PCB Layout 规范.doc

Pan-International Industrial Corp.China FactorySubject： PCB Layout 規範 Doc No : WI- page 28 of 27 Revision: 011.0 目的： 提供PCB Layout 時之依據，確保所Layout 之PCB 符合實際生產及相關標準，以期降低 生產之困擾，使PCB生產順暢。2.0 適用範圍：本公司生產之CD-ROM 、Mother Board 、DVD -Decoder Card、介面卡等所有產品皆適用之。3.0 定義：3.1 PCB: Printed Circuit Board3.2 Layout: PCB設計製作3.3 Dimension: mm(公制) mil(英制) 1mil =0.0254 mm 4.0 參考資料： 4.1 IPC-A-600D 印刷電路板允收標準4.2 本公司 SMT 生產設備Manual5.0 相關單位職責：5.1 R/D部門：負責PCB設計及規格制訂、並負責与PCB製作廠商之作業要求及技術規範，包括提供所需之文件檔案。 5.2 製造單位：負責規格、資訊之提供及問題回饋。5.3 品管單位：負責執行檢驗作業。6.0 作業內容与程序W6.1 SMT 部分TL6.1.1 PCB尺寸規格 mm 三洋九洲松下卡西歐MAXMINMAXMINMAXMINL46050360 5036050W360502505025050T2.00.52.00.52.00.56.1.2 Fiducial Mark 規格設定及位置 6.1.2.1 規格 1 - 圓形 D2 D2D1：1.0 mm (10%)D2：2.0 mm (10%) D1 6.1.2.2 規格 2 - 正方形 D1: 1.0 mm (10%) D2 D1 D2: 2.0 mm (10%) 6.1.2.3 規格 3 - 三角形 D1: 1.0 mm (10%) D2 D2: 2.0 mm (10%) D1 6.1.2.4 規格 4 D1: 1.0 2.0 mm (10%) D1 6.1.2.4 規格 4 - 十字形 D1: 1.0 mm (10%) D1 D2: 2.0 mm (10%) D26.1.2.5 規格 5 - 貫穿孔作mark D1: 1.0 mm (10%) D1 D2 D1 D2 D2: 2.0 mm (10%) 6.1.2.6 規格 6 -PAD作mark D1 D1: 1.0 mm (10%) D1 D2 D2: 2.0 mm (10%) D2 6.1.2.7 Layout 時須注意事項 6.1.2.7.1 PCB上至少應有三個Fiducial Mark ，若為雙面SMT則每面 各要有三個以上。6.1.2.3.2 Fiducial mark 中心距板邊為X=5mm(198mil)以上。6.1.2.3.3 Fiducial mark 以中心點3mm(120mil)範圍內不得有任何文字，Trace (線路)、 PAD、 VIA(通孔)，避免產生雜訊。6.1.2.3.4 超邊100之ASIC如：QFP、BGA、Chip 須於對角線上各加一顆Fiducial mark或在IC中心之位置加一mark點。 6.1.3 SMD Layout Spec (規格) 6.1.3.1 SMD瓷片電容 E SOLDER LAND/ 焊墊面積/ SOLDER PASTE PATTERN 錫膏模型 D D G SOLDER RESIST PATTERN 防焊區模型 OCCUPIED AREA C B 佔據面積 A TRACKS or F DUMMY TRACKS 軌跡線 下表為在SMT 及DIP兩種情況下之不同規格 REFLOW SOLDERING/SMT 迴流焊SIZEFOOTPRINT DIMENSIONS IN MM/引腳尺寸(mm)PROCESSING REMARKS製作注意事項 PLACEM. ACC 公差ABCDEFG 0603 2.30 0.50 0.90 0.90 0.00 2.70 1.70 + / - 0.25 0805 2.80 0.90 0.95 1.40 0.45 3.20 2.10 + / - 0.25 1206 4.00 2.00 1.00 1.80 1.40 4.40 2.50 + / - 0.25 1210 4.00 2.00 1.00 2.70 1.40 4.40 3.40 + / - 0.25WAVE SOLDERING /DIP 波峰焊SIZEFOOTPRINT DIMENSIONS IN MM/引腳尺寸(mm)PROCESSING REMARKS製作注意事項 PLACEM. ACC 公差ABCDEFG 0603 2.70 0.90 0.90 0.80 0.00 3.20 2.10 1 + / - 0.25 0805 3.40 1.30 1.05 1.30 0.20 4.30 2.70 1 + / - 0.25 1206 4.80 2.30 1.25 1.70 1.25 5.90 3.20 3 + / - 0.25 1210 5.30 2.30 1.50 2.60 1.25 6.30 4.20 3 + / - 0.25 6.1.3.2 SMD 鉭電容 E SOLDER LAND/ 焊墊面積/ SOLDER PASTE PATTERN 錫膏模型 D SOLDER RESIST G PATTERN 防焊區模型 OCCUPIED AREA C B 佔據面積 A TRACKS or F DUMMY TRACKS 軌跡線 下表為在SMT 及DIP兩種情況下之不同規格 REFLOW SOLDERING/SMT 迴流焊SIZEFOOTPRINT DIMENSIONS IN MM/引腳尺寸(mm)PROCESSING REMARKS製作注意事項 PLACEM. ACC 公差ABCDEFGA 4.00 1.80 1.10 1.20 0.90 4.40 