cam简介(中英对照).doc

CAM 簡 介( CAM profile)一工程資料制作流程簡介(Engineering data making flow profile)Engineering data making flow chart 二本司目前擁有Genesis2000 V8.0 CAM350 V7.5.1 View2001 V3.04等CAM軟件。 可解讀RS-274-D及RS-274-X之GBR資料和ODB+格式之資料。 CAM software such as Genesis2000 V8.0, CAM350 V7.5.1, View2001 V3.04 etc are used in our company, which can decode the GBR data of RS-274-D and RS-274-X as well as ODB+ format data.三本司建議客戶提供RS-274-X或ODB+格式之資料及相應的PCB制作規范及檢驗規范。若無法提供我們將按公司一般制作方式處理。為了節省雙方的資料確認時間建議客戶每個料號附一份PCB制作規格表。 Suggest the customers provide the RS-274-X or ODB+ format data, as well as the corresponding PCB Manufacturing Spec and inspection Spec. Otherwise, we will deal with it in general way. A PCB manufacturing Spec table will be necessary appended for each part in order to save times of data confirming.Usual problems and solving method of GBR filePCB Spec table 四GBR轉換為ODB+格式。(Transform the GBR into ODB+ format.)Genesis2000 operation steps 五CAM處理(CAM processing.)1. 鑽孔文件處理(Drilling file processing)2 內層處理(Inner layer processing) 2.1 內層Thermal PAD直徑小于成品孔徑情形保持原稿不變。內層Thermal PAD直徑大于成品孔徑開口不夠8mil將開口放大8mil以上(含8mil)開口大于8mil之情形保持與原稿一樣。在考慮到保証足夠通道的前提下可將角度調整客戶有特別要求之情形按特別要求處理。 For Thermal PAD diameter of inner layer less than final product size, keep the artwork in no change. For Thermal PAD diameter of inner layer more than final product hole size and the placket 8mil below, then magnify the placket 8mil(included) above; besides it, if the placket 8mils above, keeps it the same as artwork. Under the insurance of sufficient passages, angle may adjust, when special requirement appeared by customer, deal with per it.2.2 內層實心PAD必須比成品孔徑單邊放大至少12mil以上(含12mil)。 (直接量產客戶設計小于12mil之情形全部放大到12mil.) Each edge of solid inner layer PAD must be magnified above 12mil (included) than final product hole size. (For designment 12mil below of direct production, magnify to 12mil for all).2.2.1有特性阻抗要求之資料導通孔單邊放大到12mil;CPU內層PAD與PAD間距保証12mil的前提下放大到14mil以內其它對成品孔徑放大14mil。For impedance are required, via hole must be magnified to 12mil for each edge; under the insurance of 12mil spacing of inner PADS to PADS of CPU, magnify it less than 14mil.2.2.2無特性阻抗要求之資料內層PAD對成品孔徑單邊放大14mil。對于成品孔徑原稿單邊大于上述要求的以客戶原稿為准。 No impedance required, each edge of inner PAD be magnified 14mil relative to final product hole size. Over above requirement, then follows the customers artwork. 2.3 內層有線路之情形保証線路及兩端PAD掏空孔環及線與線線與孔孔與孔孔與銅面線與銅面必須保証間距5mil以上(含5mil) For inner layer with circuit, insure hollow out between the conductors and two end PADS, spacing must be keep more than 5mil(included) among annular rings, conductors, conductor to hole, holes, hole to copper, conductor to copper. 2.4 內層兩面PAD相對需保証對准且直徑一樣內層PAD放大不可相連造成隔離區須保証至少1個通道在8mil以上(含8mil)。內層兩層相對不可能全部同是Thermal PAD或實心PAD。 