FPC专业词汇中英文对照

1、FPC名词中英对照1.目的通过对行业标准的FPC工程名词引用及我司标准的整合，旨在为我司FPC名词的中英用语实现使用上的统一化2.适用范围规范FPC相关工程上出现之不良项目，生产使用之材料、设备、治具以及可靠性试验等中英文名3.定义类别一：FPC不良项目名词工程类别不良名称中文英文导线VisualInspection of Con ductors导线Con ductors开路Open短路Short缺口Nicks针孔Pin holes额外铜刺Extra neous Copper Betwee n Con ductors毛刺Sp urs结瘤Nodules蚀刻凹痕Etched Con cave导线分

2、层Con ductor Delam in ati on裂纹Cracks导线划痕Scratches on Con ductor凹坑Dents变色Discolorati on基底薄膜VisualInspection of Base Film凹坑Den ts划痕Scratches on Base Film覆盖层和覆盖涂层VisualInspection of Coverlay and Covercoat凹坑Dents on Coverlay and Covercoat划痕Scratches on Coverlay and Covercoat空洞Void偏位Coverlay Misalig n毛刺Co

3、verlay Burrs外来物导电性异物Con ductive Foreig n MattersForeig n Matters非电性异物Non-con ductive Foreig n Matters起泡和分层Blisteri ng and Delam in ati on覆盖层粘结剂挤出Squeeze-out of Adhesive of Coverlay覆盖涂层渗出Ooze-out of Covercoat覆盖涂层跳漏Skipping of Con vercoat电镀金属或焊锡的 表面条件SurfaceCon diti on ofP lated Men tai and Solder镀金Go

4、ld Plati ng镀金层缺陷Gold Plat ing Defects镀锡Tin Plat ing电镀金属或焊料的渗透Pen etratio n of P lated Metal or Solder变暗（变黑）Darke ned App eara nee (Blacke ningDiscolorati on)镀铜孔内镀层空洞Plat ing Voids in P lated-though Hole镀金粗糙Rough Gold镀金白雾Gold Discolorati on镀金变色Gold Discolorati on镀金层龟裂Gold Crack镀金针孔Gold Pin hole电镀露铜P

5、lated Expose Wetti ng剥离P lated P eeled Off电镀渗入P lated Wicki ng漏镀No Plat ing表面伤痕PI at ing Scratch电镀粗糙Rough P lated药水渗入Wicki ng外形和孔边缘VisualInspection of Edges of Outli ne and Holes撕裂和缺口Tears and Nicks毛刺Burrs丝状毛刺Thready Burrs弯曲、变形Warp age微连筋不良Poor Micro-jo int外形偏移Outli ne Misalig n外形漏冲No Outli ne反折偏位Be

6、nding Line Misalig n增强板VisualImp erfectio ns Related to Stiffe ner BondingFPC与增强板之间 的外来物Foreign Matter Between Flexible Printed Board and Stiffe nerFPC与增强板之间 的空洞Voids Betwee n Flexible Prin ted Board and Stiffe ner裂纹Cracks缺角Chi p-off划痕Scratches变形Deformati on表面附着物AffixedSubsta nces on增强板贴偏移Stiffe ner

7、 Misalig n热固胶Thermosett ing Adhesive焊剂残渣Flux Residues金属粉末残渣Residue of Metal Po wdersthe Surface粘结剂残渣Residue of Adhesive突起Protrusi ons凹坑Dents弓曲Bow扭曲Twist标1记 Marking尺寸检验Dime nsional Inspections尺寸测量Measureme nt of Dime nsions外部尺寸Exter nal Dime nsions厚度Thick ness孔Holes元件孔Component Holes导通孔Via Holes导通孔偏移

8、Via Hole Misalig n安装孔Moun ti ng Holes导线宽度Co nductor Widths导线之间的间距Cleara nces Betwee n Con ductors孔中心间距Dista nee Betwee n Hole Cen ters板边和导线之间的 最小距离Minimum Dista nee Betwee n Board Edges and Con ductors标记错误Wrong Marking字符不清晰Un clear Letter定位精度Po siti onalAccuracy孔的定位精度Po siti onal Accuracy of Holes孔与

9、焊盘的重合性Registrati on of Hole to Land覆盖层与焊盘的重合性Registrati on of Coverlay (or Covercoat) to Land增强板与FPC的重 合性Registratio n ofStiffe ner to FPC孔的重合性Registratio n of Holes外形的重合性Registratio n of Outl ines冲外形与导线图形 的重合性Registratio n of Pun ched Outl ine to Con ductor P atterns压敏胶或热固胶与FPC和增强板的重 合性Registratio

10、n of P ressure Sen sitive or Heat Activated Adhesives to FPC and Stiffe ner镀通孔的镀铜层厚 度PI ati ng Thick ness of Copper Pan ted-through Holes其它Other短装Shortage混装Mixed Stowage/Pack ing离型纸脱落Released Paper P eeled off材料错误Wrong Material类别二：PFC工程用语工程类别中文英文板Board Type单面板Sin gle Sided Flex Circuits单面双接触Double A

