详细介绍pcb印制线路板(电路板)的制作流程演示幻灯片

1,PCB生产流程工序介绍,2,3,4,5,6,开料(IssueMaterial),一、内层图形(InnerLayerPattern),7,一、内层图形(InnerLayerPattern),P.P.,銅箔（copperfoil）,8,一、内层图形(InnerLayerPattern),开料流程说明切料：按照订单要求，将大料切成MI规定的大小。磨边/圆角：通过机械打磨去除开料时板边及板四边的直角留下的玻璃纤维，以减少在后工序生产过程中擦花和划伤板面，造成品质隐患。烤板：通过烘烤去除水汽和有机挥发物，释放内应力，促进交联反应，增加板料尺寸稳定性，化学稳定性和机械强度。,9,开料(IssueMaterial),一、内层图形(InnerLayerPattern),内层清洗(InnerLayerCleaning),10,一、内层图形(InnerLayerPattern),抗蝕刻油墨etchingresist,11,开料(IssueMaterial),一、内层图形(InnerLayerPattern),内层清洗(InnerLayerCleaning),对位(Registration),曝光(Exposure),显影&蚀刻&退膜(Developing&Etching&Stripping),12,一、内层图形(InnerLayerPattern),13,一、内层图形(InnerLayerPattern),干膜/湿膜&显影&蚀刻流程说明经磨板粗化后的内层铜板，经清洗干燥，辊涂湿膜/贴干膜干燥后，用紫外线曝光。曝光后的干膜变硬，遇弱碱(Na2CO3)不能溶解，遇强碱(NaOH)能溶解，而未曝光的部分遇弱碱就溶解掉，内层线路就是利用该物料特性将图形转移到铜面上来。干膜/湿膜覆盖电路图形的表面，防止铜蚀刻；其他裸露在基板上不要的铜，以化学反应方式将予以去除使其形成所需的线路图形。,14,一、内层图形(InnerLayerPattern),去墨液（inkstripping）,15,一、内层图形(InnerLayerPattern),退膜流程说明线路图形蚀刻完成后再以强碱NaOH溶液退去覆盖在图形电路表面的干膜。,16,开料(IssueMaterial),一、内层图形(InnerLayerPattern),内层清洗(InnerLayerCleaning),对位(Registration),曝光(Exposure),显影&蚀刻&退膜(Developing&Etching&Stripping),内层完成(InnerLayerFinisshed),17,二、压合(Lamination),内层板(InnerLayerPCB),黑化or粽化(BlackOxideorBrownOxide),18,二、压合(Lamination),19,二、压合(Lamination),棕化流程说明通过水平化学生产线处理，在内层板铜面产生一种均匀，有良好结合特性的有机金属层结构，使内层粘合前铜层表面粗化，增强内层铜层和半固化片之间压板后粘合强度。,20,二、压合(Lamination),内层板(InnerLayerPCB),黑化or粽化(BlackOxideorBrownOxide),层叠(Lay-up),21,二、压合(Lamination),22,二、压合(Lamination),压合叠板方式（如图）：,23,二、压合(Lamination),内层板(InnerLayerPCB),黑化or粽化(BlackOxideorBrownOxide),层叠(Lay-up),热压合(HotLamination),冷压(CoolLamination),24,二、压合(Lamination),25,二、压合(Lamination),压合流程说明在高温高压条件下利用半固化片从B-stage向C-stage的转化过程，将各线路层粘结成一体。,26,二、压合(Lamination),内层板(InnerLayerPCB),黑化or粽化(BlackOxideorBrownOxide),层叠(Lay-up),热压合(HotLamination),冷压(CoolLamination),清洗(Cleaning),钻靶孔(DrillingTargetHole),铣边框(RoutingFrame),27,二、压合(Lamination),28,二、压合(Lamination),内层板(InnerLayerPCB),黑化or粽化(BlackOxideorBrownOxide),层叠(Lay-up),热压合(HotLamination),冷压(CoolLamination),清洗(Cleaning),钻靶孔(DrillingTargetHole),铣边框(RoutingFrame),压合完成(LaminationFinished),29,三、钻孔(Drilling),钻孔(Drilling),待钻孔(WaitingForDrilling),30,三、钻孔(Drilling),Coppercladedlaminates,thedrilledblank,31,三、钻孔(Drilling),钻孔流程说明利用钻咀的高速旋转和落速，在PCB板面加工出客户所需要的孔；线路板中孔主要用于线路中元件面与焊接面及层与层之间的导通、IC引脚的插装。