PAD on both side of inner layer, must insure registration and the same diameter, the magnification of inner layer PADS can not be link up to form segregated region, and keep one passage at least more than 8mil(included). It cannot be all Thermal PADS or solid PADS of the two inner layers in face to face. 2.5 小于6mil之區域需填實或掏大(具體依據電性連接之要求)。 Area less than 6mil must be infilled or hollowed out. (According to electric connection requirement concretely.) 2.6 內層底片尺寸補償針對合正提供的不同厚度的Tg130板材底片須按下表所列系數進行尺寸補償單位是mil/INCH。 Dimension compensation of inner layer in allusion to Tg130 board of various Thickness provided by Uniplus company, the artwork must be compensated in proper coefficient according to the following table, unit is mil/inch.開料方式(cutting mode板厚(Board thickness)直 料(filling-wise)橫 料(warp-wise)橫直料(Filling-warp)長邊Long-Side短邊Short-Side長邊Long-Side短邊Short-Side長邊Short-Side短邊Short-Side0.100.25mm(不含銅None-Cu)六層板6-layer board0.230.280.280.230.230.23四層板4-layer board0.200.250.250.200.200.200.250.35mm(不含銅None-Cu)六層板Six6board0.230.280.280.230.230.23四層板4-layer board0.200.250.250.200.200.200.40.6mm(含銅Cu include)0.200.250.250.200.200.200.60.8mm(含銅Cu include)0.200.250.250.200.200.200.81.2mm(含銅Cu include)0.150.200.200.150.150.15 由于板材漲縮受多方面影響以上為基本補償系數特殊情況(8層板以上)還需求証. As the board flexibility is affected by various ways, above is basic compensation coefficient; the special status (board more than 8-layer) will be verified. 備注(Remark)1. 橫料: 開料之長邊與板材之長邊方向一致 Warp-wise: long side of cutting is consistent with long- side.2. 直料: 開料之長邊與板材之寬邊方向一致 Filling-wise: long- side of cutting is consistent with short- side.3. 橫直料: 兩種情形同時具備 Filling-warp: two cases above in concurrent. 4.針對板厚1.0mm以上之內層, 視具體情形確定是否進行補償。 In allusion to the inner layer of board thickness more than 1.0mm, ccording to concrete state to decide whether to be compensated or not.2.7 針對6層板以上料號依生產需要在邊框加六個熔合點(1.5cm1.5cm)。 For more than 6-layer boards, add six melting dots (1.5cm*1.5cm) at the frame according as the production requirement.3 線路處理(Circuit processing)3.1 針對12mil以下之線寬補償(Compensation for trace width below 12mil)a. 0.5OZ銅箔放大0.51.5mil(標准放大1mil). 0.5 OZ Copper foil: magnify 0.51.5mil(Standard 1.0mil)b. 1OZ銅箔放大0.52.5mil(標准放大1.5mil) 銅箔厚度2OZ以上 (含2OZ) 線寬放大2mil以上。 1 OZ Copper foil: magnify 0.52.5mil(Standard 1.5mil), copper foil above 2 OZ (included): magnify no less than 2mil. 3.2 線路PAD(需鑽孔)對成品孔徑導通孔單邊至少6mil以上(含6mil)零件孔單邊68mil遇到不能保証最小間距之情形可適當切除PAD。SMD PAD整體放大12 mil(標准放大1mil)。 Annular ring around via hole is 6mil or above, Annular ring around component hole is 68mil. Cut the PAD properly when the spacing cannot reach the minimum. Magnify SMD PAD as a whole 12mil(Standard 1mil). 3.3 線與線線與銅面線與非上錫PAD非上錫PAD之間及相鄰銅面之間保最小間距4.2mil以上(含4.2mil)密集線路區域線距保持3.5mil以上。 Keep the spacing between traces, trace to copper surface, trace to No-tin PAD, No-tin PADS and the adjacent copper surfaces 4.2mil or above, keep the spacing between conductors above 3.5mil when the traces are in dense region. 3.4 線PAD銅面離NPTH孔邊保証6mil以上(8mil以最為適宜)。 