印制电路词汇.doc

印制电路词汇1. 综合词汇Printed circuit印制电路Printed wiring印制线路Printed circuit board印制电路板Printed wiring board印制线路板Printed component印制元件Printed contact印制接点Single-sided printed circuit board (SSB)单面印制电路板double-sided printedcircuit board (DSB)双面印制电路板Multilayer printed circuit board (MLB)多层印制电路板Rigid printed circuit board刚性印制电路板Flexible printed circuit board挠性印制电路板Flex-rigid printed circuit board刚挠结合印制电路板Build-up printed board积层印制板Surface laminar circuit (SLC)表面层合电路板Build-up multilayer printed Board (BUM)积层多层印制板Metal base printed board金属基印制板B2it printed board埋入凸块互连印制板ALIVH Multilayer printed board层间全内导通多层印制板Chip on board (COB)载芯片板Backplane背板Bare board裸板Break-away panel可断拼板Interconnection互连Conductor trace line导线Substrate基底Real estate基板面Conductor side导线面Component side元件面Solder side焊接面Printing印制grid网格pattern图形Conductive pattern导电图形Non- conductive pattern非导电图形Legend字符Mark标志2 基材2.1 基材的种类和结构Base material基材Laminate层压板Copper-clad laminate (CCL)覆铜箔层压板Prepreg预浸材料Bonding sheet粘结片bonding layer粘结层Preimpregnated bonding sheet预浸粘结片Epoxy glass substrate环氧玻璃基板Copper-clad surface铜箔面Foil removal surface去铜箔面Length wise direction纵向cross wise direction横向Core material内层芯材UV blocking copper-clad laminates紫外光阻挡型覆铜箔板2.2 基材的材料A-stage resinA 阶树脂B-stage resinB 阶树脂C -stage resinC 阶树脂epoxy resin环氧树脂Polymer聚合物Photosensitive resin感光性树脂Thermosetting resin热固性树脂Thermoplastic resin热塑性树脂Adhesive胶粘剂Curing agent固化剂Flame retardant阻燃剂opaquer遮光剂Polyester film (PET)聚酯薄膜Polyimide film (PI)聚酰亚胺薄膜Polytetrafluoroethylene (PTFE)聚四氟乙烯Non-woven fabric非织布/无纺布Glass fiber玻璃纤维Glass fabric玻璃布Warp-wise经向Weft-wise纬向Copper foil铜箔Electrodeposited copper foil电解铜箔Rolled copper foil压延铜箔Resin coated copper foil (RCC)涂树脂铜箔Reversed Treatment Foil翻转处理铜箔DoubleTreatedFoil双面处理铜箔DrumSide/shiny side（铜箔）光面MatteSide（铜箔）毛面2.3 基材的制造Polymerize聚合Thermoplastic热塑性Thermoset热固性creep蠕变Gel凝胶体Clad覆箔Layup叠层laminating层压/复合Internal identification mark内部识别标志Post cure后固化Gel time凝胶时间Curing time固化时间Resin flow树脂流动度Resin content树脂含量3 设计3.1 通用术语Computer-aided design (CAD)计算机辅助设计Computer-aided manufacturing (CAM)计算机辅助制造Routing布线Layout布图设计Component density元件密度Array阵列3.2 形状与尺寸Conductor导线Conductor width导线宽度Conductor spacing导线间距Conductor line/space导线宽度/间距Conductor layer导线层Teardrop pad泪滴盘Isolation pad隔离盘Offset land偏置连接盘(焊盘)Annular ring孔环Component hole元件孔Mounting hole安装孔Supported hole支撑孔Unsupported hole非支撑孔Via导通孔Plated through hole镀通孔Blind via (hole)盲孔Buried via (hole)埋孔Buried/ blind via埋/盲孔Any layer inner via hole (ALIVH)任意层内部导通孔Tooling/ pilot hole定位孔Landless via hole无连接盘导通孔Via-in-pad在连接盘中导通孔Pitch节距Fine pitch精细节距Ground plane接地层Voltage/power/bus plane电压/电源层Register mark对准标记3.3 电气互连Interfacial connection表面间连接Interlayer connection层间连接Innerlayer connection内层连接Pad, land连接盘、焊盘、焊环Component