2.30 + / - 0.25B 4.30 1.80 1.25 2.00 0.90 4.70 3.30 + / - 0.25C 6.80 3.20 1.80 2.40 2.30 7.20 4.0 + / - 0.25D 8.30 4.70 1.80 3.30 3.80 8.70 5.00 + / - 0.25WAVE SOLDERING /DIP 波峰焊SIZEFOOTPRINT DIMENSIONS IN MM/引腳尺寸(mm)PROCESSING REMARKS製作注意事項 PLACEM. ACC 公差ABCDEFG A 5.90 1.90 2.00 2.60 0.75 6.40 4.00 2 + / - 0.25 B 6.50 1.90 2.30 2.60 0.75 7.00 5.30 + / - 0.25 C 9.90 3.30 3.30 3.20 2.10 10.4 6.60 + / - 0.25 D 11.8 4.80 3.50 4.30 3.60 12.3 8.0 + / - 0.256.1.3.3 SMD MELF二極管 E SOLDER LAND/ 焊墊面積 SOLDER PASTE PATTERN 錫膏模型 G SOLDER RESIST D PATTERN 防焊區模型 OCCUPIED AREA 佔據面積 C B TRACKS or A DUMMY TRACKS F 軌跡線 下表為在SMT 及DIP兩種情況下之不同規格 REFLOW SOLDERING/SMT 迴流焊PACKAGETYPEFOOTPRINT DIMENSIONS IN MM/引腳尺寸(mm)PROCESSING REMARKS製作注意事項 PLACEM. ACC 公差ABCDEFG SOD 80 4.30 2.30 1.00 1.70 1.90 4.70 2.50 + / - 0.25 SOD 87 4.30 2.30 1.00 2.10 1.90 4.70 2.90 + / - 0.25 SOD 87S 4.30 2.30 1.00 1.60 1.90 4.70 2.30 + / - 0.25WAVE SOLDERING /DIP 波峰焊PACKAGETYPEFOOTPRINT DIMENSIONS IN MM/引腳尺寸(mm) PREFERED SOLDERING DIRECTION PLACEM. ACC 公差ABCDEFG SOD 80 4.90 2.70 1.10 1.70 2.10 6.30 2.90 + / - 0.25 SOD 87 4.90 2.70 1.10 2.10 2.10 6.90 3.50 + / - 0.25 SOD 87S 4.90 2.70 1.10 1.50 2.10 6.00 2.60 + / - 0.256.1.3.4 SMD IC Small Outline SOP 8 - SOP 32 SOLDER LAND/ SOLDER PASTE 焊墊面積/錫膏模型 C A SOLDER RESIST B F PATTERN 防焊區模型 OCCUPIED AREA 佔據面積 1. 0.60 1.27 (N-2)X G ENLARGED SOLDER LAND (擴大焊點面積) DIP 波峰焊 0.30 1.20 SOLDER LAN SOLDER ALND PATTERN C 焊墊面積/錫膏模型 B A F SOLDER RESIST PATTERN防焊區模型 OCCUPIED AREA 佔據面積 0.60 1.27 (N-2)X BOARD DIRECTION (PCB流向) G DURING WAVE SOLDERING (雙波峰錫爐) REFLOW SOLDERING (SMT迴流焊)PACKAGETYPE(包裝形式)ENVELOPE SPEC.(封裝規格)NFOOTPRINT DIMENSIONS IN MM(引腳尺寸)PLACEMENT ACCURACY(公差)ABCFGSO-8SOT96-186.604.001.307.005.50+ / - 0.25SO-8LSOT176-1811.008.001.5011.408.40+ / - 0.25SO-14SOT108-1146.604.001.307.009.30+ / - 0.25SO-16SOT109-1169.005.501.307.0010.50+ / - 0.25SO-16LSOT162-11611.008.001.5011.4010.90+ / - 0.25SO-20LSOT163-12011.008.001.5011.4013.40+ / - 0.25SO-24LSOT137-12411.008.001.5011.4016.00+ / - 0.25SO-28LSOT136-12811.008.001.5011.4018.50+ / - 0.25SO-28XLSOT213-12812.409.001.7012.8018.60+ / - 0.25SO-32XXLSOT221-13214.8011.801.5015.2021.10+ / - 0.25WAVE SOLDERING(波峰焊)PACKAGETYPE(包裝形式)ENVELOPE SPEC.