pcb韩英专业用语整理.doc

. (Photo Lithography) . (Gerber Data) (Artwork film) Gerber Scientific . (Photo Data) . (Eutectic Solder) Sn()-Pb() , , Sn(61.9%)/Pb(38.1%) . 183 , (轉移) . 183 . ()(Plugging Process) (Through Hole) , PSR . . (Solder Side) PCB (Component Side) . (Solder Wetting) . (Solder Non Wetting) . (De-Watting) (Sterss) ( ) . (Internal Layer) PCB(MLB) . 10 PCB 8 . (Negative Type Photoresist) , . (Negative Pattern) () , (陰畵) . . (Nail Head) PCB(MLB) ( ) . (Net Data) CAD , , . (Artwork) . (Die Stamping) PCB . PCB(MLB ; Multi-Layer PCB) PCB PCB , (Prepreg) . , PCB 4 PCB MLB . PCB(Single Sided PCB) PCB . , . (Dent) . (Planting Resist) . . (Conductive Paste) PCB . , , (Nickel), . (Copper Foil) . PCB . (CCL ; Copper Clad Laminated) PCB . (Dry Film) () . , . (Drilling) , (CNC Drill) . (Bit; ) . PCB . -(De-Lamination) PCB . (De-smear) ( ) . (Design Rule) ( , ) . (Dip Soldering) PCB () (, ) . (Lnad) PCB , . (Resist) PCB (Etchant), , . (Solder Resist) () . (Resin Recession;) (Through Hole) (Resin) () . PCB (Glass Cloth) , . (Reflow Soldering) (Solder Paste) ( ) ( SMD ) (Migration) ( ) . PCB . PCB . PCB (Flux) (Halogen) . (Micro Section) PCB ( , ) PCB (Cross-Section) . (Marking) PCB , , , , PCB . (Mass Lamination) PCB . 4 PCB PCB . . . (Manhattan Phenomenon) . (Tombstone;) . (Moving Probe Tester) , Flying . (Electro-less Plating) (析出) . 0.20.5 , 25 . (Mealing) PCB . (Mealing) ( ) . (Bow;) PCB 4 . (Backup Board) . , , . (Burr) or (Punching) . (Barrel Crack) . (Buried Via Hole) PCB . PCB . . PCB . (Base Film) (Flexible) PCB . (Polyimide) , (Polyester) . (Void) . (Composite CCL) 2 CEM3 . (Bonding Sheet) PCB . , . (Cpmponent Side) PCB . (Lead) . (Blister;) PCB . (Bridge) . (V-Cut) PCB (Panel) , PCB . PCB , . V - . (Blind Via Hole) PCB . PCB . (Blow Hole) . (Via Hole) 2 PCB . (Bit) , CNC PCB (Router) . (Build-Up Process) PCB . (Subtractive Process) , PCB . (Line Impedance) (Stary Capacity) () () . PCB , . (Soft Etching) , , , , (Roughness) . (, ) . (Solder;) 450 (Sn)-(Pb) . (, ), (, ), (, ), (, , Wetting ) . (61.9%), (38.1%) (). (Solder Resist) () . (Soldr Ball) . Ball . (Solder-ability;) . (Solder Pre-coat) , 0.3mm QFP TAB . . (Short;) 2 , . (Smear) ( Epoxy ) . . . (Squeeze) () . Polyurethane Gum . , , , , , . (Screen Printing) . (Space;) . (Pitch) . (Mount Data) (Mounter; ;) . , ( ) . (Symbol Mark) PCB , , , , . (Thermal Relief) (Blister) (Warp & Twist) () . (Thermal Via Hole) PCB . (Through Hole;) . (Aramide) PCB (織布) . , . -(Out Growth) . (Eyelet) . (Artwork Master) (Original Drawing) . PCB(Double-Sided PCB) PCB . (Aperture) (Slit) , . (Aspect Ratio) () . , , . (Under-Cut) . (Additive Process) . . (Etch Back) PCB , . (Etching;) - . . (Etching Resist) . . (Etching Factor) PCB , , (T) (D) (T/D) . . (Access Hole) PCB . (Entry Board) 0.10.15mm (Aluminum Foil) . (Burr) . . (Over Plate) . (Open;) 2 () . (External Layer) PCB . (Working Film) ( ) PCB . (Wedge Void) . (Working) . QFP . (In-Circuit Tester) PCB , , . . (Impedance) . PCB - ( ) . . (Electroplating) . PCB . (Ground Plane) PCB , , . (Corner Crack) . (Crazing) PCB (Creep) (Stress) (Distortion) . , . (Clearance Hole) . (Test Board) PCB . (Test Coupon) PCB ( ) , . (Test Pattern) . (Tenting) . . (Panel) . CAM . (Panel Plating) . . (Pattern Plating) . (Punching Method) PCB . (Passivation) PCB , Ion . . (Post Flux) PCB . () (Positive Type Resist) . , . (Positive Pattern) () ( ) . (Postoresist) , . . (Photo Lithography) . , . (Photo Via) , . (Photo Tool) . (Poly-imide) Imide(環) , PCB . (Surface Mounting) () , PCB . (Prepreg) B(B ) . PCB . (Pre-flux) PCB . (Flu