PCB术语中英对照.doc

PCB术语中英对照 *Process說明:A.下料(Cut Lamination)CT a-1裁板(Sheets Cutting)a-2原物料發料(Panel)(Shear materialto Size)B.鑽孔(Drilling)NC(Number control)b-1內鑽(Inner LayerDrilling)b-2一次孔(Outer LayerDrilling)b-3二次孔(2nd Drilling)b-4雷射鑽孔(Laser Drilling)(Laser Ablation)b-5盲(埋)孔鑽孔(Blind&Buried HoleDrilling)C.乾膜製程(Photo Process(D/F)c-1前處理(Pretreatment)c-2壓膜(Dry FilmLamination)c-3曝光(Exposure)c-4顯影(Developing)c-5蝕銅(Etching)c-6去膜(Stripping)c-7初檢(Touch-up)c-8化學前處理,化學研磨(Chemical Milling)c-9選擇性浸金壓膜(Selective GoldDry FilmLamination)c-10顯影(Developing)c-11去膜(Stripping)D.壓合Lamination ML(Mass/Multilayer Lamination)d-1黑化(Black OxideTreatment)d-2微蝕(Micro-etching)d-3鉚釘組合(eyelet)d-4疊板(Lay up)d-5壓合(Lamination)d-6後處理(Post Treatment)d-7黑氧化(Black Oxide)d-8銑靶(spot face)d-9去溢膠(resin flushremoval)E.減銅(Copper Reduction)e-1薄化銅(Copper Reduction)F.電鍍(Horizontal ElectrolyticPlating)f-1水平電鍍(Horizontal Electro-Plating)(Panel Plating)f-2錫鉛電鍍(Tin-Lead Plating)(Pattern Plating)f-3低於1mil(Less than1mil Thickness)f-4高於1mil(More than1mil Thickness)f-5砂帶研磨(Belt Sanding)f-6剝錫鉛(Tin-Lead Stripping)f-7微切片(Microsection)G.塞孔(Plug Hole)g-1印刷(Ink Print)g-2預烤(Precure)g-3表面刷磨(Scrub)g-4後烘烤(Postcure)H.防焊(綠漆):(Solder Mask)h-1C面印刷(Printing TopSide)h-2S面印刷(Printing BottomSide)h-3靜電噴塗(Spray Coating)h-4前處理(Pretreatment)h-5預烤(Precure)h-6曝光(Exposure)h-7顯影(Develop)h-8後烘烤(Postcure)h-9UV烘烤(UV Cure)h-10文字印刷(Printing ofLegend)h-11噴砂(Pumice)(Wet Blasting)h-12印可剝離防焊(Peelable SolderMask)I.鍍金Gold platingi-1金手指鍍鎳金(Gold Finger)i-2電鍍軟金(Soft Ni/Au Plating)i-3浸鎳金(Immersion Ni/Au)(Electroless Ni/Au)J.噴錫(Hot Air Solder Leveling)j-1水平噴錫(Horizontal HotAir SolderLeveling)j-2垂直噴錫(Vertical HotAirSolderLeveling)j-3超級焊錫(Super Solder)j-4.印焊錫突點(Solder Bump)K.成型(Profile)(Form)k-1撈型(N/C Routing)(Milling)k-2模具沖(Punch)k-3板面清洗烘烤(Cleaning&Backing)k-4V型槽(V-Cut)(V-Scoring)k-5金手指斜邊(Beveling ofG/F)L.短斷路測試(Electrical Testing)(Continuity&Insulation Testing)l-1AOI光學檢查(AOI Inspection)l-2VRS目檢(Verified&Repaired)l-3汎用型治具測試(Universal Tester)l-4專用治具測試(Dedicated Tester)l-5飛針測試(Flying Probe)M.終檢(Final Visual Inspection)m-1壓板翹(Warpage Remove)m-2X-OUT印刷(X-Out Marking)m-3包裝及出貨(Packing&shipping)m-4目檢(VisualInspection)m-5清洗及烘烤(Final Clean&Baking)m-6護銅劑(ENTEK Cu-106A)(OSP)m-7離子殘餘量測試(Ionic ContaminationTest)(Cleanliness Test)m-8冷熱衝擊試驗(Thermal cyclingTesting)m-9焊錫性試驗(Solderability Testing)N.雷射鑽孔(Laser Ablation)N-1雷射鑽Tooling孔(Laser ablationTooling Hole)N-2雷射曝光對位孔(Laser AblationRegistration Hole)N-3雷射Mask製作(Laser Mask)N-4雷射鑽孔(Laser Ablation)N-5AOI檢查及VRS(AOI Inspection&Verified&Repaired)N-6Blaser AOI(after Desmearand Microetching)N-7除膠渣(Desmear)N-8微蝕(Microetching)A/W(artwork)底片Ablation燒溶(laser),切除abrade粗化abrasion resistance耐磨性absorption吸收ACC(aept)允收aelerated corrosiontest加速腐蝕aelerated test加速試驗aeleration速化反應aelerator加速劑aeptable允收activator活化液active workin process實際在製品adhesion附著力adhesive method黏著法air inclusion氣泡air knife風刀amorphous change不定形的改變amount總量amylnitrite硝基戊烷analyzer分析儀anneal回火annular ring環狀墊圈;孔環anode slime(sludge)陽極泥anodizing陽極處理AOI(automatic opticalinspection)自動光學檢測applicable documents引用之文件AQL sampling允收水準抽樣aqueous photoresist液態光阻aspect ratio縱橫比(厚寬比)As receivedbacklighting背光back-up墊板banked workin process預留在製品base material基材baseline performance基準績效batch批beta backscattering貝他射線照射法beveling切斜邊;斜邊biaxial deformation二方向之變形black-oxide黑化blank controller空白對照組blank panel空板blanking挖空blip彈開blister氣泡;起泡blistering氣泡blow hole吹孔board-thickness error板厚錯誤bonding plies黏結層bow;bowing板彎break out從平環內破出bridging搭橋;橋接BTO(Build ToOrder)接單生產burning燒焦burr毛邊(毛頭)camcorder一體型攝錄放機carbide碳化物carlson pin定位梢carrier載運劑catalyzing催化catholic sputtering陰極濺射法caul plate隔板;鋼板calibration