分公司经理求职英文简历表格

分公司经理求职英文简历表格分公司经理求职英文简历表格 用人单位在招聘期间也会收取到大量的个人简历，求 职者也需要了解在职场中击败竞争对手的方式，比如说利 用个人简历来击败对手。那么，求职者又该如何利用个人 简历击败竞争对手呢 在求职的过程中个人简历起到怎样的作用，在竞争方 面又能起到怎样的作用，这是更好利用个人简历的来在竞 争中为自己加分，进而才能在有效的击败竞争对手。在编 写个人简历之前，也要根据个人简历的作用，来从中领悟 到个人简历的竞争力包括有哪些方面，像是个人简历整体 外在形象、个人简历的基本内容，还有个人简历中所突出 的重点部分等等，这些都是可以作为竞争优势。 利用个人简历来击败竞争对手，简单来说就是通过个 人简历来顺利的获得求职面试的机会，从而来提高求职成 功率。在这里个人简历能够顺力的通过筛选，也就是人通 过其高品质的简历效果。编写出高质量的个人简历，一来 要能够的明确的指导什么样的个人简历更具有吸引力，二 来要学习个人简历的写作技巧，尤其是在语言的使用方面。 Name:fwdqSex：Date of Birth：Hukou：Residency：Work Experience：Current Salary：Tel：Email：Career ObjectiveDesired Industry：Electronics/Semiconductor/IC ,Science/Research ,Government ,Others ,Testing, CertificationDesired Position：Senior Hardware Engineer ,Semiconductor Technology, Branch Office Manager ,Chief Representative ,Research Specialist StaffDesired address：Shanghai ,Hongkong ,Beijing ,Taiwan ,MacaoDesired Salary：NegotiableWork ExperienceXX/06Present*CompanyIndustry: Electronics/Semiconductor/IC Intel Flash Engineering Department Individual Contributor Responsibilities： I have been working in Intel Flash Assembly Test Engineering Department as an Individual Contributor since June of XX. Being Leader of ATE Yield team, I have been working with the team members to improve the products yield. Our efforts are paid off: yield of year XX has been dramatically increased than that of year XX. yield of all products, consecutively meets the goal. total amount of cost saving due to yield improvement is more than 1 million compared with year XX. Being the Leader of Board Repair Team in ATE, I worked with my team members, setup a set of new procedure to replace the current one, I defined the schedule, divided the roles responsibilities among team members, follow up the progress. Finally, the team has made a great cost saving of in XX. Report Directly to: Department ManagerNumber of Subordinate: 14 Reference: Bao Powel Achievements: Being Leader of ATE Yield team, I have been working with the team members to improve the products yield. Our efforts are paid off: yield of year XX has been dramatically increased than that of year XX. yield of all products, consecutively meets the goal. total amount of cost saving due to yield improvement is more than 1 million compared with year XX. Being the Leader of Board Repair Team in ATE, I worked with my team members, setup a set of new procedure to replace the current one, I defined the schedule, divided the roles responsibilities among team members, follow up the progress. Finally, the team has made a great cost saving of in XX.XX/01XX/05Intel(Shanghai) Technology Development Ltd. CompanyIndustry: Electronics/Semiconductor/IC Intel STTDChina Department Electronics Development Engineer Responsibilities： had been working in STTDChina since Jan XX to May XX as a senior module engineer. that time, as a main contributor of this project, we succeeded in developing a set of MASSIVELY PARALLEL CLASS TEST equipment, which is able to test more than 6700 units in one time. Report Directly to: Hopman MarkNumber of Subordinate: 14 Reference: Bao Powel Reason for Leaving: I was transferred to Intel（Shanghai）Products Ltd. Company due to the internal reorganization in June of XX. Achievements: As a main contributor of STTDChina department, I cowork with my colleagues to succeed in developing a set of MASSIVELY PARALLEL CLASS TEST equipment, which is able to test more than 6700 units in one cycle.XX/05XX/01Nanyang University of Science TechnologyIndustry: Electronics/Semiconductor/IC Electronics Electrical Engineering Department Research Fellow Responsibilities： work in Electronics Electrical Engineering Department of Nanyang University of Science Technology as a Research Fellow. majored at Gate Oxide Reliability Research in the duration. Report Directly to: Professor Pey Kin Leoh Subordinate: 3 Reference: Patrick Low Reason for Leaving: I completed the project which I undertook by myself, and want to do more challenging job. Achievements: In less than one year, I made a lot of experiments and acquired the wonderful data for the project by myself.Project ExperienceXX/01 PresentAssembly NPI (New Product Introduction)Project Description: To introduce more products into Intel Flash Assembly factory, I join Assembly NPI team and work as the team leader. I coordinate with IE, Planner, Marketing guy and Engineer to select new product items, do demo in factory, and then qualify it. Responsibility: I am working as NPI Team leader and coordinate all team members, define the NPI candidate, make Assembly build plan, follow up the /01XX/12Marginal Electrical Boards RescueProject Description: To rescue some electrical boards of testing equipment, a Task Force team was built up and led by me. We categorized each kind of board, made historical failure analysis on each kind of board and around million dollars was saved finally. Responsibility: Being the team leader, I took the job of data analysis, define each members role, make program plan, coordinate each team member and follow up the /10XX/05Optimization the current Test Process Order for Flash MemoryProject Description: To simplify the current Test procedure and enhance the working efficiency, a Task Force team has been called and started by me. Responsibility: Being the Project leader, I take the main responsibility, such as, design, plan, organize and /05XX/12Test Yield of Flash memory ImprovementProject Description: To improve the test yield of different products, a Task Force team was built up and led by me. Being the team leader, I worked with all team members to dig out the failure root cause for each product, defined action taken plan for each emergency case, coordinated each team member and make proactive plan to avoided unexpected things happen. Responsibility: Being the team leader of Improving Test Yield, coordinate each team member, make program plan and follow up.Education and Training XX/05XX/01Nanyang University of Science Technology Microelectronics DoctorateI worked in Nan yang University of Science Technology as a Research Fellow. I major at Gate oxide Reliability research in the /03XX/03Seoul National University of Korea Microelectronics OthersI had been working in National Physical Lab of Seoul National University in Korea since March of XX to March of XX as a Postdoctor. Where I unhook the project of research development of CarbonNan tube Biosensor. And only after one year, an EIS sensor based on CMOS technology has been successfully produced. And one SCI paper about it has been published in Semiconductor Science and /03XX/03Shanghai Institute of Microsystemsand Information Technology，Chinese Academy of Sciences InformationTechnology Doctorate1998/09 XX/03Nanjing University of Science Technology Material Science