PCB工程问客

Common Query I. Board thickness1. Lay-up2. Mismatch between the lay-up board thicknesses3. Relax board thickness toleranceII. Carbon inkIII. Cu thickness & Pad1. Add Cu clearance for NPTH or consider 2nd-drill2. Add dummy pattern3. Copper close to board edge4. Copper extending to unit edge5. Delete NPTH pad6. Distance between two pads less than 4mil7. Isolated fiducial mark8. No space to enlarge pads to ensure 2mil annual ring9. Pad size is too small10. PTH hole with elliptic pad11. Relax Cu thickness on outer layer12. Relax Cu thickness on outer layerIV. DWG1. Label in DWG is undefined2. No DWG with dimension 3. Unit DWG size is smallV. General criteria1. Common criteria2. E/T stamp3. Our logo4. X-outVI. Gold finger 1. Delete solder mask bridge between gold fingers2. Relax tolerance for bevel size3. Relax beveling angle or disregard the remaining thickness4. Space between gold finger edge and outline is too narrow5. Space between test pad and the top of gold finger is too narrowVII. Hole1. Blind/buried hole2. Breakaway hole is partially on copper plane3. Change overlapped hole as slot4. Drilling positional tolerance5. Relax tolerance for NPTH6. Relax tolerance for PTH7. Repeated hole8. Routing hole9. Rectangular holeVIII. Impedance 1. Calculated value trends to the limit2. Match impedance3. Reference plane4. Which trace should be controlledIX. Inner cornerRight angleX. Outline dimension1. Connection tab far away from unit edge2. Mismatch between CAD/CAM data and DWG3. Miss dimension4. Narrow connection area between breakaway holes5. No tooling hole6. Relax tolerance for outline dimension7. Uneven tolerance8. Useless dimension9. Add overshootXI. PackingXII. Peelable solder mask1. Peelable solder mask covered hole2. Peelable solder mask plugged hole3. Relax thickness for peelable solder mask4. Without the detail dimension of peelable solder maskXIII. Silkscreen1. Marking in hole or pad2. Marking in large solder surface3. Legend on step areaXIV. Slot1. Relax tolerance for non-plated slot2. Relax tolerance for plated slotXV. Solder mask1. Add S/M Bridge for SMT2. Change S/M plugged hole to covered hole3. Hole size is too large to plug4. Hole size is too small to cover5. Relax solder mask thickness6. S/M cover gold finger7. Solder mask material8. Spacing is too narrow to add S/M BridgeXVI. Solder thicknessRelax solder thicknessXVII. TABWithout TAB on one row of units at the centerXVIII. TgTg value is not specified for High Tg materialXIX. Trace1. Connection between Cu grounds is too thin2. Exposed trace from solder mask opening3. Relax etching tolerance4. Self-spacing5. Spacing between two traces is too narrowXX. Transfer boardSample approvalXXI. V-Cut1. Discontinuous V-Cut2. Relax V-Cut remain thickness tolerance3. Relax V-Cut groove angle tolerance4. V-Cut remain thickness is too weak5. V-Cut run across BATXXII. WarpageRelax warpageI. 板厚 1. 排板结构2. 排板结构和板厚要求不一致3. 释放板厚公差II. 碳油III. 铜厚& Pad1. 为考虑二次钻孔的NPTH加Cu clearance2. 加 dummy pattern3. 铜距板边太近4. 铜延伸至单元边5. 删除NPTH的PAD6. 相邻两PAD距离小于4mil7. 独立Fiducial mark8. 没有足够的空间来加大PAD以保证2mil焊锡圈9. Pad尺寸太小10. 有椭圆PAD的PTH孔11. 释放孔壁铜厚12. 释放外层铜厚IV. DWG1. 图纸标记不明2. 没有标注尺寸的图纸 3. 单元图尺寸太小V. 常规Query1. 普通标准2. E/T 印3. 公司 logo4. 单元报废VI. 金手指 1. 删除金指间的绿油桥2. 释放斜边尺寸公差3. 释放斜边角度或忽略残留厚度4. 金指边离外围太近5. 测试PAD离金指顶部太近VII. 孔1. 盲/埋孔2. 折断孔部分在铜面上3. 改重孔为槽4. 钻孔位置公差5. 释放NPTH公差6. 释放PTH公差7. 重孔8. 锣孔9. 矩形孔VIII. 阻抗 1. 阻抗计算值偏向上/下限2. 匹配阻抗3. 阻抗参考面4. 哪一条线要求控制阻抗IX. 内角内角为直角X. 外形尺寸1. 相连TAB远离单元边2. CAD/CAM数据与DWG不一致3. 缺少尺寸4. 折断孔连接区域太窄5. 没有工具孔6. 释放外形尺寸公差7. 孔到孔公差不对称8. 无用尺寸9. 加OvershootXI. 包装要求XII. Peelable solder mask1. 蓝胶盖孔2. 蓝胶塞孔3. 释放蓝胶厚度4. 缺少蓝胶详细尺寸XIII. 丝印1. 白字入孔/上PAD2. 白字上大锡面3. 白字部分在铜面上部分在基材上XIV. 槽1. 释放非电镀槽公差2. 释放电镀槽公差XV. 绿油1. 为SMT加绿油桥2. 改绿油塞孔为盖孔3. 孔太大不便绿油塞孔4. 孔太小不便绿油盖孔5. 释放绿油厚度6. 绿油盖金指7. 绿油材料8. 间距太小不便加绿油桥XVI. 铅锡厚度释放铅锡厚度XVII. TAB单元间无 TABXVIII. Tg高Tg材料的Tg值未指明XIX. 导线1. 两个Cu ground间连接太小2. 绿油开窗露线3. 释放蚀刻公差4. 线路自身间距太小5. 线间太窄XX. 转板样板转生产板XXI. V-Cut1. 跳 V-Cut2. 释放V-Cut残留厚度公差3. 释放V-Cut槽角度公差4. V-Cut残留厚度太小5. V-Cut穿过BATXXII. 