lead元件引脚3.4其他Primary side主面Secondary side辅面Signal layer信号层Crosstalk串扰Capacitance电容Impedance特性阻抗Impedance match阻抗匹配Electromagnetic shielding电磁屏蔽Electromagnetic compatibility（EMC）电磁兼容Electromagnetic interference (EMT)电磁干扰Inductance电感Coplanarity共面性（度）Core board 芯板Thin type multilayer board薄型多层板Buried and blind via hole multilayer board埋/盲孔多层板Buried bump interconnection technology (B2it)嵌入凸块互连技术Multichip module (MCM)多芯片模块Alignment mark对准标记Fiducial mark基准标记Registration mark对位标记Layer to layer registration层间重合度4. 制造4.1 通用术语Subtractive process减成法Additive process加成法Semi-additive process半加成法Full-additive process全加成法Build up process积层法Solder mask on bare copper (SMOBC)裸铜覆阻焊工艺Tenting掩蔽法Sequential lamination顺序层压法Wet process湿处理Panel plating process板面电镀法Pattern plating process图形电镀法Finishing最终修饰Reworking返工Tooling feature工艺标识Panel在制板，拼板First article首板Prototype试样板End product最终产品Process flow工艺流程Process window工艺范围Lot size批量Job traveler工作流程单4.2 照相底版制作Artwork照相底图Phototool照相底版Artwork master照相原版Working master工作原版Production master生产底版Photographic film照相底片Silver film银盐底片Diazo film重氮底片Positive正像Positive pattern正像图形Negative负像Negative pattern负像图形Photo plotting光绘图Laser plotting激光绘图Gerber fileGerber文件Photoplotter光绘机Laser plotter激光绘图机Registration mark定位标记4.3 图形转移Printing ink印料Etching resist ink抗蚀印料Plating resist ink耐电镀印料Resist抗蚀剂Photo resist光致抗蚀剂Dry film photoresist干膜光致抗蚀剂Liquid photoresist液体光致抗蚀剂Positive-acting resist正性抗蚀剂Negative- acting resist负性抗蚀剂Plating resist耐电镀抗蚀剂Plated resist抗蚀镀层Permanent resist永久性保护层Electro-deposited photoresist电沉积光致抗蚀剂Mask掩膜Solder resist、solder mask阻焊剂Solder mask ink阻焊印料Dry film solder mask阻焊干膜Liquid photosensitive solder resist液体光致阻焊剂Marking ink、legend ink标记印料Conductive paste导电膏Hole filing ink堵孔油墨Peelable solder mask ink 可剥性防焊油墨Thermally curable、heat cured热固化Ultraviolet curable (UV cured)紫外线固化Screen printing网版印刷Silk screen丝印网版Stencil网版Screenability网印能力Chase、frame网框Fabric、cloth丝网Mesh count网目数Squeegee刮板Skip printing漏印Thinner、diluent稀释剂Viscosity粘度Imaging成像Imaging transfer图像转移Dry film imaging干膜制图形Lamination贴膜Wet lamination湿法贴膜Exposure曝光holding time停留时间developing显影developer显影液anti-foamer/ anti-foaming agent消泡剂resolution分辨率definition逼真度ghost image重影halation晕环air inclusion夹杂气泡tackiness粘着性post cure后固化shelf life保存期pot life/ working life适用期/工作寿命dip coating浸涂法roller coating辊涂法spray coating喷涂法curtain coating帘幕法laser direct imaging激光直接成像4.4清洗与蚀刻rinsing / rinse水洗electrolytic cleaning电解清洗alkaline degreasing化学除油electrolytic degreasing电解除油overflow溢流deionized water去离子水surface active agent /surfactant表面活性剂surface tension表面张力wetting润湿wetting agent / wetter润湿剂tarnish污化drag in/ drag out带进/带出brushing / scrubbing磨刷abrasive磨料scrubber磨刷机mechanical cleaning机械清洗chemical