电子元器件封装方式对照图.doc

/BGABall Grid ArrayCPGACeramic Pin GridArraySBGALGAEBGA 680LPGAPlasticPin Grid ArrayFBGALBGA 160LuBGAMicroBall GridArrayQFPQuad Flat PackagePBGA 217LPlastic Ball Grid ArrayLQFPPQFPSBGA 192LCLCCLDCCTSBGA 680LLCCPLCCTQFP 100LJLCCSOT26SOT363SOJLQFP 100LSOSmall Outline PackageSSOPMETAL QUAD 100LHSOP28TSOPThin Small Outline PackagePQFP 100LTSSOP or TSOP IIThin Shrink Outline PackageSOHLAMINATE TCSP 20LChip Scale PackagePCMCIASNAPTKLAMINATE CSP 112LChip Scale PackageSNAPTKSNAPZPCERQUADCeramic Quad Flat PackFlat PackSOT220LLP 8LaSOT223SOT223SO DIMMSmall Outline Dual In-line Memory ModuleSOT23Socket 603FosterSOT23SOT323SOT25SOT353SOT343SOCKET 370For intel 370 pin PGA Pentium III & Celeron CPUSOT523SOT89SOCKET 423For intel 423 pin PGA Pentium 4 CPUTO252TO263TO268SOCKET 462/SOCKET AFor PGA AMD Athlon & Duron CPUC-BendLead CeramicCaseSOCKET 7For intel Pentium & MMX Pentium CPUGull Wing Leads SC-70 5LPDIPSDIPPSDIPSOJ 32LPCDIPDIPDual Inline PackageSOP EIAJ TYPE II 14LDIP-tabDual Inline Package with Metal HeatsinkFDIPSSOP 16L ZIPZig-Zag Inline PackageCNRCommunication and Networking Riser Specification Revision 1.2SIPSingle Inline PackageSIMM30Single In-line Memory ModuleSOT220SIMM72Single In-line Memory ModuleFTO220SIMM72Single In-line Memory ModuleSLOT 1For intel Pentium II Pentium III & Celeron CPUSLOT AFor AMD Athlon CPUPCI 32bit 5VPeripheral Component InterconnectPCI 64bit 3.3VPeripheral Component Int