板曲释放板曲Straight matterI. Board thickness1. Lay-up In DWG, customer mentioned layer order only, but didnt indicate the dielectric thickness between layers and Copper thickness. So, we suggest you follow the lay-up shown on attached file XX. Please confirm.2. Mismatch between the lay-up and board thickness According to the lay-up specified by customer, the overall board thickness will be XXX mil, not the customer nominal requirement of YYY mil. So, we suggest: A). To follow the lay-up specified by customer and change the overall board thickness to YYYmil+/-10%, OR B). To modify the lay-up as shown on attached file and control the overall board thickness to be XXX mil per customer requirement. Please clarify which item (A or B) customer preferred.3. Relax board thickness tolerance Customer required controlling the finished board thickness to be XX%, however, the standard tolerance for board thickness is +/-10%. We can achieve tighter tolerance by ordering non-standard materials, however, it will take a long lead-time and a high price to purchase this special material. So, we suggest you relax the tolerance from XX% to +/-10%. Please confirm.II. Carbon ink According to master A/W, carbon ink will be printed on contact finger. While the carbon/carbon isolation spacing is too narrow: Item Master A/W Our capabilityCarbon/carbon isolation spacing: X mil 14milCarbon width: Y mil 12mil(min)Cu finger width: U mil NILCarbon/Cu overlapping: Z mil 6mil(min)Carbon misregistration: +/-X mil +/-5mil In order to facilitate in production, we suggest you modify master A/W as below: Item on Master A/W Change toCarbon/carbon isolation spacing: X milCarbon width: Y milCu finger width: U milCarbon/Cu overlapping: Z milPlease confirm.III. Cu thickness & Pad1. Add Cu clearance for NPTH or consider 2nd-drillThe non-plated hole located in ground plane (OR a large pad: DIAXXX), in order to facilitate in production, we suggest we shave Cu and add a 10mil clearance around non-plated holes. Please confirm.2. Add dummy patternAs the distribution of Cu pattern is very uneven on outer layers, in order to balance plating and improve quality, we suggest you add some dummy pattern in blank area. The dummy shape and size see attached file. Please confirm.3. Copper close to board edgeIn some locations, copper features are closer than 15mil(10mil) from the outline. This presents the risk of exposed copper at board edges. We suggest we shave copper to get sufficient spacing. Please confirm.4. Copper extending to unit edgeIn some locations, copper has extended to unit edge. If we follow master A/W to build, copper will be exposed at unit edge. So, we suggest we shave copper to get sufficient spacing. Please confirm.5. Delete NPTH padFor some non-plated holes (DIA: XX), their pad size (DIA: XXX) is larger than hole size. In order to facilitate in production, we suggest you delete these pads. Please confirm6. Distance between two pads less than 4milOn component side/solder side, the spacing between two pads is too narrow (X mil only). As the two pads have been connected together in inner layer YY. In order to facilitate in production, we suggest we shave the pads and keep 5mil spacing. Please confirm.7. Isolated fiducial markThe isolated fiducial marks are easy to be peeled off during the hot air leveling. In order to avoid this problem, we would suggest you add a circular copper ring around the fiducial mark under solder mask.8. No space to enlarge pads to ensure 2mil annual ring To ensure 2mil annual ring, we need enlarge the pads to 35mil (min). But according to master film, there is no enough spacing to enlarge these pads, so we suggest to try our best to enlarge them, and ensure 2mil annual ring at the joint of trace and pad. By doing this, there may be hole breakout in other area, please suggest customer to accept.9. Pad size is too smallAccording to master A/W, the via hole pad is too small (hole size: MMM, pad size: NNN). As there isnt enough spacing for us to add these pads. In order to select a smaller drill we suggest you change the tolerance of via hole from XXXX+/-3mil to XXXX+0/-6mil. Please confirm.10. PTH hole with elliptic pad Per master artwork, we found some PTH holes (DIA: XXX