Keep the spacing from trace, PAD, Copper surface to the edge of NPTH hole above 6mil(8mil is best). 3.5 NPTH孔PAD刪除。(Remove the PAD on NPTH hole). 3.6 無法保証線距之情形可將線適當移動(不超過40mil)。 Move the trace properly when the conductor spacing cannot reach the specified size.4 防焊處理(S/M processing) 4.1 防焊PAD對線路PAD單邊邊大1.53.0mil。 The width of annular ring of S/M PAD must be 1.53.0mil over than conductor PAD. 4.2 壓線銅面之防焊PAD需縮小或切除保証間距2mil以上(含2mil)。 Reduce or cut the S/M PAD of the covered trace and copper surface, ensure the spacing more than 2mil(included). 4.3 客戶用于檢修之BGA附近之線條在保証不影響電氣連接的前提下單邊放大2mil有異常的與客戶協商處理。 Traces adjacent to BGA, which are used for customers inspection, may be magnified 2mil, without effecting electrical connection. Consult with customer when unusual condition appears. 4.4 線路錫手指之間邊到邊最小距離小于8mil之情形防焊PAD間不下墨。 When the minimum spacing between tin fingers is less than 8mil, uncovered ink among S/M PAD.5 文字處理(C/M processing) 5.1 字符離防焊PAD單邊5mil以上(含5mil)。 The spacing between legend and the edge of S/M PAD is 5mil or above. 5.2 壓上錫PAD之字符無法移動之情形將字符刪除。(壓大錫面之字符保留) Remove the legend when it covered tin PAD and cannot be moved. (Keep the legend when it is larger than tin PAD) 5.3 完全蓋住非上錫孔之字符不作處理部份壓非上錫孔之字符將字符移位或掏空(移位之字符必須保証清晰一目了然。) It is acceptable when legend covers No-tin hole completely, for partially, move or hollow out the legend (must keep the moved legends clearly and legibly). 5.4 客戶LOGO務必保証清晰完整。(Keep customers LOGO clearly and completely.)6 特殊處理(Special processing) 6.1 按客戶要求增加客戶指定的LOGO。Add specified LOGO per customers requirement. 6.2 在滿足客戶要求的前提下加入本公司周期和UL-MARK。 Under satisfying customers requirement, add our companys D/C an UL-MARK. 6.3 按客戶要求增加工藝邊(折斷邊)或按客戶要求排成連片。 Add disjunction edge (coupon) or compose into panelization according to customers requirement. 6.4 針對金手指板設置斜邊測試點。在零件面或焊錫面在成型內離成型線中心15mil處增加一條寬度為5mil的連線將相鄰兩個獨立的金手指相連。相鄰兩個金手指必須保証在不同網路上。 Set bevel testing point for G/F board. Add a connecting line of 5mil width within the profile line15mil from the center of the profile line on Comp side or solder side, which connects the two-separated neighboring G/F. Keep the neighboring G/Fs on different traces. 6.5 針對有折斷邊之雙面文字板設置文字測試點。 Set legend testing point for the double-C/M board with coupon. 在客戶許可的前提下針對有折斷邊的雙面文字板若板邊整面鋪銅則在靠近板角處設置兩個間距為80mil直徑為40mil上錫PAD若板邊加DUMMY PAD則在底邊相應位置設置擋點直徑比線路PAD直徑大5mil反向拼版在對角設置陰陽排版兩面相應位置同時設置。 With customers permission, for the double-C/M board with coupon, if the board edge is covered with copper, set two tin PADS with 80mil spacing and 40mil diameter near the board edge. If the board edge has DUMMY PAD, set the corresponding points at the edge with the diameter as 5mil longer than trace PAD. When composing reverse, set the points on the opposite angles, when composing on both sides, set the points on the corresponded positions.7. V-cut檢測線設定 (V-cut testing line setting) 7.1 在客戶允許的前提下須加V-cut檢測線。 