产品外观检验规范讲议.ppt

主機板SMT定位PIN2.4mm,Kink腳;定位PINL2.4mm,理想狀況(TARGETCONDITION),DIP2-3零件組裝標準-水平電子零組件浮件與傾斜(次缺-Minor),允收狀況(ACCEPTABLECONDITION),+,浮高Lh2.0mm,傾斜Wh2.0mm,拒收狀況(NONCONFORMINGDEFECT),DIP外觀檢驗規範,PAGE3,浮高Lh2.0mm,傾斜Wh2.0mm,1.零件平貼於機板表面。2.浮高與傾斜之判定量測應以PCB零件面與零件基座之最低點為判定量測距離依據。ComponentismountedonM/Bclosely.,1.浮高低於2.0mm。2.傾斜低於2.0mm。3.零件腳未折腳與短路。1.LHislessthan2.0mm.2.WHislessthan2.0mm.3.Nobentpinorshortphenomenonforcomponent,1.浮高高於2.0mm判定拒收2.傾斜高於2.0mm判定拒收3.錫面零件腳折腳未出孔或零件腳短路判定拒收。1.LHisoverthan2.0mm.2.WHisoverthan2.0mm3.Leadisntprotrudedoversolder.,PCB,最佳狀況(TARGETCONDITION),DIP2-4零件組裝標準-直立電子零組件浮件、傾斜(次缺-Minor),允收狀況(ACCEPTABLECONDITION),Lh2.0mm,拒收狀況(NONCONFORMINGDEFECT),DIP外觀檢驗規範,PAGE4,Lh2.0mm,1.零件平貼於機板表面。ComponentismountedonM/Bclosely.,1.浮高、傾斜高度低於2.0mm2.零件腳未折腳與短路。1.DimensionLHislessthan2.0mm.2.Nobentpinorshortphenomenonforcomponent.,1.浮高、傾斜大於2.0mm判定拒收。2.錫面零件腳折腳未出孔或零件腳短路判定拒收。1.DimensionLHisoverthan2.0mm.2.Leadisntprotrudedoversolder.,PCB,理想狀況(TARGETCONDITION),DIP2-5零件組裝標準-JUMPERWIRE浮件、傾斜(次缺-Minor),允收狀況(ACCEPTABLECONDITION),Lh0.8mm,拒收狀況(NONCONFORMINGDEFECT),Lh0.8mm,DIP外觀檢驗規範,PAGE5,1.單獨跳線須平貼於機板表面。2.固定用跳線不得浮高,跳線需平貼零件。1.ComponentismountedonM/Bclosely.2.JumperlinematchtoPCBclosely.,1.單獨跳線浮高傾斜0.8mm2.固定用跳線須觸及於被固定零件。3.錫面零件腳未折腳出孔1.LHidlessthan0.8mm.2.Jumperlinemustbefixedoncomponent.3.Leadisprotrudedoversolder.,1.單獨跳線浮高傾脅斜0.8mm2.(振盪器)固定用跳線未觸及於被固定零件。1.LHisoverthan0.8mm.2.Jumperlineisntfixedoncomponent.,32.768,32.768,32.768,理想狀況(TARGETCONDITION),DIP2-6零件組裝標準-CONNECTOR、HEATSINK浮件、傾斜(次缺-Minor),允收狀況(ACCEPTABLECONDITION),拒收狀況(NONCONFORMINGDEFECT),Lh、Wh0.8mm,Lh、Wh0.8mm,DIP外觀檢驗規範,PAGE6,1.機構零件基座平貼PCB零件面，無浮高傾斜。ComponentismountedonM/Bcloselyandnotiltorfloatingphenomenon.,1.浮高、傾斜小於0.8mm內。(Lh.Wh0.8mm)2.錫面零件腳出孔。1.DimensionLH.Whislessthan0.8mm.2.Leadisprotrudedoversolder.,1.浮高、傾斜大於0.8mm內判定拒收。(Lh.Wh0.8mm)2.錫面零件腳未出孔判定拒收。