mil) with elliptic pad (pad size: MM X NN mil) (see attached file). As the elliptic pad was too small, thus it was ineluctable that hole will be broken on short side if we follow master artwork to proceed. We suggest to enlarge the pad suitably to guarantee a 2 mil (min) annular ring on the conjoint area, please confirm.11. Relax Cu thickness on hole wallCustomer required plating a thick copper of XXX mil on plated hole wall; however, the standard for hole wall copper plating thickness is 1.0mil minimum. Thicker copper plating can overplate surface features, depending on the circuitry distribution and create yield problems. In order to facilitate in production, we suggest you relax your minimum to the specification above from XXX mil (min). Please confirm.12. Relax Cu thickness on outer layerCustomer required using X oz copper foil for outer layer and plated to YY mil finish. Because circuit distribution will significantly affect outer layer conductor copper thickness, it is difficult to guarantee thickness greater than 1.4mil for 1/2oz foil, and 2.1mil for 1oz foil. In order to facilitate in production, we suggest you relax the overall copper thickness to be ZZ mil. Please confirm.IV. DWG1. Label in DWG is undefinedOn the panel DWG, there was one dimension XXX, which we didnt know what it indicated, please customer to clarify it, or we suggest to ignore it, please confirming.2. No DWG with dimension After measuring out-line of the Drill DWG, we suggest a draft DWG with dimension as attached file X shown. Please confirm.3. Unit DWG size is small Because of the unit DWG size is too small (MMM x NNN), in order to facilitate in our production, we design a panel DWG (see attached file), please confirm. If the above is accepted, how many scrap units (XX up/per panel) could be accept, please confirm. In order to distinguish X-out board with good board, we will draw a black cross on X-out board, and we will pack the X-out board separately, please take note.V. General criteria1. Common criteriaSome common criteria were not specified. We suggest you follow IPC-6012A CLASS 2 and our default conditions: 1. Surface finish: HAL/Immersion Gold/Entek 2. Annular ring: 2mil min 3. Solder mask color: green 4. Legend color: White (Yellow) 5. Solder thickness: On Cu Ground Area: 40u(min) (30u(min) for new customer) On SMT Pad; 100u(min) (80u(min) for new customer) 6. Etching tolerance: +/-20% 7. Outline tolerance: +/-5mil 8. Inner Radius: R63mil (max) 9. The Cu thickness of hole wall: 0.8mil(min) 10. The Au thickness: 15u(min) The Ni thickness: 80u(min) 11. Warp and twist: 0.75%(max) 12. Tolerance of hole size: For Via (Dia: 12mil): +0/-6mil For PTH (except Via): +/-3mil For NPTH: +/-2mil 13. Slot tolerance: Plated slot: width: +/-4.5mil X length: +/-5.5mil (width: +/-3mil X length: +/-4mil for tighter tolerance) Non-plated slot: width: +/-3mil X length: +/-4mil (width: +/-2mil X length: +/-3mil for tighter tolerance) 14. For blind or buried hole: The Cu thickness of hole wall: 0.5mil(min) per IPC Standard; Annular ring: 2mil(min) at connection area, 90-degree breakout at rest area. In order to strengthen the connection between hole to pad, we suggest you add teardrop for all blind/buried hole at connection area. Please confirm.2. E/T stamp In order to show the board has passed E-Test, we will place a white/black “T” stamp without S/M opening on solder/component side. Please confirm.3. Our logo We suggest to silkscreen/etch our marking on solder/component side. Please confirm.4. X-out Could one scrap unit per panel (2-UP per panel) be accepted, please confirm. How many scrap units per panel (X-UP per panel) be accepted, please confirm. In order to distinguish X-out board with good board, we will draw a black cross on X-out board, and we will pack the X-out board separately, please take note.VI. Gold finger1. Delete solder mask bridge between gold fingers There has solder mask bridge between gold fingers (see attached file 1), in order to improve gold finger quality, grinding copper surface of gold finger is required before plated gold finger process. So