不良描述中英文对照.doc

不良描述中英文对照Goods Supplement补货1.Plastic parts 塑胶部件Abrasion/划痕、Bubbles/气泡、Burrs/毛刺、Bad Plating/电镀不良、Contamination/杂质、Crack/爆裂、 Combine Lines/结合线、Deformation/变形、Flow Marks/流痕、GreasyDirt/油污、Haze/雾状、Jelly/泠胶、Mold Marks/模痕、Melange Color/混色、Oppilation Hole/盲孔、Pull White/拉白、Pour Hole uneven/浇口不平、Wrong Stamping/字麦不符、 Short Shots/缺料、Shrinkage/缩水、Stripped Screw/螺丝滑牙、Top White/顶白、Weld Lines/夹水纹、Wrong Dimension/尺寸不符 、Wrong Texture/纹理错误、Light/发亮，Gaps裂缝、Steps 披峰、表面有手指印Surface finger prints、丝印错误Wrong printing、 丝印偏移Printing slanted、丝印重影Printing double image、丝印有污点，拖尾Printing smearing、 丝印不平坦（多油或少油）Printing uneven ( thin / thick )、 丝印对于中心偏位Printing off centre、压痕或凹痕Press mark 或dented mark、反光或毛刺Flashing 或 burr、 镜片有针孔Pin hole on lens. 光泽luster/白点white dot、黑点black dot、装配不合格assembled NG、缺口Nick裂split2.Metal Parts 五金部件Abrasion/划痕 、Bad Weld/焊接不良 、Burrs/毛刺 、Bad Plating/电镀不良 、Bend angle/折弯角度、Contamination/杂质 、Crack/爆裂、Deformation/变形 、Dents/凹痕 、Greasy Dirt/油污 、Mold Marks/模痕 、Missing Stamp/漏冲压 、Oppilation Hole/盲孔 、Pressing Marks/压痕 、Rust/生锈、Wrong Stamping/字麦错误 、Short Shots/缺料、Stripped Screw/螺丝滑牙、 Pits/疤痕、Specks/斑点、Wrong Texture/纹理错误、Wrong Dimension/尺寸不符3.Painting partsSilkScreen parts 喷油/丝印部件Inspection Points /检查要点 : Bleeding/渗色 , Bad Painting/喷油不良 , Contamination/杂质 , deviate position/偏位 , Flow Marks/流痕 , Missing paint/漏喷,Over Paint/肥油 ,Pits/疤痕 , Poor Adhesion/附着力差 , Print Words Leans/印刷字体倾斜 ,Pooring Paint/薄油, Silkscreen Haze/丝印模糊 , Silkscreen Stamping Inconsistency/丝印字样不一致 , Scratch/划伤 , Speck/斑点 ,Uneven Surface Oil/表面油层不均匀 , Words Break Off/字体断开 , Wrong Color/错误颜色 ,Wrong Texture/纹理错误 ;4.PCB 印制线路板Open/开路; Short/短路; Weave Texture/板料席纹; Foreign Residue/外来杂物; Delamination/爆板,分层; Dent/凹陷;Dent on G/F/金手指凹陷; Scratch/擦花; Misregistration/对位不正; Board Damage/板子损坏; C/M Illegible/白字不清;C/M on pad/白字上垫; Copper expoure/露铜; Solder Mask on Pad/绿油上垫; Uneven Solder Mask/绿油不平均; Solder Mask peeling off/绿油脱落; Missing Hole/漏孔; Excess Hole/多孔; Wrong Hole Size/孔径错误; Hole Breakout/崩孔; Nick Trace/线路缺口; Void on Trace/线路铜穿; Diskdown/线路不良/狗牙; Solder Mask inside hole/绿油入孔; Discolouration under Solder Mask/绿油颜色不良; Foreign matter under Solder Mask/绿油下杂物; Solder Mask skipping/不过油; Solder on Gold Finger/金手指上锡; Poor Bevelling/斜边不良; Gold Finger burrs/金手指损坏; Ping Ring/粉红圈5.Electronic parts 电子元件No AVL/没AVL; not on AVL/不在AVL上; Mfg/Mfg P/N dis-match AVL/ 与AVL不符; D/C overdue/ D/C 过期;无D/C; wrong part/错料; no reel/无卷轴; bulk packing for chip/ 散装; No dry packing(HIC change color)/ 无真空包装(防潮卡变色); No ESD packing/无防静电包装; illegible marking/印字不清, wrong marking/印字错; deformation/变型 ; micro crack/裂料;damaged part/ 烂料 ;Lead bent(PTH/SMT)/脚弯;Solder balls damaged/锡球坏 wrong lead form/脚型错; wrong pitch/脚距不符; coplanar problem/平整度不良; pad(lead) oxidization/锡垫(引脚)氧化; wrong direction in tape(tray)/带中(盘中)方向错; short pins/引脚短; failed in solderability/ 焊锡不良; size(dimensions) out of specification/ 尺寸超标; function fail/ 功能不良;no tolerance/无误差范围; contamination/杂质; wrong identification