systemrequirements校驗系統之各種要求center beammethod中心光束法central projection集中式投射線certification認證chamfer倒角(金手指)chamfering切斜邊;倒角characteristic impedance特性阻抗charge transferoverpotential電量傳遞過電壓chase網框checkboard棋盤chelator蟹和劑chemical bond化學鍵chemical vapordeposition化學蒸著鍍circumferential void圓周性之孔破clad metal包夾金屬clean room無塵室clearance間隙coat鍍外表coating error防焊覆蓋錯誤coefficient ofthermal expansion(CTE)熱澎脹系數cold solderjoint冷焊點cold-weld金屬粉末冷焊color顏色color error顏色錯誤pensation補償petitive performance競爭力績效plex salt錯化物plexor錯化物ponent hole零件孔ponent side零件面concentric同心conformance密貼性consumer products消費性產品contact resistance接觸電阻continuous performance連續發揮效能contract service協力廠controlled split均裂式conventional flow亂流方式conventional tensiletest傳統張力測試法conversion coating轉化層convex突出coordinate list資料清單copper cladedlaminates(CCL)銅箔基板copper exposure線路露銅copper mirror鏡銅copper pad銅箔圓配copper residue(copper splash)銅渣corrosion ratenumbering腐蝕速率計數系統corrosion resistance抗蝕性coulombs law庫倫定律countersink喇叭孔coupon試樣coupon location試樣點covering power遮蓋力CPU中央處理器crack破裂;裂痕crazing裂痕;白斑cross linking交聯聚合cross talk呼應作用crosslinking交聯crystal collection結晶收集curing聚合體current efficiency電流效率cut-outs挖空cutting裁板cyanide氰化物cycles oflearning學習循環cycle-time reduction交期縮短date code週期deburring去毛頭dedicated專用型degradation退變delamination分層dent/pin hole凹陷/針孔department ofdefense國防部designation字碼簡示法de-smear除膠渣developing顯影dewetting縮錫dewetting time縮錫時間dimension error外形尺寸錯誤dielectric constant介質常數difficulty困難度difunctional雙功能dimension尺寸dimension stability尺寸安定性dimensional stability尺度安定性dimension andtolerance尺寸與公差dirty hole孔內異物discolor hole孔黑;孔灰;氧化discoloration變色disposable eyeletmethod消耗性鉚釘法distortion factor尺寸變形函數double side雙面板downtime停機時間drill鑽孔drill bit鑽頭drill facet鑽尖切萷面drill pointer鑽尖重(研)磨機drilled blankboard已鑽孔之裸板drilling鑽孔dry film乾膜ductility延展性economy ofscale經濟規模edge spacing板邊空地edge-board contact(gold finger)金手指efficiency能量效率electric test電測electrical testing電測;測試electrochemical machineECM電化學加工法electrochemical reactor電化學反應器electroforming電鑄electroless plate化學銅electroless-deposition無電鍍electropolishing電解拋光electrorefining電解精鍊electrowinning電解萃取elliptical set橢圓形embrittlement脆性entitlement performance可達成績效entrapment電鍍夾雜物epoxy環氧樹酯equipotential電位線error datafile異常情形etch rate蝕銅速率etchants蝕刻液etchback回蝕evaluation program評估用程式exposure曝光external pinmethod外部插梢法eyelet hole鉚釘孔Eyeletting鉚眼fabric網布failure故障fast response快速回應fault瑕庛;缺陷fiber exposure纖維顯露fiber protrusion纖維突出fiducial mark光學點,基準記號filler填充料film底片filtration過濾finished board成品fixing固著fixture電測夾具(治具)flaking off粹離flammability rating燃性等級flare喇叭形孔flat cable併排電纜feedback loop回饋循環first-in-first-out(FIFO)先進先出flexible manufacturingsystem(FMS)彈性製造系統flux助焊劑foil distortion銅層變形fold空泡foreign include異物foreign material基材內異物free radicalchain polymerization自由基連鎖聚合fully additive加成法fully annealedtype徹底回火軔化之類形function函數fundamental andbasic基本fungus resistance抗黴性funnel flange喇叭形摺翼galvanized加法尼化製程gap鑽尖分開gauge length有效長度gel time膠化時間general resistink一般阻劑油墨general通論general industrial一般性(電子)工業級geometrical levelling幾何平整glass transitiontemperature(Tg)玻璃態轉換溫度Gold金gold finger金手指gold plating鍍金golden board標準板gouges刷磨凹溝gouging挖破grain boundary金屬晶體之四邊green綠色grip夾頭ground plane接地層ground planeclearance接地空環hackers駭客HAL(hot airleveling)噴錫haloing白邊;白圈hardener硬化劑hardness硬度hepa filter空氣濾清器high performanceindustrial高性能(電子)工業級high reliability高可靠度high resolution高解析度high temperatureelongation(HTE)高溫延展性銅箔high temperatureepoxy(HTE)高溫樹酯hit擊hole counter數孔機hole diameter孔徑hole diametererror孔徑錯誤hole location孔位hole number孔數hole wallquality孔壁品質hook外弧hot dip熱浸法hull cell哈氏槽hybrid混成積體電路hydrogen bonding氫鍵hydrolysis水解hydrometallurgy濕法冶金法image ana