1.DimensionLH.Whisoverthan0.8mm.2.Leadisntprotrudedoversolder.,PCB,CONNECTOR,理想狀況(TARGETCONDITION),DIP2-7零件組裝標準-機構零件CPUSLOT浮高、傾斜(次缺-Minor),允收狀況(ACCEPTABLECONDITION),Lh.Wh0.5mm,拒收狀況(NONCONFORMINGDEFECT),Lh.Wh0.5mm,DIP外觀檢驗規範,PAGE7,1.機構零件基座平貼PCB零件面，無浮高傾斜現象。ComponentismountedonM/Bcloselyandnofloatingphenomenon.,1.傾斜、浮高高度小於0.5mm內。(Lh.Wh0.5mm)2.錫面零件腳出孔1.Lh.Whislessthan0.5mm.2.Leadisprotrudedoversolder.,1.傾斜、浮高高度大於0.5mm，判定拒收。(Lh.Wh0.5mm)2.錫面零件腳未出孔判定拒收。1.Lh.Whisoverthan0.5mm.2.Leadisntprotrudedoversolder.,PCB,SLOT1,理想狀況(TARGETCONDITION),DIP2-8零件組裝標準-機構零件JUMPERPINS浮件、傾斜(次缺-Minor),允收狀況(ACCEPTABLECONDITION),Lh.Wh2.0mm,DIP外觀檢驗規範,拒收狀況(NONCONFORMINGDEFECT),PAGE8,Lh.Wh2.0mm,1.零件平貼於PCB零件面。2.無傾斜、浮件現象。1.ComponentismountedonM/Bclosely.2.Notiltorfloatingphenomenon.,1.浮高、傾斜小於2.0mm。(Lh.Wh2.0mm)2.錫面零件腳出孔3.排針頂端最大傾斜不得超過PCB板邊邊緣4.傾斜不得觸及其他零件1.Lh.Whislessthan2.0mm2.Leadisprotrudedoversolder.3.Ifpintilt,thetiltpincantovertheedgeofPCBorcontactothercomponent.,1.浮高、傾斜大於2.0mm判定拒收。(Lh.Wh2.0mm)2.錫面零件腳未出孔判定拒收。3.排針頂端最大傾斜超過PCB板邊邊緣。4.傾斜觸及其他零件。1.Lh.Whoverthan2.0mm.2.Leadisntprotrudedoversolder.3.ThetiltpincantoverthePCBedgeorcontactothercomponent.,PCB,理想狀況(TARGETCONDITION),DIP2-9零件組裝標準-機構零件JUMPERPINS組裝性(次缺-Minor),允收狀況(ACCEPTABLECONDITION),DIP外觀檢驗規範,PAGE9,1.PIN排列直立2.無PIN歪與變形不良。1.Pinisstraight.2.Pinsurfaceisluminousandnoburisappeared.,1.PIN(撞)歪小於1/2PIN的厚度，判定允收。2.PIN高低誤差小於0.5mm內判定允收。1.DimensionPislessthanthicknessofpin.2.DimensionHislessthan0.5mm.,1.PIN(撞)歪大於1/2PIN的厚度，判定拒收。2.PIN高低誤差大於0.5mm外，判定拒收。1.DimensionPisgreaterthanthicknessofpin.2.DimensionHisgreaterthan0.5mm.,PIN高低誤差(H)0.5mm,PIN歪(P)1/2PIN厚度,拒收狀況(NONCONFORMINGDEFECT),PIN高低誤差(H)0.5mm,PIN歪(P)1/2PIN厚度,P,H,H,P,PCB,DIP2-10零件組裝標準-機構零件JUMPERPINS組裝外觀(次缺-Minor),允收狀況(ACCEPTABLECONDITION),拒收狀況(NONCONFORMINGDEFECT),PIN有毛邊、缺邊表層電鍍不良等現象,PIN變形、上端成蕈狀不良現象,DIP外觀檢驗規範,PAGE10,1.PIN排列直立無扭轉、扭曲不良現象。2.PIN表面光亮電鍍良好、無毛邊扭曲不良現象。1.Pinisstraight.2.Pinsurfaceisluminousandnoburisappeared.,1.連接區域PIN有毛邊、表層電鍍不良現象，判定拒收。2.PIN變形、上端成蕈狀不良現象，判定拒收。