单面板詏计与制程能力规范

1、MP敬鵬（蘇州）電子有限公司F I F C T 0 H I C IACP. ELECTRONICS CO., LTD.單面板設計與製程能力規範DESIGN REQUIREMENT OF SINGLE SIDED BOARD AND THE PROCESS CAPABILIT YACP. ELECTRONICS CO., LTD.一、制訂目的（PURPOSE為使本公司之單面板、一般雙面板設計及製程能力品質管理有所依循，故訂定本規章。TO SPECIFY THE DESIGN REQUIREMENT OF SINGLE SIDE AND DOUBLE SIDE WITH NON-PTHBOARDS

2、. THE PROCESS CAPABILITY IS COVERED AS WELL.二、適用範圍（SCOP）凡與本公司各製程相關規格及規定等，均屬之。SINGLE-SIDE BOARDS DOUBLE-SIDED NON-PTH BOARDS AND THE RELATED PROCESSES三、內容（CONTENTETCHING RESIST PRINTING1.1銅箔導體寬度Min :0.18mm。Min. LINE WIDTH : 0.181.2銅箔導體間距Min :0.2m。Min. LINE SPACING: 0.2 m。1.3銅箔導體距板邊Min :0.3mm。Min. EDG

3、E TO CONDUCTOR.3 m。1.4銅箔導體距沖孔邊Min :0.3m。Min. CLEARANCE TO HOLES0.3 m。1.5銅導體最大面積UL規定Max:2 0m。MAX. UNPIERCED ARE/20 m。ACP. ELECTRONICS CO., LTD.1.6線路印刷尺寸精度：0 .10伽。REGISTRATION PRECISIONS 0.10 伽。1.7 GROUN設計距線路使用S/MSOLDER RESIS銅箔厚度THE THICKNESSOF COPPERrUV防焊油墨UV SOLDER-RESISTIR防焊油墨IR SOLDER-RESIST3 5 ym

4、Min0.30 mmMin 0.35 m7 0 ymMin 0.45 mMin 0.45 mTHE DISTANCE OF GROUND WITH CONDUCTOR設計方式DESIGN規格SPECIFICATION1.排孔（沖床）Min0.30m2. 一般設計（沖床）NORMAL DESIGN熱沖板：Min0.40mPAPER PHENOLICmin 0.40 m冷沖板：Min0.35mCEM-1 CEM-3： min 0.35 m3.NC鑽孔WITH NC DRILLING HOLE正面銅 PAD：Min0.20m背面銅 PAD：Min0.30m1.8 最小焊圈MIN. ANNULAR R

5、ING耳 HOLE丿RPADACP. ELECTRONICS CO., LTD.1.9線路突出與線路缺口VARIANCE OF LINE WIDTH AND THE SPACING1.9.1 線路突出:Lv 2A , W 20%D W 0.13 mmVARIANCE OF THE SPACING1.9.2 線路缺口： Lv 2A , W 20%A W 0.13 mVARIANCE OF LINE WIDTH1.10雙面線路印刷正背導準確度 Max:0.13伽（.0 0 5 “）。REGISTRATION BETWEEN BOTH SIDEix 0.13.005 “）。2、防焊印刷JSOLDER

6、 RESIST 2.1防焊圈大於PAD之最小距離（m）CLEARANCE TO CONDUCTOR銅箔厚度THETHICKNESOFCOPPEUV防焊:R UV SOLDER RESISTIR防焊IR SOLDER RESIST3 5 ymMin 0.15mmMin0.20m7 0 y mMin0.25mMin0.30mACP. ELECTRONICS CO., LTD.2.2防焊油墨印刷厚度Min:10 ymTHICKNESS Min 10 y m2.3防焊印刷準確度：土 0.15伽。REGISTRATION 0.15 伽。2.4防焊隔線最小寬度Mi n. SOLDER RESIST LIN

7、E WIDTH BETWEEN CONDUCTORS銅箔厚度THE THICKNESS OF COPPER隔線最小寬度Min .LINE WIDTH3 5 y mMin0.2m7 0 y mMin0.3m2.5防焊隔線導體間距GAP BETWEEN CONDUCTORS銅箔厚度THE THICKNESS OF COP導體最小間距PERMi n. GAP REQUIREMENT3 5 y mMin0.5m7 0 y mMin0.6m2.6大銅箔內孔之防焊圈尺寸：Mi n0.5mmGROUND IS 0.5mm.1 GroundA :S/M圈B :HOLERTHE MINIMUM REQUIREM

