Infineon产品介绍资料.ppt

infineonigbt-smartchoiceinhomeappliance,jimmywang(王进)infineontechnologieschinasystemapplicationengineerjimmy.wang,newigbtfamilyoptimizedforhomeappliance,2019/12/18,contents,infineonnewhighspeed3igbt,airconsplitsystemwithinfineonhighspeed3sensorlessfoccontrolusingxc878,2019/12/18,approachtoimprovethermalpartii,thermaldissipationt=ptotal*rthjalayoutdesignenlargeareaofcopperunderdeviceasmuchaspossible.morethicknessofcopperlayer,e,gfrom1ozto2oz.putcopperlayeratbothside,meanwhilethermalviasdevelopedinbetween.thehigherdensitythebetterheatsinkattached,2019/12/18,10.02.2010,page46,copyrightinfineontechnologies2010.allrightsreserved.,thermalconcept,thermalconceptforsections(1.compressor-inverter,2.pfcand3.fan-inverter)optimizedforlowestpcb-spaceusageandcost,pcb,thermal-vias,copper,isolationfoil,heatsink,rc-drives,2019/12/18,10.02.2010,page47,copyrightinfineontechnologies2010.allrightsreserved.,pcbmanufacturing,conceptcanfollowseveralmethodscopperinlays(productionlimitedandquiteexpensiveconcept).thermalviasfilledwithsyntheticresintoavoidsoldervoidsatrc-drivesleadframeduetoaflowthroughthevias.smalldrillholes(below0.2mm)forthethermalviasthatarefilledduringgalvanisiationtoavoidsolderflow.infineonrecommendthesmalldrillholeconceptssinceitsthemostcosteffectivesolutionduetoeasyproductionandadequatethermalbehaviour.,copperinlays(ruwelgmbh),classicalthermalviaswithresin,thin-via-concept(smalldrillholes),2019/12/18,10.02.2010,page48,copyrightinfineontechnologies2010.allrightsreserved.,thermalconciderationsofthin-via-concept,smalldrillholesboard-parameter:d=1mm,r2=0.22mm,r1=0.2mm,lamda=400w/krth,via=95k/wthedistancebetweenthepadscanbezerotohaveanoptimizedheatspreading.,2019/12/18,10.02.2010,page49,copyrightinfineontechnologies2010.allrightsreserved.,thermalconcept,15arcdtheconceptwastestedsuccessfullyinthedemoboardwithtj150catpinv=1.5kw,2019/12/18,examplesurfacemount:dpak,commercialfridgecompressorboard,rc-drivesdemoboard,d-pak,d2-pak,boardisflippedupsidedownandscrewedtothemetalsheet“,actingasheatsinkandgroundconnection,2019/12/18,thermalviasforimprovedheatdissipationincaseahsisused,surfacemount,exampleofheatsinkmounting,2019/12/18,verticalinsertion:i-pak,insulationfoil+clipsmountingwithnutsandbolts.,washingmachineboard,2019/12/18,summary,infineonsolutionoffer:best-in-classdevicesforroomsaving,improvedpowerdensityhighperformance&priceratiovce(sat)optimisedandbesteoffbalancedforlowlossestemperaturestablebehavioursmoothswitchingwaveformstoimproveyouremiperformance.,2019/12/18,ikd04n60r,s=siemensi=infineon,deviced=diodek=hardswitchingseriesintegrateddiodeh=softswitchingseriesintegrateddiodeg=singlediode,packagetypea=to-220fullpakb=to-263h=to-220“realtwoleg”d=to-252(d-pak)p=to-220i=to-262(i-pak)u=to-251(i-pak)w=to-247y=to-247hc,infineonigbtnomenclature,voltage(v/10)breakdownvoltage,technologyn=n-channelp=p-channelt=trenchstop(only1200v)e=emittercontrolleddiodes=sicdiode,currentclass(a)nominalcurrent100c,specificationsnothingstated=fastigbt(20khz/igbt2)hs=highspeed(600v)(80khz/igbt2)h2=highspeed2(1200v)(80khz/igbt2)h3=highspeed3(1200v)(80khz/igbt4)t=trenchstop(20khz/igbt3)t2=