1.Thereisburorpoorplatingphenomenononpinsurface.2.Pinisdeformedorbent.,PCB,理想狀況(TARGETCONDITION),DIP2-11零件組裝標準-機構零件CPUSOCKET浮件與傾斜(次缺-Minor),允收狀況(ACCEPTABLECONDITION),浮高Lh,浮高Lh,浮高Lh,傾斜Wh0.5mm,浮件Lh0.5mm,拒收狀況(NONCONFORMINGDEFECT),浮高Lh,浮高Lh,傾斜Wh0.5mm,浮件Lh0.5mm,DIP外觀檢驗規範,PAGE11,Socket7,Socket7,Socket7,Socket7,Socket7,1.浮高與傾斜之判定量測應以PCB零件面與零件基座之最低點為判定量測距離依據。2.CPUSOCKET平貼於PCB零件面。1.Nofloatingortiltphenomenon.2.ComponentismountedonM/Bclosely.,1.浮高、傾斜小於0.5mm內，判定允收。(Lh,Wh0.5mm)1.LHislessthan0.5mm.2.WHislessthan0.5mm.,1.浮高、傾斜大於0.5mm，判定拒收。(Lh,Wh0.5mm)2.錫面零件腳未出孔判定拒收。1.LHisgreaterthan0.5mm.2.WHisgreaterthan0.5mm.,PCB,理想狀況(TARGETCONDITION),DIP2-12零件組裝標準-K/BJACK、POWER零件浮件與傾斜(次缺-Minor),允收狀況(ACCEPTABLECONDITION),浮高.傾斜Lh.Wh0.5mm,拒收狀況(NONCONFORMINGDEFECT),DIP外觀檢驗規範,PAGE12,POWERCONN,POWERCONN,浮高.傾斜Lh.Wh0.5mm,POWERCONN,K/BJACK,K/BJACK,K/BJACK,1.K/BJACK與POWERSET平貼於PCB零件面。ComponentismountedonM/Bclosely.,1.浮高、傾斜小於0.5mm內，判定允收。(Lh,Wh0.5mm)2.錫面零件腳出孔判定允收LHislessthan0.5mmandleadisprotrudedoversolder.,1.浮高、傾斜大於0.5mm，判定拒收。(Lh,Wh0.5mm)2.錫面零件腳未出孔判定拒收。1.LHisgreaterthan0.5mm.2.Leadisnotprotrudedoversolder.,拒收狀況(NONCONFORMINGDEFECT),DIP2-13零件組裝標準-零件腳折腳、未入孔、未出孔(主缺-Major),允收狀況(ACCEPTABLECONDITION),DIP外觀檢驗規範,PAGE13,1.零件腳未入孔，判定拒收。leaddoesnotbeinsertedintohole.,拒收狀況(NONCONFORMINGDEFECT),1.零件腳折腳、零件腳未出孔，判定拒收。Bentpinorleaddoesnotbeinsertedintohole.,1.應有之零件腳出焊錫面，無零件腳之折腳、未入孔、未出孔或零件腳短、缺零件腳等缺點-判定允收。2.零件腳長度符合標準。3.BIOS腳插於腳座時不得浮高Componentleadprotrudeoversolder.,理想狀況(TARGETCONDITION),拒收狀況(NONCONFORMINGDEFECT),DIP2-14零件組裝標準-零件腳與線路間距(次缺-Minor),允收狀況(ACCEPTABLECONDITION),0.1mm(4mil),90度,DIP外觀檢驗規範,PAGE17,可目視見孔填錫，錫墊上已達75%孔內填錫,無法目視見孔填錫，錫墊上未達75%孔內填錫,焊錫觸及零漸本體,1.完全被焊點覆蓋。2.焊錫面需有向外及向上之擴展，且外觀成一均勻弧度。3.無冷焊現象或其表面光亮。4.無過多的助焊劑殘留。5.沾錫角度趨近於零度。1.Soldercoverallpadandluminous.2.Nosolderresidue.,1.沾錫角度小於90度。2.無冷焊、縮錫、拒焊或空焊3.需符合錫洞與針孔標準。4.不可有錫裂與錫尖。5.焊錫不超越過錫墊邊緣與觸及零件或PCB板面。6.零件孔內可目視見錫底，填錫量已達75%孔內填錫。1.Wettingangleislessthan90o.2.Solderdoesntcontactbody.3.Over75%iscoveredbysolderinPTHandnosolderspike.,1.沾錫角度大於90度。2.