PCB缺陷英语汇总

1、开路open circuit2短路short circuit线路狗牙circuit wist3线路缺口circuit nick4线路凹痕circuit dent5渗镀plating bloody6焊盘缺口pad nick7内层白斑i/l white spot8黑化不良poor b.o9爆板measling10粉红圈pinking ring11层压起泡press blister12错位misregistation13偏位shift14孔内无铜no cu on pth15孔内毛刺hole burrs16npth有铜cu on npth17铜面露基材exposed laminate18铜面凹痕den

2、t on cu surface19胶渍gum residue20夹膜d/f nip21蚀刻不尽under etching22线幼line too thin23孔大hole oversize24孔小hole undersize25偏孔hole misregistration26铜面瘤粒cu nodule27显影不尽under developing28铜面刮伤scratch on cu surface29塞孔hole plugged30修理不良poor repairing31 铜薄copper too thin32内层擦花i/l scratch33内层偏位i/l misregistation34内

3、层杂物i/l inclusions35掉膜film off36干膜碎d/f meaking37退锡不尽poor sn stripping38间隙小space too marrow39板薄board too thin40板厚board too thickness41针孔pinhole42崩孔breakout43侧蚀undrcut44镀层粗糙plating layer roughness45亚色dull colour46焊 盘 翘 起lifted land47漏 钻 孔missing hole48露 布 纹weave exposure49钻 偏 孔hole misregistratiion50孔

4、损 害hole damage51基 材 分 层delamination52蚀 刻 过 度over etching53多 孔hole too much54残 铜remain cu55孔 内 露 基材 laminate exposure in hole56焊 盘 脱 落pad break off57焊 盘 凹 痕pad dent58焊 盘 凸 起pad bulge59焊 盘 损 坏pad damaged60焊 盘 缺 口pad nick61焊 盘 露 铜pad expose cu1 板面凹痕dent2 内层白斑i/l white spot3线路缺口circuit nick4蚀刻不净undering

5、 etching5绿油剥离s/m peel off6显影不净under developing7基 材 白 点laminate measling8铜面氧化copper oxide9绿油上焊盘s/m on pad10白字上焊盘c/m on pad11阻焊不良poor s/m12 线路擦花track scratch13锡上线sn on circuit14聚锡sn mass15锡灰sn gray16焊盘露铜cu exposed on pad17锡上金手指sn on g/f18金手指凹痕g/f dent19金手指擦花g/f scratch20金手指粗糙g/f roughness21v-cut 不良poo

6、r v-cut22倒边不良poor milling23针床压伤et dent24拖锡不良poor touch up25补金不良poor repairing au26补油不良poor repairing s/m27针孔pinhole28胶渍paster stain29k 孔内毛刺burrs in hole30锡珠入孔solder in hole31露铜expose cu32露镍expose ni33 绿油起泡solder mask blister34绿油起皱solder mask winbles35金手指氧化g/f oxiding36金颜色不良au discoloration37金面凸起au surface blister38绿油入孔solder mask i