焊线动画-wirebonding

WAFERMOUNT,WAFERSAW,DIEATTACH,EPOXYCURE,WIREBOND,SemiconductorPackagingProcess,MODING,IntegratedCircuit(IC),TRIM/FORM,WAFER,CONTENTS,A.PURPOSEB.PRINCIPLEC.PROCESSD.PACKAGEINTODUCEE.M/CBASICDATAF.MATERIALG.PARAMETERH.DEFECTSI.REFERENCE,A.PURPOSE,FORMINGASTRONGANDRELIABLEINTERTALLICBONDBETWWEENTHEWIREANDTHEPAD,ASWELLASBETWEENTHEWIREANDTHELEAD,DICE,GOLDWIRE,LEADFRAME,A.PURPOSE,pad,lead,Goldwire,WedgeBond(2ndBond),BallBond(1stBond),B.PRINCIPLE,HARDWELDING:PRESSUREAMPLIFY&FREQUENCYWELDINGTIMEWELDINGTEMPATURETHERMOSONICBONDING:THERMALCOMPRESSUREULTRASONICENERGY(1.2MHZ),B.PRINCIPLE,C.WIREBONDPROCESS,pad,lead,Freeairballiscapturedinthechamfer,GOLDBALL,Freeairballiscapturedinthechamfer,pad,lead,Freeairballiscapturedinthechamfer,pad,lead,Freeairballiscapturedinthechamfer,pad,lead,Freeairballiscapturedinthechamfer,pad,lead,Formationofafirstbond,pad,lead,Formationofafirstbond,pad,lead,Formationofafirstbond,pad,lead,heat,PRESSURE,UltraSonicVibration,Formationofafirstbond,pad,lead,UltraSonicVibration,heat,PRESSURE,Capillaryrisestoloopheightposition,pad,lead,Capillaryrisestoloopheightposition,pad,lead,Capillaryrisestoloopheightposition,pad,lead,Capillaryrisestoloopheightposition,pad,lead,Capillaryrisestoloopheightposition,pad,lead,Formationofaloop,pad,lead,Formationofaloop,pad,lead,pad,lead,pad,lead,pad,lead,pad,lead,pad,lead,pad,lead,pad,lead,pad,lead,pad,lead,pad,lead,pad,lead,pad,lead,pad,lead,pad,lead,pad,lead,pad,lead,Formationofasecondbond,pad,lead,heat,Formationofasecondbond,pad,lead,heat,heat,pad,lead,heat,heat,pad,lead,heat,heat,pad,lead,pad,lead,pad,lead,pad,lead,pad,lead,pad,lead,pad,lead,Discon