660植物灯规格书仿流明.doc

承认书SpecificationProduct/产品 :White LAMP LEDPart Number/型号 :YL-P0513W-AB-14Customer/客户 :-Issue Date /发行日期 :2011-08-08MAKER制定Prepared制作Checked审核Approved核准刘刚版本A0Customer Confirmation客户确认Features/产品特点High reliability (可靠性好)High Luminous Intensity（亮度高）Peak wavelength p=660nm（峰值波长p=660nm）surface light emitting（表面发光结构）Low forward voltage（低电压）Pb Free（使用自由、方便）This product itself will remain within RoHS compliant version.（产品本身符合RoHS认证标准）Applications/应用（在日照量少或日照时间短的时候作为植物光合作用的补充照明）（植物工厂的主要照明并为植物提供周期、光形态建成的诱导照明）（广泛应用于水溶液培养，园林，播种，育种，幼苗，农场，花卉等栽培）Device Selection GuideLED Part No.ChipLens ColorMaterialAlGaInPWater clearAbsolute maximum ratings/最大绝对额定值Parameter参数Symbol符号Value数值Unit单位Continuous Forward Current持续工作电流If350mAReverse Voltage反向电压VR5VOperating Temperature工作温度Topr-25+85Storage Temperature储存温度Tstg-35+85Soldering temperature焊接温度Tsol2605（for4sec）Power Dissipation功率消耗Pd1000mWPulse Current脉冲电流IFP1000mA Shape Specification /外观要求No.序号ITEM项目SPEC OR DESCRIPTION规格要求描述1Lens胶体 No change color/不可有胶体变色 No Disrepair/不可有破损 Scratch/划伤（length 2.0mm,Width0.25mm） macula/黑点、异物（0.25mm and 2EA in Encapsulation reverse） bubble/气泡（0.3mm and 2EA Encapsulation reverse）2PINPIN脚 No oxidation/不可有氧化3Configuration结构 No PIN loosen/PIN脚不可松动4surface preparation表面处理 Cut neednt electroplate /切口处无需作电镀5Lens color胶体颜色 Water Clear水透明 Dimensional drawing/尺寸图 Opto-Electronical Characteristics /光电参数特性 (Ta=25)参数Parameter符号Symbol测试条件Condition最小Min.平均Typ.最大Max.单位Units发光强度（Luminous Intensity）EeIF=350mA-3500-mcd峰值波长（Peak Wavelength）pIF=350mA-660-nm波宽（Spectral Bandwidth）IF=350mA-45-nm正向电压（Forward Voltage）VFIF=350mA-2.23.0V反向电流（Reverse Current）IRVR=5V-10A角度（View Angle）21/2IF=350mA-140-Deg Opto-Electronical Rank /光电分级规格 Condition：IF=350mA Unit：mcdBin NumberMNPQ最小（Min）2500300035004000最大（Max）3000350040004500 Typical Electro-Optical Characteristics Curves /光电特性曲线图 Lighting Angle /发光角度 Reliability Test Items/可靠度测试项目 No.ItemConditionTime/CycleNumber of Damaged测度项目测试条件测试时间或周期不良数/测试数1Soldering Heat Test2605 oC10 sec0/60焊接试验2Thermal Shock0 oC (15sec) 100 oC(15sec)20 cycle0/60热冲击3High Temp. Storage100 oC1000Hrs0/60高温储存4Low Temp. Storage-40 oC1000Hrs0/60低温储存5Temperature Cycle Test-40 oC 80 oC100 Cycles, 200 Hrs0/60高低温循环6High Temp. High Humidity Test60 oC, 90 % RH1000 Hrs0/60高温高湿7Operation Life Test 1Room Temp., 350mA1000 Hrs0/60常温老化8Operation Life Test 2Room Temp., 350mA500 Hrs0/60常温老化9High Temp. Operation Life Test85 oC ,200mA1000 Hrs0/60高温老化10Low Temp. Operation Life Test-30 oC , 450mA1000 Hrs0/60低温老化Judgment Criteria/判定标准：ItemSymbolTest ConditionsJudgment Criteria项目 Forward VoltageVfIF = 350 mA% 10 %正向电压 Leakage CurrentIrVr = 5V10 uA反向漏电流 Luminous IntensityIvIF = 350 mA% 10%发光强度Peak WavelengthlmIF = 350 mA% 5%峰值波长 Reflow/回流焊接Lead Solder/有铅焊接Lead-Free Solder/无铅焊接 Packaging Specifications/包装规格 Caution/注意事项1、Before opening the package： the LED should be kept at 30oC or less and 90 % RH or less. 