Under customers permission, add V-cut testing line.7.2 所加檢測線線寬5mil兩端PAD直徑40mil線上需蓋防焊油墨PAD不可蓋防焊油墨。 The width of the added testing line is 5mil, the diameter of the end PAD is 40mil, and solder mask is needed to cover the line but PAD.7.3 所加之檢測線與V-cut線正交所加之PAD以V-cut線為對稱軸對稱分布。 The added testing lines are perpendicular to the V-cut lines, the added PAD are symmetrically distributed with V-cut as their symmetric axis. 7.4 相鄰需V-cut兩銅面之間可直接加檢測線而不需加PAD。 Between the two adjacent copper surfaces where V-cut is needed, add testing line directly no need PAD. 7.5 在可能情況下盡量將V-cut檢測線及PAD加于折斷邊上并將檢測線彎轉90直角處于V-cut線中心相交。 If possible, put V-cut testing line and PAD on the coupon, fold the testing line 90 with its right angle on the center of the V-cut line. 7.6 無特別指定V-cut檢測線及PAD須置于component side。 Without specified, put V-cut line and PAD on the component side. 8. 阻抗測試邊設定 (Impedance testing line setting) 8.1 客戶有特性阻抗要求之情形需加阻抗測試邊。 When impedance required, add impedance-testing line. 8.2 阻抗測試邊的設計遵照特性阻抗控制規范。客戶有設計測試coupon之情形以客戶設計為准。 The design of impedance testing line should be in accordance withImpedance control Spec.If customer has the design of testing coupon, do it according to the customers design.8.3 客戶之設計錯誤或與本公司設備不匹配之情形需自行進行測試coupon之設計。 If customer designed wrong or its design is cannot match with our equipment, the design of testing coupon needs to be carried out us.9 底片膜面設定(Artwork emulsion setting) 9.1 各層英文代號(English code for each layer.)類別(type) 層面(layer)線路層Circuit layer阻焊層Solder mask layer文字層Legend layer地層Ground layer電源層Power layer零件面Comp sideGTLGTSGTOGNDVCC焊接面Solder sideGBLGBSGBOGNDVCC 9.2 雙面板黑片膜面設定(Artwork emulsion setting for double-sided board ) GTLGTSGTO膜面朝上 Emulsion up GBLGBSGBO膜面朝下 Emulsion down 9.3 四層板黑片膜面設定(Artwork emulsion setting for 4-layer board ) 當GND層在第二層VCC層在第三層時 (When GND on the second layer, VCC on the third)GTLGTSGTOGND膜面朝上 Emulsion up GBLGBSGBOVCC膜面朝下 Emulsion down 當VCC層在第二層GND層在第三層時 (When VCC on the second layer, GND on the third)GTLGTSGTOGND膜面朝上 Emulsion upGTLGTSGTOVCC膜面朝上 Emulsion up GBLGBSGBOGND膜面朝下 Emulsion down 9.4 六層板黑片膜面設定(Artwork emulsion setting for 6-layer board) 六層板之電路圖形按其在板內之位置從零件面到焊接面依次定義為L1L2L3L4L5L6膜面設定有如下兩種情形 According to their position, the circuit patterns of 6-layer board, from Comp side to solder side, can be defined as L1, L2, L3, L4, L5, and L6. The setting of emulsion has two conditions as following:兩次壓合完成(twice lamination)L1L2L3GTSGTO膜面朝上。Emulsion up L4L5L6GBSGBO 膜面朝下。Emulsion down 一次壓合完成(once lamination)L1L2L4GTSGTO膜面朝上。Emulsion up L3L5L6GBSGBO 膜面朝下。Emulsion down 9.5 棕片與黑片膜面方向相反。(字符棕片膜面與字符黑片膜面方向一致。) 直接用于曝光機對位之黑片膜面與棕片膜面方向一致。 The emulsion of diazo film and artwork are in converse sides. (The legend diazo film emulsion is accordance with the legend artwork). The artwork emulsion of using for registration is in the same direction with diazo film emulsion.10 排版設定(Composing setting)About composing 10.1 非金手指相對間距2.5mm(成型線中心到中心) 金手指相對間距4mm(成型線中心到中心)。 