8、ENT OF THE RING BETWEEN SOLDER RESIST AND HOLE IfACP. ELECTRONICS CO., LTD._3、文字印刷LEGEND & MARKING3.1 字體寬度Min :0.2mm。Min WIDTH 0.2 m。3.2顏色：黑色、白色、藍色、綠色。COLOR BLACK WHITE BLUE AND GREEN4、其它印刷工程|及電鍍OTHER PRINTING AND PLATING4.1可剝膠膜厚度：0.2mm0 .35m。THICKNESS OF PEELABLE SOLDER RESIST m0.35 m。4.2噴錫厚度：1.3 y

9、m50 ym。THICKNESS OF HOT AIR LEVELING1.3 y m50 y m。4.3鍍金厚度：1. 一般規格：0.025 y m(1 y inch )0 .075 y m(3 y inch )。 NORMAL SPEC.0.025 y m( 1 y inch )0.075 y m( 3 y inch )。2. 特殊規格：0 .0 2 5 y m(1 y inch )0 .500 y m(20 y inch )。SPECIAL SPEC:. 0.025 y m (1 y inch )0.500 y m (20 y inch )。5、開模及沖床|工程PUNCHING TOOL

10、 AND PUNCHING PROCESS5.1外型成形最小尺寸：12 0mX12 0m。MIN. SIZE OF THE BOARD 120 mX 120 m。ACP. ELECTRONICS CO., LTD.5.2外型尺寸公差：0.1伽。OUT-LINE DIMENSION TOLERANCE OF THE BOARD.1 mm。5.3圓孔最小孔徑（m）MIN HOLE DIAMETERS）厚度 THICKNESS FR-1/FR-2CEM-1CEM3FR40.8m0.600.600.700.801.0mm0.600.700.750.801.2m0.650.750.80NC1.6m0.6

11、50.800.90NC2.0m0.901.001.10NC5.4方形孔最小尺寸（mm）MIN SIZE OF THE SLOT材質MAL紙板FR-1、FR-2CEM-1CEM-3尺寸SIZE0.7X1.5m0.8X1.5m0.9X1.5m5.5孔徑公差（m）TOLERANCE OF NORMAL HOLE5.5.1 一般孔TOLERANCE OF NORMAL HOLE DIAMETERACP. ELECTRONICS CO., LTD.項目ITEM一般孔之孔徑公差TOLERANCE OF HOLE DIAMETER圓孔HOLE0.05方孔0.10SLOTS5.5.2機構孔TOLERANCE

12、OF TOOLING HOLE DIAMETER材質MAL公差 TOLERANCE冷沖板CEM-1 CEM-3+ 0.05mm / 0 或+ 0m / 0.05m熱沖板PAPER PHENOLIC+ 0.03mm / 0.05m 或+ 0.05m / 0.03 mm5.6孔位公差（mm）TOLERANCE OF HOLE LOCATION5.6.1 一般孔TOLERANCE OF NORMAL HOLE LOCATION項目一般孔之孔位公差ITEMTOLERANCE OF HOLE LOCATION冷沖COMPOSITE MTMin.0.08m熱沖PAPER PHENOLICMin.0.10m

13、5.6.2機構孔TOLERANCE OF TOOLING HOLE LOCATIONACP. ELECTRONICS CO., LTD.項目一般孔之孔位公差ITEMTOLERANCE OF HOLE LOCATION冷沖COMPOSITE MATMin.0.05m熱沖PAPER PHENOLICMin.0.08m5.7 a）光學點與沖孔準確度範圍土_0.15伽。TOLERANCE TO THE HOLE LOCATION OF FIDUCIAL MRK5 mm。b）光學點與外型公差範圍土 0.20 m。TOLERANCE TO THE BOARD EDGE OF FIDUCIAL MARKO

14、m。5.8沖孔孔邊到孔邊最小尺寸（m）MIN. SPACING BETWEEN HOLE）最小間距厚度Min-GAPTHICKNESS紙板PAPER PHENOLICCEM-1CEM-3FR-4鉆孑LDRILLING0.8mm0.51.0mm0.51.2mm0.70.8NC0.51.6m0.81.0NC0.52.0m1.01.2NC0.5ACP. ELECTRONICS CO., LTD.5.9沖孔孔邊到板邊間距EDGE OF THE BOARD TO THE EDGE OF HOLMSJ THICKNESS OF THE SUBSTRATE板厚THE TH