the small rubbish of solder mask would be created on gold fingers copper surface, which will affect gold finger quality. In order to avoid this problem, we suggest to delete solder mask bridge between gold fingers, to get full solder mask opening for gold finger. Please confirm.2. Relax tolerance for bevel size In UNIT DWG, the bevel size is XXX mil, however, the tolerance of bevel height is too tight. The standard tolerance for bevel size is +/-5mil for 30/40 degree cutter (+/-8mil for a 20 degree cutter). Tighter tolerance can be achieved with special processing. Bevel size is easily affected by the board thickness. In order to facilitate in production, we suggest you relax your tolerance to the standards above. Please confirm.3. Relax beveling angle or disregard the remaining thickness According to customers DWG, the beveling dimension was required as below sketched: Angle: XX degree; Height: YY mil; Remaining thickness: ZZ mil i) For angle +/-X degree, however, tighter tolerance can be achieved with special process. In order to facilitate the production and improve efficiency, we suggest to relax to +/-3 degree. Please confirm. ii) For the remaining thickness. In general, the beveling height was adjustable and controlled in production, while the remaining thickness was a reference in the beveling process. We suggest to only control the beveling height and disregard the remaining thickness. Please confirm.4. Space between gold finger edge and outline is too narrow The minimum space was only X mil between the gold finger edge and outline (see attached file). Because of registered tolerance, after finished, the copper may be exposed at the edge of key-slot. In order to avoid this question, we suggest to shave suitable copper and assuring the space to our standard space: 8mil (min) (see attached file). Please confirm5. Space between test pad and the top of finger is too narrow The space between test pad and the top of gold finger is closer than 30mil (only XX mil) (see attached file M) on bottom side. It is necessary to cover gold finger with high temperature tape during HAL process, and this operation is performed by hand, We required a 30mil spacing as deviation area to avoid that these pads with solder mask opening were covered with the tape. So, we suggest to shift down solder mask opening 10mil(max) (see attached file N). Please confirm.VII. Hole1. Blind/buried hole Is this blind hole design for your component bonding purpose? So that copper plating is required on these blind hole surfaces. Please specify and confirm.2. Breakaway hole is partially on copper plane Per the breakaway detail, the breakaway hole would be located partially on the copper planes of all layers. We suggest to create a suitable clearance (about 0.50mm larger than the hole size). Please confirm.3. Change overlapped hole as slot On drill file, three holes (PTH/NPTH, DIA: VVV) are overlapped each other, the distance between two holes is XXX mil. In order to facilitate in production, we suggest you change them as a slot. Please confirm.4. Drilling positional tolerance Customer required controlling the drill positional tolerance to be +/-X mil, however, the standard tolerance for drill positional accuracy is +/-3mil. Tighter tolerance can be achieved with special processing. In order to facilitate in production, we suggest you relax the tolerance from +/-X mil to +/-3mil. Please confirm.5. Relax tolerance for NPTH Customer required controlling the tolerance of +/-X mil for non-plated hole of DIAXXX; however, the standard tolerance for PTH diameter is +/-2mil. Tighter tolerance can be achieved with special processing. In order to facilitate in production, we suggest you relax the tolerance from +/-X mil to +/-2mil. Please confirm.6. Relax tolerance for PTH Customer required controlling the tolerance of +/-X mil for plated hole of DIAXXX; however, the standard tolerance for PTH diameter is +/-3mil. This allows for variations caused by circuitry distribution and processing. In order to facilitate in production, we suggest you relax the tolerance from +/-X