,32,三、钻孔(Drilling),钻孔(Drilling),检孔(HoleChecking),已钻孔(DrillingFinished),待钻孔(WaitingForDrilling),33,化学沉铜(PlatedThroughHole),四、沉铜+加厚镀(Plating-ThroughHole),已钻孔(FinishedDrilling),磨板(GrindingBoard),整板电镀(PanelPlating),34,四、沉铜+加厚镀(Plating-ThroughHole),35,四、沉铜+加厚镀(Plating-ThroughHole),沉铜+加厚镀流程说明沉铜：通过一系列化学处理，最终在绝缘的孔壁及板铜面上，沉积一层厚薄均匀的金属铜(0.3-0.7微米)，为后工序提供一定的金属电镀导通层。加厚镀：通过电镀铜的方式，将孔壁和板面铜加厚至一定的厚度，以确保后工序过程中孔壁的完整。上板膨胀二级逆流水洗除胶渣回收热水洗二级逆流水洗中和二级逆流水洗碱性除油热水洗二级逆流水洗微蚀二级逆流水洗预浸活化二级逆流水洗加速水洗化学沉铜二级逆流水洗下板浸稀酸,36,来料(InconmingPCB),干膜(JointingDryFilm),磨板(GrindingBoard),五、干膜(DryFilm),37,五、干膜(DryFilm),laminator,38,来料(InconmingPCB),干膜(JointingDryFilm),磨板(GrindingBoard),对位(Registration),五、干膜(DryFilm),曝光(Exposure),39,五、干膜(DryFilm),底片MASK,40,来料(InconmingPCB),干膜(JointingDryFilm),磨板(GrindingBoard),对位(Registration),五、干膜(DryFilm),曝光(Exposure),显影(Developing),41,五、干膜(DryFilm),42,五、干膜(DryFilm),外层图形转移流程说明经磨板粗化后的外层铜板，经清洗干燥，贴干膜干燥后，用紫外线曝光。曝光后的干膜变硬，遇弱碱不能溶解，遇强碱能溶解，而未曝光的部分遇弱碱就溶解掉，外层线路就是利用该物料特性将图形转移到铜面上来。,43,来料(InconmingPCB),干膜(JointingDryFilm),磨板(GrindingBoard),对位(Registration),五、干膜(DryFilm),曝光(Exposure),显影(Developing),QC检查(QCInspection),完成干膜(DryFilmFinished),44,六、图形电镀&蚀刻(PatternPlating&Etching),干膜板(DryFilm),图形电镀(PatternPlating),45,六、图形电镀&蚀刻(PatternPlating&Etching),二次銅thesecondarycopper,46,六、图形电镀&蚀刻(PatternPlating&Etching),图形电镀流程说明镀铜：图形电镀铜在图形转移后，通过电镀的方式对孔内铜及线路进行电镀处理，满足客户对孔内及线路的铜厚度要求，保证其优良的导电性；镀镍：镀镍层作为中间层金、铜之间的阻挡层作用，它可以阻止金铜间的相互扩散和阻碍铜穿透到金表面确保金层的平整性及硬度；镀金：镀金层碱性蚀刻镀的保护层，也可以作为客户焊接和邦线的最终表面镀层，具有优良的导电性及抗化学浸蚀能力；镀锡：为碱性蚀刻提供抗蚀保护层，以保证碱性蚀刻后形成良好的线路；,47,六、图形电镀&蚀刻(PatternPlating&Etching),干膜板(DryFilm),图形电镀(PatternPlating),电镀完成(PlattingFinished),退膜(DryFilmStripping),48,六、图形电镀&蚀刻(PatternPlating&Etching),剝膜液（thedryfilmstrippingsol.）,49,六、图形电镀&蚀刻(PatternPlating&Etching),退膜流程说明线路图电镀刻完成后再以NaOH溶液退去干膜。