15、ICKNESS OF THE BOARD沖孔孔邊到板邊間距THE CLEARANCE OF THE HOLEWITH THE EDGE OF THE BOARD1.6 mMin1.2m1.2 mMin1.0mV1.2mmMin 板厚5.10沖床板邊凹槽容許值：Max板厚5 0%。CHIP-OFF Max 50% OF THE THICKNESS5.11 PUSH-BACK1)開模PUNCHING PROCESS取小板厚要求MIN THK孔徑公差要求TOOL. OF HOLE LOCATIO模具套數N TOOLS REQUIRED1.2m三0.30m兩套 (2 SET)1.2m0.15m三套 （

16、3 SET）2）單片板邊與單片板邊間距Mi n:6伽。SUPPORTING SPACING BETWEEN CAVITIES Mimm。3）單片板邊至外形板邊距高度Mi n:8mm。WIDTH OF THE OUT-LINE SUPPORTING FRAMin. 8 m4）單片外形設計為方者易板彎，故須加透氣孔於轉角處，以防板彎DESIGN STRESS RELIEF SLOTS TO PREVENT WARPAGEACP. ELECTRONICS CO., LTD.6、V-CUT工程V-CUT PROCESS6.1刀具角度：30、45。ANGLE OF THE INCISION 30、45。

17、6.2不同材質之殘厚規格THE MATERIAL REMAINING SPECIFICATION板厚材質J0.81.01.21.6PAPER0.30 0.100.40 0.100.50 0.100.70 0.10CEM-10.30 0.100.40 0.100.50 0.100.80 0.10CEM-30.30 0.100.40 0.100.50 0.100.70 0.10F R-40.16 0.100.24 0.100.30 0.100.50 0.10除殘厚管制外，板厚1.6伽，V-CUT深度須三0.15伽板厚1.6伽，V-CUT深度須三0.20伽。If v-uct is implement

18、ed , in addition to controling the remaining board thick ness, v-cut depth must be followed as below:When board thick ness is =0.15mmWhe n board thick ness is 1.6 mm, v-cut depth must =0.20mm6.3 V-CUT尺寸公差及縮刀尺寸（mm）AFTEROVERLAP THE CUTTING EDGE TO REDUCE THE IMPACT OF THE SIZE ENLARGEMEN BREAKAGE）單片尺寸

19、公差TOL OF THE OUT-LINE DIM縮刀尺寸OVERLAP PROPOSAL0.150.3mm0.20.2mm0.3以上不縮OVER0.30ACP. ELECTRONICS CO., LTD.6.4 V-CUT單片尺寸公差 Min:0.3mm。SIZE ENLARGEMENT DUE TO THE ROUGHNESS OF THE BREAKAGE Min 6.5 V-CUT線距導體間距Min :0.5 伽SPACING TO CONDUCTORS:MM mm。 W W= 0.5 m6.6 V-CUT 到板邊公差：土 0.15mm。DIMENSIONAL PRECISION 0.

20、15 m。6.7 V-CUT跳刀必須預留鋸片旋轉空間：三15m。SLOT LENGTH FOR V-CUT SKIPPING 15 m。6.8 V-CUT距板邊尺寸Mi n:5m。EDGE OF BOARD TO V-CUT Min5 m。S ACP. ELECTRONICS CO., LTD.6.9 V-CUT加工尺寸：50450伽。PANEL SIZE : 50450mm。度30 (即 0 =15 )45 (即 0 =22.5)槽寬V-CUT槽寬V-CUT槽寬(即 2W)(即 2W)深度D 上限下限上限下限80.210.110.330.170.

21、40.130.370.210.280.260.150.400.230.300.270.160.410.250.350.300.190.460.290.400.320.210.500.330.450.350.240.540.370.500.380.270.580.410.550.400.290.620.46若該刀為跳刀，則規格為上述相對應值，再加上備註0.05 m。IF THE CUTTING LINE IS SKIPPING-CUT, THESPEC. MUST BE ADD 0.0 IN THE ABOVE LIST.6.10 V-CUT 溝

22、槽寬度(THE WIDTH OF V-CUT SCORE LINE)6.11 V-CUT上下刀準確度：0 .15 mmX : 50450mmY : 50450mm圖1.V-CUT切槽示意圖THE ACCURACY OF UPPER AND BELOW CUT-LIE0.15 m6.12 V-CUT方向與板邊應平行。THE EDGE OF DIRECTION IS PARALLEL WITH V-CUT LINE.ACP. ELECTRONICS CO., LTD.7、carbon 工程7.1、碳墨跳線暨按鍵流程PROCESSING OF PCB WITH CARBON OR SILVER JU