G/F isn t face-to-face, spacing 2.5mm G.F is face-to-face, spacing 4mm (From its center to the center of profile line)10.2 成型線離黑邊1mm。(The spacing between profile and black edge is 1mm) 10.3 需沖模制作或進行特性阻抗控制之板子可反向拼版需進行特性阻抗控制的板子無法反向拼版時需保証阻抗測試邊離板邊0.8以上(含0.8)。When the board needs punch processing or impedance controlling, composing reverse will be allowed. For the board cant be composed reverse of which needs impedance controlling, we should keep the spacing between impedance testing line and board edge 0.8 or above. 10.4 排版時應事先預估排版后之尺寸是否合乎廠內之常備基板尺寸及壓合流程最佳尺寸2941。排版尺寸最長不可超過23.8寬邊不可大于17.5不可小于9.4.排版利用率與制程和品質需要有沖突時優先考慮滿足制程和品質需求。 Before composing, we should estimate whether the size of finished composing conforms with the size of base material within the company and the optimum size of laminating: 2941. When composing, the length is within 23.8, the width is between 9.417.5. When the utilizing ratio of composing has conflict with process and quality requirement, take process and quality in prior. 10.5 針對成品板厚小于0.8mm之噴錫板開料尺寸不超過1418。 For the HASL board which the finish board thickness is less than 0.8mm, its cutting size is no more than 1418.11 邊框寬度及外圍孔位設定(Frame width and peripheral hole position setting) 11.1 板邊黑框15mm黑片包含黑框之尺寸小于開料尺寸時加寬黑框尺寸直至與開料尺寸一致。Black frame 15mm, when the size of the artwork included the black frame is smaller than the board cutting size; widen the black frame to the original board cutting size. 11.2 靶孔PIN孔噴錫挂孔及對位之設定。 Target hole, PIN hole, HASL tooling hole and registration setting. 靶孔6個(孔中心離成型線中心8mm一般鑽孔只鑽長邊或寬邊三個)兩對邊之靶孔不可成等腰三角形或直角三角形。不同料號之靶孔相對位置絕對不可一樣。 Target hole: 6(The spacing between the hole center and the profile line center is 8mm, 3 holes are needed drilling on long-side or wide-side). The target holes on the opposite side can t be arranged into isosceles triangle or right triangle. The relative position of the target holes of various parts is absolutely different. PIN孔18個(孔中心離成型線中心6.6mm)。有一角三個PIN孔等距排列以防止棕片對倒(防呆)。 PIN孔實際鑽孔直徑125mil底片上PAD直徑138mil單邊僅6.5mil方便外線影對偏檢查(防呆)。在板四角設置四個靶標零件面與防焊面分別為“”和“”兩面相對完全吻合方便檢查底片是否因溫濕度變化變形。 PIN hole: 18(The spacing between the hole center and the profile line center is 6.6mm) 3 Pin holes are arranged in an angle evenly in order to protect against inverting of diazo film (mistake proofing). The actual drilling diameter of PIN hole is 125mil, PAD diameter on the artwork is 138mil, the annular ring is only 6.5mil to be convenient for out-layer inspecting of registration (mistake proofing). Set 4 target marks on the 4 angles of the board, Comp side and solder side are marked as “”and “”,the two sides coincide with each other completely. It is convenient to inspect artwork deformation because of the change of temperature and humidity.噴錫挂鉤孔2個(孔中心離成型線中心6mm)定于板子寬邊居中。HASL tooling hole: 2 (The spacing between the hole center and the profile lin