11、ccess or Back-bared Flex Circuits双面板Double Sided Flex Circuits软硬结合板Rigid-flex Circuits模具Die模具图纸Die Drawi ng量产模具Mass P roductio n Die样品模具P rototy pe Die钢模Steel Die刀模Die上模Top Die下模Bottom Die线切割Wire Cut外形模具Outli ne Cut保护膜模具Coverlay Die胶纸模具P ressure Sen sitive Adhesive Die补强模具Stiffe ner Die银浆模具Silver Di

12、e导柱P ost冲头Punch分割刀模Cutti ng Steel Rule Die销钉Pin治具Jig( Fixture)贴合治具Lam in ati on Jig电测治具Electrical Check Jig假贴治具Tack ing Jig曝光治具Expo sure Jig丝印网框Scree n Printing Frame孔Hole曝光定位孔Guide Hole for Exp osure模具定位孔Guide Hole for Die假贴定位孔Guide Hole for Tack ing贴合定位孔Guide Hole for Adhesive电测定位孔Guide Hole for E

13、lectrical Test丝印定位孔Guide Hole for Scree n Prin ti ng孔环Lifted Land渗锡孔Sta nnize Hole装配孔Fitti ng Hole制程Manu factureP rocedure下料Material Prep arati on钻孔Drilli ng镀铜Copper PI at ing化学铜leEletcroless Plati ng Copper贴干膜Sen sitive Dry Film丝印阻焊油墨Liquid Photose nsitive Soldermask曝光Expo sure显影Devel oping蚀刻Etchi

14、ng脱膜Stri pping贴保护膜Tack ing Coverlay粗化Abrade层压Lam in ati on原材料Material固化（烘烤）Curi ng黑孔Black Hole表面处理Surface Treatme nt循环水洗Cascade Rinse微蚀Micro-etch酸洗Acid Clea ning水洗Water Clea ning防锈处理An ti-corrosio n Treatme nt前处理P re-treatme nt刷板Brush ing干燥Dry up电镀（金、锡、 镍）(Gold、Solder、Nickel) Plating闪镀(Gold ) Flash

15、Plat in g/Strike Plat ing局部电镀P attern P late化学镍金Immersio n Gold有机保焊膜Orga nic Solderability Preservatives (OS P)丝印字符Prin ti ng of Lege nd贴补强板Back Board Lam in ati on电性能测试Electrical Inspection贴胶纸Double Faced Adhesive Tape打孔Punching雷射切割Laser Cut自动光学检验Automatic Op tical Insp ecti on(AOI)表面贴装Surface Mou

16、nting Techn ology( SMT外形冲切Punching冲孔Punching外观检查Final Insp ecti on目视检查Visual Insp ecti on(Final Inspection)线路显微镜检 验（镜检）Con ductor Microsc ope Insp ecti on性能测试Reliability Test包装Pack ing铜箔Copper Foil (CU)电解铜Electro-de posited Copper Foil (ED)压延铜Rolled Ann ealed Copper Foil (RA)保护膜Coverlay (CVL)基材Base

17、Material挠性覆铜板Flexible Copper Clad Lami nate (FCCL)无胶基材Adhesiveless FCCL粘接剂（胶）Adhesives (Ad)压克力Acrylic顶层补强Top Stiffe ner底层补强Bottom Stiffe ner顶层银浆膜Top Silver P aste底层银浆膜Bottom Silver P aste银浆油墨Sliver InkOthers顶层线路Top Circuits/C on ductors底层线路Bottom Circuits/C on ductors半固化片Bo nding Film (BOD)聚酰亚胺Po ly

18、imide( PI)1聚酯P olyester Film (P ET)钢片Sheet Steel玻璃纤维布Wove n Glass ClothFR4补强板Fiberboard液态感光油墨Liquid P hotoimageable Resist Ink压敏胶P ressure Sen sitive Adhesive( PSA离型膜Release Paper导电胶Con duct ing Resin导电布Electric Fabric泡棉Foam导向导电胶An isotro pic Con ductive Film( ACF导电泡棉Con ductive/Electric Foam屏蔽膜Shie

19、ld Film（金属）薄膜开 关Metal Dome ( DOME连接器Conn ector电容Cap acita nee ( C )电阻Resista nee ( R )集成电路In tegrated Circuit( IC)二极管Diode (D)静电Electro-Static Discharge( ESD机械方向Machi ne Direction( MD垂直方向Tran sverse Direct ion(TD进刀Feed进刀量Chip Load转速Sp eed焊接Solderi ng手工焊接Hand Solderi ng波焊Wave Solderi ng品质允收标准Acce pta

20、ble Quality Level( AQL)菲林Film字符Legend烘箱Ove n温度Temp erature湿度Humidity速度Sp eed压力P ressure喷淋压力Spo ut ing P ressure浓度Concen trati on原理图纸Schematic Diagram线宽Line Sp ace线距Line Width线路间距Pitch引用标准：IPC/JP CA-6202单、双面绕性印制板的性能手册类别三：FPC可靠性测试项目中文英文电气性能Testi ng of Electrical Performanee导线电阻Con ductor Resista nee表面层绝缘电阻Surface In sulati on Resista nee (SIR)表面介质层耐电压强度Dielectric Withsta nding Voltage of Surface Layers机械性能测试Testi ng of Mechanical Property剥离强度P eel Stre ngth孔