打开包装前请在温度30 oC湿度90%的环境以下储存。2、After openning the package ：the LED should be kept at 30 oC or less and 30%RH or less.The LED should be soldered within 168h( 7days)after opening the package. If unused LEDs remain，they should be stored in moisture proof package，such as sealed containers with packages of moisture absorbent material(silica gel). It is also recommended to return the LEDs to the original moisture proof bag and to seal the moisture bag again.打开包装后，LED请在温度30 oC湿度60%的环境以下储存，并应在168小时内完成焊接。如果包装打开后，未用完的LED应放置在防潮包装中，比如含有防潮剂（硅胶）的袋子中。建议将此LED返回到原始包装带中并将其封口。3、After openning the package ,If the humidity indicators color change from blue to pink at 30% or more, and if the LEDs have exceed the storage time, bake treatment should be performed using the following conditions.baking treatment :more than 24 hours at 605 oC。打开包装后，如果发现湿度指示卡的颜色由蓝色变为粉红色并且是在30%（含30%）以上，或者产品超过储存时间，干燥处理如下：605 oC，24小时以上。 4、The LED is an ESD sensitive device. All the equipment and machine must be properly grounded. LED是静电敏感器件，使用时所有设备、机构都需有适当的接地导电措施。5、When make use of it,please use static-free container,operator showld ware antistatic clothes and rope-satic-ring also should make effective ground使用时请使用防静电的盛装容器，作业人员应穿着防静电服装及佩戴有绳之静电环并作有效接地。6、Damaged device will appear some symptoms,lower forward voltage,higher leak current,or even short curcuit受静电与突波破坏之LED的电性特性上，会有明显的漏电流，或驱动电压明显变低，甚至是短路现象。7、After soldering the LED should keep out off any shake or outer force before it come to normal tempreture 上在焊接温度回到正常以前，必须避免使LED受到任何震动或外力。8、Reflow soldering should not be done more than two times,when soldering,do not put stress on the LEDs during heating.After soldering,do not warp the circuit board.。Repair should not be done after the LEDs have been soldered. When repairing is unavoidable,a double-head soldering iron shoud be used. It should be confirmed beforehand whether the characteristics of the LEDs will not be damaged by repairing.LED不宜过两次回流焊接，在高温焊接期间，不要在LED表面施压。LED焊接后，不要弯曲线路板。LED焊接后不宜进行返修，当返修不可避免时，请事先确认返修是否使LED的特性受到破坏，再确定是否使用双头烙铁进行返修。9、LED is one-way continuity, please check electrode before mount, if amount wrong ,the LED chip will damage or fail when LED applied voltageLED单向导通性，安装前确认极性，若装反，在施加电压时容易造成LED芯片损伤或失效。10、Please design the PCB board to keep a distance between LED and other emit heat component 线路设计时，请尽量避免将LED与发热组件靠得过近。11、Strongly recommend design the board according setting current other than setting voltage .if you are really need setting voltage type please consider there may cause influence arise by difference voltage of difference LED电路设计上，建议以定电流设计，若为定电压设计，请考虑LED之间不同正向电压所可能造成之影响。12、The outer voltage change will bring the current index change .unsuitable design and current control,easy cause LED fail .for example excess current will cause LED