神基MITAC B300X最新图纸I7 CPU_MITAC B300X REV 01.pdf

5 5 4 4 3 3 2 2 1 1 DD CC BB AA GNDGND GNDGNDGND GNDGND GND GNDGND GNDGNDGNDGNDGND GNDGNDGNDGNDGNDGNDGNDGND GNDGND GND GNDGND Title Size Document Number Rev Date Sheetof B300 X R01 Cover Sheet Custom 143Monday July 05 2010 Title Size Document Number Rev Date Sheetof B300 X R01 Cover Sheet Custom 143Monday July 05 2010 Title Size Document Number Rev Date Sheetof B300 X R01 Cover Sheet Custom 143Monday July 05 2010 MODEL B300 CalpellaRevision R01 G551Project Code Product Code 8317 DESIGNISSUEDCHECKDRAW CPU ARRANDALE 3 4 32 CPU ARRANDALE 4 4 9 3V MINI PCI EXPRESS 52P 0 8MM 280299 1 SMT SANTA to 291000675205 TF1 TH CON MINI PCI EXPRESS 52P 0 8MM 9 9H 889 08 5204M to for material EOL issue G55109AGZ6 5 5 4 4 3 3 2 2 1 1 DD CC BB AA Title Size Document Number Rev Date Sheetof B300 X R01 History 2 Custom 4243Monday July 05 2010 Title Size Document Number Rev Date Sheetof B300 X R01 History 2 Custom 4243Monday July 05 2010 Title Size Document Number Rev Date Sheetof B300 X R01 History 2 Custom 4243Monday July 05 2010 Rev 00Content History NoteECR No 2 Change G Sensor power from V3 3A to V3 3S 27 2009 12 28 1 Change Q29 Gate from V3 3A to V3 3S 25 3 Modify RP504 and RP506 the PIO signals 26 4 Modify U8 pin 3 from SMART CARD ON to SC IN 20 5 KBC GPIO GPIO LANRST to AUDIO PWR ON 23 27 6 Exchange Cardreader J2 19 pin and 20 pin for MS card 18 7 Exchange IT8709E U521 pin35 and pin42 26 8 Add DCI functoin 11 ECR add Q63 and R376 9 Modify PCH PME function 13 ECR add X505 C786 C787 R797 and del R796 10 Change HP SENSE to Sense B 23 11 Change R622 and R640 to 1K for SMART CARD 20 ECR change R622 and R640 to 1K 12 Remove R196 and change V3 3S 13 13 Q24 Q28 Q510 change to 2N7002 25 27 ECR del R196 ECR Q24 Q28 Q510 change to 2N7002 14 Add TS ENABLE and CCD ENABLE to Pull up V3 3S 28 ECR add R377 AND R379 15 Add 0 ohm pull down on U11 pin11 20 ECR add R378 16 Change ODD pull up down power to 1 8V ODD 15 17 Change Q555 and Q62 to DTC144TKA 15 ECR Change Q555 and Q62 to DTC144TKA 18 Change R354 R306 R892 R831 NA and R384 R325 R873 R852 10K for SATA HDD ODD 15 ECR Change R354 R306 R892 R831 NA and R384 R325 R873 R852 10K 19 Change R546 R369 R908 R372 R921 R362 R554 to VDD3 pull up 15 27 20 Change R917 to V3 3A pull up 15 21 Change Q519 to NA 25 ECR del Q519 22 Add C580 and C587 for V1 05S 29 ECR add C580 and C587 23 Add 1 5VS CPU power switch 6 ECR check page 6 24 Add docking R G B 150ohm 30 ECR add R383 R384 R385 25 Change R13 and R17 from 22ohm to 75ohm for closetalk 24 ECR change R13 and R17 from 22ohm to 75ohm 26 Change R205 R211 R214 R221 R233 R234 from 22ohm to 10ohm for falling time fail issue 13 ECR change R205 R211 R214 R221 R233 R234 from 22ohm to 10ohm 27 Remove E SATA RE DRIVER IC 28 ECR remove U502 please check 28 Change R103 R97 from 10K to 2 2k for SM bus SI issue 25 ECR Change R103 R97 from 10K to 2 2k 29 EMI soultion please see EMI doucument EMC G551 E 01 10 30 EMI soultion EC606 and EC607 EC69 change to 18P 11 ECR Add EC606 EC607 EC69 change to 18P 31 EMI soultion Add 10p EC91 EC92 EC93 EC94 EC97 13 ECR Add 10p EC91 EC92 EC93 EC94 EC97 32 EMI soultion Add 0 01u EC786 15 ECR Add 0 01u EC786 33 EMI soultion modify CLK 17 18 ECR check doucument 34 EMI soultion modify audio and MDC CLK and others 23 ECR check doucument 35 EMI soultion modify KBC CLK keyboard and others 25 ECR check doucument 36 EMI soultion modify U18 U521 CLK 26 