clearing化学清洗pumice powder浮石粉/火山灰sand blasting喷砂deburring去披峰/去毛刺mechanical polishing机械抛光chemical polishing化学抛光electropolishing电抛光etchant蚀刻剂/蚀刻液Undercut侧蚀microetch微蚀over etching过腐蚀stripper剥离液bright dip浸亮4.5 电镀和涂覆Plating镀覆electrochemistry电化学electrolyte电解质electrolytic solution电解液electrochemical corrosion电化学腐蚀chemical corrosion化学腐蚀ionization电离migration迁移solubility溶解度addition agent/additive添加剂Galvanic cell原电池Throwing power分散能力brightening agent/brightener光亮剂leveling agent整平剂catalyst/catalyzer催化剂activator/activating agent活化剂acceleration agent/accelerator增速剂chelating agent/chelant螯合剂complex络和物swelling agent/sweller膨松剂plasma等离子体electroplating电镀metal electrodeposition金属电沉积bright plating光亮电镀alloy plating合金电镀strik plating冲击镀flash/flash plating闪镀pulse plating脉冲电镀rack plating挂镀barrel plating滚镀brush plating刷镀selective plating选择性电镀Auxiliary anode辅助阳极Auxiliary cathode辅助阴极Preplating镀前处理Postplating镀后处理Plating up电镀加厚Pattern plating图形电镀Panel plating整板电镀Copper (electro) plating电镀铜Tin-lead plating电镀锡铅Plating line电镀线Electroless plating,electroless deposition无电电镀Immersion plate浸镀Plated through hole（PTH）孔金属化Electroless copper plating化学沉铜Direct plating直接电镀Roughening粗化Sensitization敏化Catalyzing催化Metallization金属化Acceleration增速Chemisorption化学吸附Swelling溶胀Hole conditioning整孔Hole cleaning洗孔Desmear, smear removal去钻污Etchback凹蚀Plasma desmear等离子去钻污passivation钝化acid dipping弱浸蚀pickling强浸蚀hot melting热熔fusing fluid热熔液solder leveling焊料整平tin immersion浸锡solder焊锡solder coat焊锡涂层flux助焊剂preflux预焊剂organic solderabilitypreservatives (OSP)有机保护剂black oxidation黑氧化brown oxidation棕氧化Pink ring粉红圈（环）pits麻点peeling起皮blister起泡orange peel 桔皮pores针孔porosity孔隙率hardness硬度tarnish金属变色4.6机械加工和压制drilling钻孔numerical control (NC)数控back-up垫板entry material盖板spindle主轴ring / collar钻套feed rate进给速率off set钻面不匀resin smear树脂钻污foil burr铜箔毛刺break-out破出hole counter数孔机laser via hole激光钻孔photo via hole光致穿孔plasma via hole等离子穿孔counterboring沉头孔（埋头孔）countersinking锥形孔platen热压板opening/daylight开档press plate压模板bonding layer / bonding sheet粘结层kraft paper牛皮纸lamination void层间空洞dent凹坑crease皱褶punching冲切bugle hole喇叭孔die 冲模shearing / cutting切料routing铣切bevelling倒斜边chamfer倒角scoring刻槽V cut槽切割Sewing hole缝纫孔Fixture夹具Indexing hole基准孔Tooling feature定位特征5检测5.1 通用术语inspection检验test试验as received验收态production board成品板test board测试板coupon附连板qualification testing鉴定试验acceptance tests验收试验accelerated test加速试验aging老化quality conformance testing质量一致性试验storage life贮存期specification规范standard标准tolerance容差/公差nonconformity不合格nonconforming item (unit)不合格品defect缺陷sampling inspection抽样检验acceptable quality level (AQL)可接收质量水平5.2外观和尺寸visual examination/visual inspection目检blister起泡blow hole气孔bulge凸起cracking裂缝crazing微裂纹burr毛刺dishdown凹陷measling白斑delamination分层fibre exposure露纤维Weave exposure露织物dent / indentation压痕haloing晕圈wrinkle 皱褶void空洞hole breakout破环foreign material（基材内）外来物hole void孔壁空洞nail heading钉头lifted land连接盘起翘nodule结瘤nick缺口pit麻点pin hole针孔scratch划痕resin recession树脂凹缩laminate void层压空洞bump凸瘤shadowing / etchback凹蚀阴影mealing粉点Wedge void楔形空洞5.3 电性能Surface insulation resistance (SIR)表明绝缘电阻Dielectric constant介电常数permittivity电容率；介电常数Dielectric dissipation factor损耗因数Dielectric strength介电强度Dielectric breakdown介电击穿Dielectric withstanding voltage耐电压Metal migration金属迁移Electro migration电迁移Known good board (KGB)已知好板5.4 非电性能Bond strength粘合强度Pull-off strength拉脱强度Pull-out strength拉出强度Pull strength拉离强度Peel strength剥离强度Flexural strength弯曲强度Tensile strength拉伸强度Shear strength剪切强度Torsional strength抗扭强度Hole pull strength孔拉脱强度Pull away拉离Tear strength撕裂强度Bow弓曲Twist扭曲Coefficient of thermalexpansion (CTE)热膨胀系数Dimensional stability尺寸稳定性Machinability机械加工性Heat resistance耐热性Thermal stress热应力Thermal shock热冲击elongation伸长率Solder float test浮焊试验Substrate bending test基板弯曲试验Bendability弯曲能力Fatigue life疲劳寿命Fatigue limit疲劳极限Fatigue strength疲劳强度Abrasion resistance耐磨(擦)性Wear resistance耐磨(损)性Crease褶痕Solderability可焊性Wetting焊料润湿Dewetting半润湿Nonwetting不润湿Microsectioning显微剖切Porosity test孔隙率试验Cleanliness清洁度Ionic cleanliness离子清洁度Ionizable contaminant离子污染Nonionic contaminant非离子污染Organic contamination有机污染Outgassing排气Self-extinguishing自熄性Chemical resistance耐化学性bleeding渗出Glass transition temperature玻璃化温度Differential scanning calorimetry差示扫描量热法Thermal mechanical analysis热机械分析6. 组装surface mount technology (SMT)表面组装技术surface mount component (SMC)表面组装元件chip scale package (CSP) / chip scale mounting芯片级组装flip chip package (FCP)倒芯片封装soldering焊接reflow soldering再流焊；回流焊wave soldering波峰焊assembly density组装密度lead引线lead foot / lead引脚（腿）lead pitch引脚节距fine pitch devices (FPD)精细节距器件node连接节点chip carrier芯片载体ball grid array (BGA)球栅阵列chip / die / dice裸芯片flip chip倒装芯片active devices (parts)有源器件passive devices (parts)无源器件embedded component埋入元件add-on component附加元件integrated circuit (IC)集成电路resin flux树脂（松香）助焊剂bond焊（连）接electrical bridging电桥接dross焊渣residue 残留物stress relief消除应力7.光电路optical board光线路板optical daughter board光插板、光子板optical pig tail光抽头、光引出端fiber flexible optical board光纤挠性线路板diffusion optical transmission扩散光传输印制电路技术英语缩略语ALIVH (any layer inner via hole)任意层内部导通孔AOI (automatic optical inspection)自动光学检验BGA (ball grill array)球栅阵列BUM (build-up multilayer)积层多层（板）BUT (build-up technology)积层式技术CAD(computer aided design)计算机辅助设计CAM (computer aided manufacturing)计算机辅助制造CAF(conductive anodic filament)阳极导电细丝CCL (copper clad laminate)覆铜箔层压板CMT (chip mount technology)芯片安装技术CNC (computer numerical control)计算机数字控制COB (chip-on-board)载芯片板CPCA (China Printed Circuit Association)中国印制电路行业协会CSP (chip scale packaging)芯片级封装DI (direct imaging)直接成像法DIW (de