TLP521-4中文资料.doc

TLP521是可控制的光电藕合器件，光电耦合器广泛作用在电脑终端机，可控硅系统设备，测量仪器，影印机，自动售票，家用电器，如风扇，加热器等电路之间的信号传输，使之前端与负载完全隔离，目的在于增加安全性，减小电路干扰，减化电路设计。东芝TLP5211，2和4组成的砷化镓红外发光二极管耦合到光三极管。该TLP5212提供了两个孤立的光耦8引脚塑料封装，而TLP5214提供了4个孤立的光耦中16引脚塑料DIP封装集电极-发射极电压： 55（最小值）经常转移的比例： 50 （最小）隔离电压： 2500 Vrms （最小） 图1 TLP521 TLP521-2 TLP521-4 光藕内部结构图及引脚图图2 TLP521-2 光电耦合器引脚排列图Absolute Maximum Ratings 绝对最大额定值(Ta = 25)Characteristic 参数Symbol 符号Rating 数值Unit 单位TLP5211TLP5212 TLP5214LEDForward current 正向电流IF7050mAForward current derating正向电流减率IF/0.93(Ta50)0.5(Ta25)mA/Pulse forward current瞬间正向脉冲电流IFP1 (100 pulse, 100pps)AReverse voltage 反向电压VR5VJunction temperature 结温Tj125接 收 侧Collectoremitter voltage 集电极发射极电压VCEO55VEmittercollector voltage 发射极集电极电压VECO7VCollector current 集电极电流IC50mACollector power dissipation (1 circuit) 集电极功耗PC150100mWCollector power dissipation derating (1 circuit Ta 25) 集电极功耗减率PC/1.51.0mW/Junction temperature 结温Tj125Storage temperature range 储存温度范围Tstg55125Operating temperature range 工作温度范围Topr55100Lead soldering temperature 无铅焊接温度Tsol260 (10 s)Total package power dissipation整体功耗PT250150mWTotal package power dissipation derating (Ta25) 整体功耗减率PT/2.51.5mW/Isolation voltage 隔离电压BVS2500(AC,1Min 最小, R.H.60%)Vrms注：使用连续负载很重的情况下（如高温/电流/温度/电压和重大变化等），可能会导致本产品的可靠性下降明显甚至损坏。Recommended Operating Conditions建议操作条件Characteristic 参数Symbol 符号Min 最小Typ 典型Max 最大Unit 单位Supply voltage 电源电压VCC524VForward current 正向电流IF1625mACollector current 集电极电流IC110mAOperating temperature 操作温度Topr2585型号Classi fication (*1)分级标准Current Transfer Ratio (%)(IC/IF) 经常转移率 (%)(IC/IF)Marking Of Classification 标志的分类IF = 5mA, VCE = 5V, Ta = 25最小最大TLP521A50600Blank, Y, Y, G, G, B, B, GBRank Y50150Y, YRank GR100300G, GRank BL200600B, BRank GB100600G, G, B, B, GBTLP5212 TLP5214A50600Blank, GR, BL, GBRank GB100600GR, BL, GB*1: Ex. rank GB: TLP5211 (GB)(Note): Application type name for certification test, please use standard product type name, i.e.TLP5211 (GB): TLP5211, TLP5212 (GB): TLP5212Individual Electrical Characteristic 单独的电气特性参数(Ta = 25)Coupled Electrical Characteristic 耦合电气特性参数s(Ta = 25)Characteristic 参数Symbol 符号Test Condition 测试条件Min 最小Typ 典型Max 最大Unit 单位Current transfer ratio 经常转移的比率IC/IFIF=5mA, VCE =5V Rank GB50600%100600Saturated CTR 饱和率IC/IF (sat)IF=1mA, VCE=0.4V Rank GB60%30Collectoremitter saturation voltage 集电极-发射极饱和电压VCE (sat)IC = 2.4 mA, IF = 8 mA0.4VIC=0.2mA, IF=1mA Rank GB0.20.4Isolation Characteristic 耦合电气特性参数(Ta = 25)Characteristic 参数Symbol 符号Test Condition 测试条件Min 最小Typ 典型Max 最大Unit 单位Capacitance(input to output)电容（输入输出）CSVS = 0, f = 1 MHz0.8pFIsolation resistance 隔离电阻RSVS = 500 V, R.H. 60%1011Isolation voltage 隔离电压BVSAC, 1 Min 最小ute2500VrmsAC, 1 second, in oil5000DC, 1 Min 最小ute, in oil5000VdcSwitching Characteristic 开关特性参数(Ta = 25)Characteristic 参数Symbol 符号Test Condition 测试条件Min 最小Typ 典型Max 最大Unit 单位Rise time 上升时间trVCC=10V IC=2mA RL=1002s Fall time下降时间tf3Turnon time 开启时间ton3Turnoff time 关断时间toff3Turnon time 开启时间tONRL = 1.9k (Fig.1) VCC = 5V, IF