23、MPERS線路印刷PATTERN PRINTING AND ETCHING下層絕緣印刷(一)UNDERCOAT PRINTING (first time)防焊印刷SOLDER MASK PRINTING下層絕緣印刷(二)UNDERCOAT PRINTING(seco nd time)I文字印刷LEGEND PRINTING表面清洗SURFACE CLEANING碳墨印刷CARBON PRINTING熱烘烤BAKINGCARBON CONDUCTOR TESTINGACP. ELECTRONICS CO., LTD.UNDERCOATCARBON7.3、碳墨印刷設計基準THEDESIGN SPE

24、CIFICATION OFCARBON PRINTING7.3.1碳墨按鍵導體寬度WIDTH OF CARBON KEY SWITCHA. 碳墨導線下有銅箔：寬度大於等於0.60伽WITH COPPER UNDER CARB0W.60 伽B. 碳墨導線下無銅箔：寬度大於等於0.5伽WWWWITHOUT COPPER UNDER CARSl5 mmACP. ELECTRONICS CO., LTD.THE CONFIGURATION FIGURE OF CARBON ONDUCTOR, KEY SWITCH CONDUCTOR OVERCOAT7.3.2碳墨按鍵導線寬度與銅箔導體寬度關係尺寸RE

25、LATIVE SIZE FOR CARBON KEY SWITCH AND COPPER CONDUCTORD.銅箔導體寬度最小 0.2 m (WIDTH OF COPPER KEY SWITCH 0.20 m)f4*CCCB A MIN. 0.60 mC&D RING MIN. 0.25 mACP. ELECTRONICS CO., LTD.A.銅箔 PAD(COPPER PAD)B. 碳墨接點(CARBON CONTACT POINT)C. 碳墨按鍵導線寬度最小 0.60 伽(WIDTH OF COPPER KEY SWITCH 0.60 mm)7.3.3碳墨導線,按鍵間距關係尺寸GAP

26、BETWEEN THE CARBON CONDUCTORA : MIN. 0.40 mB : MIN. 0.50 m7.3.4碳墨與其他線路關係尺寸GAP BETWEEN THE CARBON CONDUCTOR AND COPPER CONDUCTORS= 0.4 mmACP. ELECTRONICS CO., LTD.735碳墨與其它銅PADS係尺寸GAP BETWEEN THE CARBON CONDUCTOR AND COPPER PADSS: = 0.4 mmSOLDERCOPPER7.3.6碳墨接點銅PA页防焊圈關係尺寸RELATIVE5IZE FORCOPPEPADOFTHECA

27、RBONOINTECPOINTANDSOLDEIRESISTANNULAR RING防焊圈大於銅PAD 0.3 mSOLDER RESIST RING COPPER PAD0.3 mACP. ELECTRONICS CO., LTD.737上下絕緣層與跳線關係尺寸BA A B 三 1.0 mmWIDTH OF UNDERCOAT AND OVERCOATOVER/UNDER COATCARBON CONDUCTOR7.3.8上下絕緣層如圖下之形狀者,製作成如下圖IF OVER/UNDER COATS ARE TO BE AS FIG. A, IT MUST BE COMBINED ：S三 1.

28、2 m7.3.9碳墨必須與銅箔重疊1.2 mm以上ON THE CONJUNCTION, THE OVERLAP MUST BE MORE THAN 1.2 C7. 4、碳墨產品信賴性試驗MP敬鵬(蘇州)電子有限公司F I F C T 0 M I C SACP. ELECTRONICS CO., LTD.試驗項目TEST ITEM試驗條件TEST CONDITION規格SPECIFICATION耐濕性試驗HUMIDITY RESISTANCTEST(60 2) CX 95%R.H. XE (500 12) hrs測試後電阻值變化率小於50%VARIATION OF RESISTANCE LTH

29、AN 50%耐熱特性試驗HEATRESISTANCEEST(100 2) CX (500 12) hrs測試後電阻值變化率小於50%VARIATION OF RESISTANCE LTHAN 50%耐冷熱循環特性實驗HEAT CYCLING TEST(-40 CX 30 mi ns) +(100 C 2C) X 30 mins X 10 cycles測試後電阻值變化率小於50%VARIATION OF RESISTANCE LTHAN 50%四焊錫性試驗SOLDER DIPPING TES(260 5) CX 10secs；X 3 times測試後電阻值變化率小於50%VARIATION OF

30、 RESISTANCE LTHAN 50%五熱迴流特性試驗HEAT REFLOW TEST如試驗第6.5項圖示。AS SHOWN ON PAGEITEM 6.5。測試後電阻值變化率小於50%VARIATION OF RESISTANCE LTHAN 50%六剝離強度試驗PEEL STRENGTH TES3M TAPX 50mmT測試後碳墨不得剝離NO PEEL-OFF CARBON ISPERMITTEDTHE RELIABILITY TEST OF CARBON PRODUCTESSESSESSESSESSACP. ELECTRONICS CO., LTD.試驗項目TEST ITEM試驗條件