,50,六、图形电镀&蚀刻(PatternPlating&Etching),干膜板(DryFilm),图形电镀(PatternPlating),电镀完成(PlattingFinished),退膜(DryFilmStripping),蚀刻(Etching),51,六、图形电镀&蚀刻(PatternPlating&Etching),蝕刻液（Etchingsolution）,52,六、图形电镀&蚀刻(PatternPlating&Etching),蚀刻流程说明外层通常采用正片电镀方式，镀锡/镍金层覆盖电路图形的表面防止铜蚀刻；其他干膜覆盖在基板上不要的铜以化学反应方式予以除去，使其形成所需的线路图形。,53,六、图形电镀&蚀刻(PatternPlating&Etching),干膜板(DryFilm),图形电镀(PatternPlating),电镀完成(PlattingFinished),退膜(DryFilmStripping),蚀刻(Etching),退锡(TinRemoving),54,六、图形电镀&蚀刻(PatternPlating&Etching),55,六、图形电镀&蚀刻(PatternPlating&Etching),退锡流程说明外层蚀刻完成后用硝酸溶液将覆盖在线路图形表面的镀锡层予以除去，此时外层铜线路露出。,56,六、图形电镀&蚀刻(PatternPlating&Etching),干膜板(DryFilm),图形电镀(PatternPlating),电镀完成(PlattingFinished),退膜(DryFilmStripping),蚀刻(Etching),退锡(TinRemoving),完成蚀刻(EtchingFinished),57,丝印阻焊(SolderMaskPrinting),七、阻焊(SolderMask),磨板(GrindingBoard),58,七、阻焊(SolderMask),59,七、阻焊(SolderMask),阻焊印刷流程说明油墨层在刚印完后，会留下网线痕迹。这可通过静置一段时间来改善，同时线路边缘局部微小区域覆盖不全的情况也可以通过静置来改善，并且静置也能使部分溶剂挥发，减少预烤的负荷量。,60,对位(Registration),丝印阻焊(SolderMaskPrinting),预烘(Pre-heating),七、阻焊(SolderMask),磨板(GrindingBoard),曝光(Exposure),61,七、阻焊(SolderMask),62,七、阻焊(SolderMask),曝光流程说明通过预烤段蒸发油墨中的溶剂，防止底片和板面发生粘结。经过紫外线照射的油墨部分进行固化，未曝光的部分在下一工序中予以除去。,63,对位(Registration),丝印阻焊(SolderMaskPrinting),预烘(Pre-heating),七、阻焊(SolderMask),磨板(GrindingBoard),曝光(Exposure),显影(Developing),64,七、阻焊(SolderMask),65,七、阻焊(SolderMask),显影流程说明利用浓度1%的碳酸钠溶液，将未经过曝光部分的油墨予以除去，此时留在板面上为客户需要的阻焊层。阻焊层作为一种保护层，涂覆在印制板不需要焊接的线路和基材上，防止焊接时线路间产生桥接，同时提供永久性的电气环境和抗化学保护层，另外也起到美化外观的作用。,66,对位(Registration),丝印阻焊(SolderMaskPrinting),预烘(Pre-heating),七、阻焊(SolderMask),磨板(GrindingBoard),曝光(Exposure),显影(Developing),QC检查(QCInspection),67,七、阻焊(SolderMask),68,七、阻焊(SolderMask),字符流程说明利用丝网印刷或者文字喷印机在板面上印出白、黄或黑色字符标记，为元件安装和今后维修提供帮助。,69,对位(Registration),丝印阻焊(SolderMaskPrinting),预烘(Pre-heating),七、阻焊(SolderMask),磨板(GrindingBoard),曝光(Exposure),显影(Developing),QC检查(QCInspection),丝网印刷(SilkScreenPrinting),文字打印(LegendPrinting),后固化(Curing),70,喷锡(HotAirLeveling),八、喷锡(HotAIRLeveling),磨板(HALPre-treating),预涂助焊剂(CoatingSolder),71,八、喷锡(HotAIRLeveling),SN,72,八、喷锡(HotAIRLeveling),喷锡流程说明印制板上浸上助焊剂，随后在熔融焊料里浸涂，然后从两片风刀之间通过，用风刀中的热压缩空气把印制板上多余焊料吹掉，同时排除金属孔内的多余焊料从而得到一个光亮、平整均匀的焊料涂层。,73,喷锡(HotAirLeveling),八、喷锡(HotAIRLeveling),磨板(HALPre-treating),预涂助焊剂(CoatingSolder),