焊錫超越過錫墊邊緣與觸及零件或PCB板面，判定拒收。3.零件孔內無法目視及錫底面，填錫量未達75%孔內填錫。1.Wettingangleisgreaterthan90degrees.2.Soldercontactcomponentbody.3.Soldervalueislessthan75%ofallPTH.,PCB,拒收狀況(NONCONFORMINGDEFECT),DIP2-18焊錫性標準-焊錫性其他標準2(次缺-Minor),+,允收狀況(ACCEPTABLECONDITION),DIP外觀檢驗規範,PAGE18,空焊、拒焊,拒收狀況(NONCONFORMINGDEFECT),焊錫面針孔(錫洞VOID),.,.,錫洞/針孔:周圍的吃錫小於270度Circumferentialfilletandwettingless270degrees,孔填錫與切面焊錫性,在特殊情況下拒收:存在縮錫或空焊或拒焊.螺絲孔焊點球狀超過0.5mm、焊錫寬度跨越旁邊PAD等焊錫性不良現象判定拒收Thereisvoidorcoldsolderorsolderballisover0.5mmphenomenononplatingthroughhole.,孔填錫與切面焊錫性,在下列特殊情況下,判定允收:1.未上零件之零件孔不得有空焊、拒焊等不良現象。(不可有目視貫穿過之零件孔;但非零件孔除外)PS:雙面製程之零件孔,有目視貫穿過之現象,判定允收Thereisnovoidorcoldsolderphenomenononsurfaceofplatingthroughhole.,PCB,焊錫寬度跨越旁邊PAD(PS:拖錫點除外),螺絲孔焊點球狀高度0.5mm,拒收狀況(NONCONFORMINGDEFECT),DIP2-19焊錫性標準-焊錫性其他標準3(主缺-Major),拒收狀況(NONCONFORMINGDEFECT),DIP外觀檢驗規範,PAGE19,允收狀況(ACCEPTABLECONDITION),1.插件之零件於焊錫後兩導體無相互短路2.零件腳可目視零件腳出錫面為基準。Thereisnoshortphenomenonbetweenleads.,錫裂1.因不適當之外力或不銳利之修整工具，造成零件腳與焊錫面產生裂紋，影響焊錫性與電氣特性之可靠度時，判定拒收。Acrackappearsonsoldersurface.,錫短路、錫橋:1.兩導體或兩零件腳有錫短路、錫橋，判定拒收。Theresolderresiduecontacttwoleadsatthesametime.,PCB,短路,理想狀況(TARGETCONDITION),DIP2-20零件組裝標準-DIMM,SIMM,PCICONNECTOR浮件、傾斜(次缺-Minor),允收狀況(ACCEPTABLECONDITION),拒收狀況(NONCONFORMINGDEFECT),Lh、Wh0.5mm,DIP外觀檢驗規範,PAGE20,PCB,DIMMCONNECTOR,DIMMCONNECTOR,Lh、Wh0.5mm,Lh、Wh0.5mm,Lh、Wh0.5mm,1.零件平貼於機板表面。2.浮高與傾斜之判定量測應以PCB零件面與零件基座之最低點為判定量測距離依據。ComponentismountedonM/Bclosely.,1.浮高低於0.5mm。2.傾斜低於0.5mm。3.浮高低於0.5mm。(DIMM底座有突塊)4.傾斜低於0.5mm。(DIMM底座有突塊)5.零件腳未折腳與短路1.LHislessthan0.5mm.2.WHislessthan0.5mm.3.LHislessthan0.5mm.(forDIMMstandoff)4.WHislessthan0.5mm.(forDIMMstandoff)5.Nobentpinorshortphenomenonforcomponent,1.浮高高於0.5mm。2.傾斜高於0.5mm。3.浮高高於0.5mm。(DIMM底座有突塊)4.傾斜高於0.5mm。(DIMM底座有突塊)5.零件腳折腳與短路1.LHisoverthan0.5mm.2.WHisoverthan0.5mm.3.LHisoverthan0.5mm.(forDIMMstandoff)4.WHisoverthan0.5mm.(forDIMMstandoff)5.bentpinorshortphenomenonforcomponent,DIP外觀檢驗規範,PAGE21,DIP2-21零件組裝標準-彎腳90o型式排針傾斜(次