31、TEST CONDITION規格SPECIFICATION七彎曲試驗BENDING TESTBENDING 3mX10times測試後電阻值變化率小於50%VARIATION OF RESISTANCE LTHAN 50%八落下試驗DROP TESTCONCRETE FLOOR1MH.X 10 TIMES測試後電阻值變化率小於50%VARIATION OF RESISTANCE LTHAN 50%九耐溶劑試驗ANTI-SOLVENT TESTACETONX10mi ns測試後電阻值變化率小於50%VARIATION OF RESISTANCE LTHAN 50%十碳墨耐撞擊壽命CARBON T

32、OUCH LIFETEST(450 + 50) g/ cm2X2hits/sec X 1500000hits測試後電阻值變化率小於50%VARIATION OF RESISTANCE LTHAN 50%ESSESSESSESS7. 5、電器特性ELECTRICAL PROPERTIES名稱(NAME)規格SPECIFICATION1、電阻值RESISTANCE45 Q / 2、絕緣電阻值INSULATION RESISTANCE 100 MQ (DC 40V)3、額定電壓RATED VOLTAGEUNDER(DC 12 V)7. 6、碳墨印刷試驗項目與方法ACP. ELECTRONICS CO

33、., LTD.SPECIFICATION OF TESTING METHODS AND ITEMS FOR PCB WITH CARBON PRINTING7.6.1 耐溼度特性試驗(HUMIDITY RESIST TEST)PRIORTORESISTANCEESTING THESPECIMEISHALLBE PROCESSED? FOLLOWING PROCEDURE.1) (60 2C, 9095% R.H.) X (500 12) HRS.2) DESCATOR (4 2) C X (60 15) MINS.3) ROOM TEMP.X 30 MINS.VARIANCE OF RESIS

34、TANCE ON CARBON JUMPER MUST BE LESTHDA%7.6.2 耐熱特性試驗(HEAT RESIST TEST)PRIORTORESISTANCTESTING THESPECIMENHALLBEPROCESSEEFOLLOWING PROCEDURE.1) STORE IN A CHAMBER WITH (102) C X (500 12) HRS.2) COOLING AT ROOM TEMP. FOR (615) MINS.VARIANCE OF RESISTANCE ON CARBON JUMPER MUST BE LESTHA%7.6.3冷熱循環特性試驗(HE

35、AT CYCLE TEST)PRIORTORESISTANCTESTING THESPECIMENHALLBEPROCESSEEFOLLOWING PROCEDURE.1) A CYCLE OF (-40 3) C X 30 MINS + (100 2) C X 30 MINS FOR 10 TIMES.2) PUT IN ROOM TEMP. FOR (60 15) MINS.VARIANCE OF RESISTANCE ON CARBON JUMPER MUST BE LEST50A%7.6.4 焊錫性試驗(SOLDER DIPPING)PRIORTORESISTANCTESTING TH

36、ESPECIMESHALLBEPROCESSESFOLLOWING PROCEDURE.1) A CYCLEDF WAVEJOLDERINGT (260 5) C FOR 10 SECS+ ROOMTEMP.30 MINS FOR 3 TIMES.ACP. ELECTRONICS CO., LTD.2) PUT IN ROOM TEMP. FOR (60土 15) MINS.VARIANCE OF RESISTANCE ON CARBON JUMPER MUST BE LEST50AN7.6.5 預熱迴流試驗(RESISTANCE VARIANCE AGAINST HEAT REFLOW TE

37、ST) PRIORTORESISTANCTESTING THESPECIMENHALLBEPROCESSEISFOLLOWING PROCEDURE.1) AS SHOWN THEFOLLOWINGGURE THETEMP.STARTSAT ROOIMEMP, RISESTO (150 10) C AND STAYS AT THE TEMPERATURE FOR 80 SECS.2) HEATING TO 24C MAX. AT A STATED FREQUENCY. STAY AT THE TEMP. FOR 10 SECS MAX.3) COOLING TO ROOM TEMP. AT A STATED FREQUENCY.4) THE TOTAL TESTING TIME SHALL BE LESS THAN 180 SECS.VARIANCE OF RESISTANCE ON CARBON JUMPER MUST BE LEST50AH (C )4240150080 SECS10 SECLING STRENGTH)ROOM TEMP7.6.6剝離強度試驗(PEEA P