(封裝規格)NFOOTPRINT DIMENSIONS IN MM(引腳尺寸)PLACEMENT ACCURACY(公差)ABCFGSO-8SOT96-188.003.802.109.407.10+ / - 0.25SO-8LSOT176-1811.507.901.8013.0010.90+ / - 0.25SO-14SOT108-1148.003.802.109.4010.80+ / - 0.25SO-16SOT109-1168.003.802.109.4012.10+ / - 0.25SO-16LSOT162-11611.507.901.8013.0013.40+ / - 0.25SO-20LSOT163-12011.507.901.8013.0015.90+ / - 0.25SO-24LSOT137-12411.507.901.8013.0018.50+ / - 0.25SO-28LSOT136-12811.507.901.8013.0021.00+ / - 0.25SO-28XLSOT213-12812.709.001.8514.2021.50+ / - 0.25SO-32XXLSOT221-13215.3011.701.8016.8024.00+ / - 0.25 6.1.3.5 電晶體SOT-23 and SOT-143 REFLOW SOLDERING (迴流焊) WAVE SOLDERING(波峰焊)0.701.200.702.603.601.100.852.803.200.803.404.501.001.504.004.500.701.202.603.601.601.100.852.803.201.100.700.803.404.501.301.501.303.401.001.504.004.50 SOT-23 SOT-23 REFLOW SOLDERING (迴流焊) WAVE SOLDERING(波峰焊) SOT-143 SOT-1432.60 6.1.3.6電晶體SOT-89 and SOT 2230.75(3X)2.202.700.501.701.502.00 5.20 3.000.901.402.502.00 *1.402.903.30 * 2.40 6.603.203.60 1.10(3X) 4.601.404.803.803.80* 3.40 7.208.004.804.10*4.10 4.00 9.008.70 SOLDER LAND SOLDER RESIST OCCUPIED SOLDER PASTE PATTERN PATTERN AREA PATTERN0.75(3X) REFLOW SOLDERING (迴流焊) WAVE SOLDERING(波峰焊) SOT-89 SOT-89 3.001.50 1.40(3X) REFLOW SOLDERING (迴流焊) WAVE SOLDERING(波峰焊) SOT-223 SOT-223 4.601.70 6.1.3.7 SOJ 24 & SSOP 20GBAFP(N-2)XGD SOLDER LAND/ SOLDER PASTE PATTERN 焊墊面積/錫膏模型 SOLDER RESIST PATTERN 防焊區模型 OCCUPIED AREA 佔據面積 SOJ 24 REFLOW SOLDERRING (迴流焊)PACKAGE TYPE(包裝形式)RNVELOE.SPEC.(封裝規格)NPFOOTPRINT DIMENSIONS IN MM(引腳尺寸)公差ABCDFGSOJ 24SOT 239-1241.2710.55.21.700.609.5016.10+ / - 0.25 SSOP - 20 REFLOW SOLDERRING (波峰焊)PACKAGE TYPERNVELOE.SPEC.NPFOOTPRINT DIMENSIONS IN MM公差ABCDFGSSOP - 20SOT 266-1200.656.904.701.100.357.307.00+ / - 0.25 6.1.3.8 IC Quad Flat Pack QFP 44 - QFP 208 0.20 Ax 0.20 Bx C0.20 SOLDER LAND/ SOLDER PASTE PATTERNAY BY SOLDER RESIST PATTERN P(Nx-1)X C0. 20 OCCUPIED AREA D P(Nx-1)X X 0.15mm XXREFLOW SOLDERING /SMT 迴流焊PACKAGE TYPEENVELOPESPEC.NXNYFOOTPRINT DIMENSIONS IN MM/尺寸規格PLACEM ACC./公差PAXAYBXBYCDQFP44SOT20311110.8015.0015.0010.8010.802.100.40+ / - 0.15QFP44SOT20511111.0019.4019.4014.7014.702.350.50+ / - 0.25QFP48SOT19612120.7515.7015.7010.5010.502.600.40+ / - 0.15QFP64SOT20819131.0025.4019.4021.5015.501.950.50+ / - 0.25QFP80SOT21924160.8025.4019.4021.5015.501.950.40+ / - 0.15QFP100SOT21030200.6525.4019.4021.5015.501.950.35+ / - 0.10QFP120SOT22030300.8033.4033.4029.7029.701.850.40+ / - 0.15QFP 128SOT24432320.8033.4033.4029.7029.701.850.40+ / - 0.15QFP128SOT28032320.8032.6032.6029.7029.701.450.40+ / - 0.15QFP160SOT22540400.6533.4033.4029.7029.701.850.35+ / - 0.10QFP20852520.533.0033.4029.7028.701.850.25+ / - 0.10 6.1.3.9 IC PLCC 20 PCLL 84 AX C BX C AY G BY 0.60 1.27(Nx-1)X F REFLOW SOLDERING PACKAGE TYPEENMEL OPE SPEC.NXNYFOOTPRINT DIMENSIONS IN MMPLACEM.ACC.AXAYBXBYCFGPLCC-20AL15510.3010.306.606.601.8510.7010.70+