ECR check doucument 37 EMI soultion modify J10 debug CLK 27 ECR check doucument 38 EMI soultion modify J511 TMP CLK 28 ECR check doucument 39 Add 0 75V leakage current solution 3 6 7 13 25 40 Add LED panel switch contol 9 41 Modify GPIO21 28 27 74 65 66 35 60 for common design 11 14 42 Modify Xtal cap X502 21 43 Add 4 switch for CON1 and CON2 26 28 44 Modify some circuit error 45 Exchange J510 pin5 and pin7 for battery LED status 28 46 Change R15 and R19 to 75 ohm for audio precision 24 47 Change KBC pin define for common design 25 27 48 Remove VDD3S power for common design 49 Remove C517 AND C572 24 50 Modify GPS Module circuit 28 51 Change TMP infineon P N 40 52 Add smartcard CLK buffer 20 53 Add PCH GPIO16 17 36 52 pull high 13 39 54 Modify Audio circuit for FAE s request 23 24 55 Add DisplayPort 2nd SD and del 2nd LAN con4 13 21 56 Change all crystal to 3 2x2 5 57 Del VCCME ON and add ME 3V ME 1 05V 58 Add ACPRENT and GPIO33 form KBC control 25 59 Add EMI choke and resistor for LAN 22 60 Add reverse power button and U524 pull down resistor 9 25 5 5 4 4 3 3 2 2 1 1 DD CC BB AA Title Size Document Number Rev Date Sheetof B300 X R01 History 3 Custom 4343Monday July 05 2010 Title Size Document Number Rev Date Sheetof B300 X R01 History 3 Custom 4343Monday July 05 2010 Title Size Document Number Rev Date Sheetof B300 X R01 History 3 Custom 4343Monday July 05 2010 Rev 0A R0CContent History NoteECR No 2010 04 021 R673 change NA for rework to pull high V3 3 2 Change R679 to 3K and R675 NA for Night Vision function 3 Change PR505 PR508 to NA and ADD PQ524 PQ528 PQ504 PQ508 PR562 PR563 for LVDS control pin 4 Change EC607 EC606 for EMI request 5 R704 change NA for LAN CLKREQ leakage 6 Change SB PWRGE KBC form KBC U23 NA R206 Add 7 Change R372 R369 R77 R362 R921 from 10K to 200K for Battery only under 1mA 8 IT8760E and IT8709E 48MHz clock change generate form PCH Phase in by ECR and GTK Rework 9 BT PWR ON change pull high to 1K 10 ER508 EC522 ER503 EC504 change to NA for EMI request 2010 04 28 12 U526 pin5 change V3 3A TO V3 3 and R673 Add 11 R512 change NA for KBC GPIO leakage 13 Add AP2280 for pannel T7 sequence and DEL AO4409 U522 part 14 Change Q41 Q58 Q548 from AO3415 to AO3401 15 Add 2N7002 for leakage between PCH and LAN IC on SM bus and LAN CLKREQ 16 Add CLK SIO48 and CLK PIO48 for IT8760E and IT8709E 48MHz clock 17 Change PCH GPIO33 to ME DISABLE form IT8301E 18 Connect PCIECLKRQ4 to SWAP ID0 19 Add USB power SW enable pin USB PSWEN by KBC 20 Add Boost schematic on 3G MODULE part and 8pin connector for 2nd solution G55110AJVH G55110AJVI 21 Smart Card power enable by card detect pin 22 Swap VCCP PWRGD and G SENSOR pin on KBC 23 HDA DOCK EN change to ME DISABLE R118 NA 24 KBC PS 2 interface pull high add P MOS for leakage 25 ITE GND add 0 ohm resistor connect to GND 27 Change V1 05S MOS from IRF7832 to AO4456 26 Change KBC MB ID1 to USB PSWEN 28 Add RC on SD MS CLK for EMI request 31 Change ESD diode from PD02S180H100PT to TVM0G180M120R for buyer request 29 Change PM EXT TS 1 connect to two DDR DIMM and thermal sensor ALERT pin Change PM EXT TS 0 connect to thermal sensor CRIT pin B300X formal tapeout by layout change for DVT stage 30 Add HDMI CLK DATA and V5S from PCH to J6 32 Change CPU CHOKE COIL to small size 33 Add 0 01U on PC76 PC822 2010 06 02 G55110AKI6 G55110AL8J 34 Change 3GDISABLE pull high from 100K to 1K Arrange GTK rework on DVT stage 37 Add PR505 Del P