因裂程信由彳系，裂造罩位要求漆？(11) .DIPf!容，Fuse等易阳斜之元件位置，(斜彳爰(裂程彳爰)不曾羞到IC Chip 上方。(12) .版本建更畤，以不建勤测副停占位置悬原JW (Node不建)，测副停占若有增 力口，言

44、青利用不使用之测副停占位置或另外拉出额外的测副停占？(13)侧翻裸岭H 100%力口入如有困须知曾ATE部因，作曲湖解决？(14) .Power Nodet(段言十四(0浏就黑占？(15) .Connector之脚距若谩小(10mil),言青隔一脚另拉测被盗占？Subject:PCB Layout 烷Doc No :WI-page 23 of 27(16) .IC Chip之每一脚均要有测副停占，包含不用之腕位，NC腕例除外？(17) .|H ICT治具畤，言青提供空板，SMT上件板，BOM,路H, CADFiles(例:PCAD=>*.PDF,PADS=>*ASC, MENTOR

45、=>CF.VSS;NF.VSS;PF.VSS;ROUTE.VSS;NEUTRAL) ?(18)用ATE治具提供之资料悬装板，SMT上件板不用,其他相同？(18) 4.Tooling Hole Spec &Place :2.Place合排版)：(1) .PCB上至少有三低I Tooling Hole,若悬ft面SMT JOMH四角 皆有，若悬Card U至少雨他I以上？(2) Tooling Hole IW之距离隹公差 A or A1此075mm(3) .Tooling Hole 中心距板X=5 此1mm(197Mmil)?A1Subject:PCB LayoutDoc No :W

46、I-page 24 of 276.6 本甫助部份6.6.1. PCB是宽厚差：6.6.1.1 S m25mm(10mil).6.6.1.2 竟 由25mm(10mil).6.6.1.3 .厚 此05mmi( 2mil ).6.6.2. PCB铜箔及金厚度:6.6.2.1 内唇铜箔厚度1.0 oz.6.6.2.2 铜箔厚度1.0 oz.6.6.2.3 金手指金厚度：6.6.2.4 Add on Card=10u.6.6.2.5 殊规格依除需求而定6.6.3. PCB Warpage6.6.4. PCB 醇角：PCB四低I角，需作蹲角，R角3mm(118mil),以防止PCB撞像?6.6.5. P

47、CB文字襟示：6.6.5.1 一般规定：6.6.5.1.1 文字面襟示，以清晰易辨原U .6.6.5.1.2 文字不可互相重叠.6.6.5.1.3 文字不可在 VIO Hole &PAD 上.6.6.5.1.4 所有文字1必须 6mil以上.y字高50mil以上.6.6.52特殊需求：除上述之外，必i(另外襟示下列各文字:6.6.5.2.1. Project Name(Size 100mil).6.6.5.2.2. Rev: (Size:100mil).Subject:PCB LayoutDoc No :WI-page 25 of 27例:P6LX-ARev:1.0A25mil? Serial no:30*5mm(1181*197mil)之58留S/N位置,不可有PAD及其他文字Bar Code 襟示:(