PCB基本英文培训教材.doc

1、中英制基本单位换算1 Ag=2.205 lb(磅)1 磅=0.454 Ag1英尺=12英寸1 OZ(盎司)=28.3527g1g=0.035270Z1 英寸 inch=1000 密尔 mil1 ft(英尺)=0.3048m1m=3.281ft1mil=1000u ”uin mil)1 码=0.914m1m=1.094 码1OZ=28.35克/平方英尺=35微米1 in(英寸)=25.4mm2 21mm=0.03937in2 21in=1000mil=25.4mm,1mil=25.4um1 m2=10.76 ft21 ft2=0.0929 m21ASD=1安培/平方分米=10.76安培/平方英尺

2、1磅力=4.4484牛顿1N=0.2248 磅力a1加仑美制=3.785升1psi=0.06895bar1bar=14.5psi=1.013Ag/cmT1bar=100000Pa1马力=0.746千瓦1 品脱=568 ml1oC=1.8 x oC+32 oF1 乍=(oF-32)/1.8 oC1 英尺=30.5 cm基本英文词汇1、流程Board cut开料Carbon printing碳油印刷Inner dry film内层干膜Peelable blue masA蓝胶Inner etchi ng内层蚀刻ENIG(ElectrolessnicAelimmersio n gold)沉镍金Inne

3、r dry film stripping内层干膜退膜HAL(hot air leveli ng)喷锡AOI ( Automatic Optical In spect ion)自动光学检测OSP ( Organic solderability preservative)有机保焊Press ing压板Punching啤板Drilli ng钻孔Profili ng外形加工Desmear除胶渣，去钻污E-Test电性测试PTH镀通孔，沉铜FQC(final quality control)最终检杳Panel plat ing整板电镀FQA(Fi nal quality audit)最终抽检Outer

4、dry film外层干膜PacAi ng包装Etch ing蚀刻IPQA(I n-process quality audit)流程QATin strippi ng退锡IPQC(I n-process quality con trol)流程QCEQC( QC after etching)蚀检QCIQC(lncoming quality control)来料检杳Solder masA感阻MRB(material review board)材料评审委员会Comp onent marA字符QA(Quality assura nee)品质保证Physical Laboratory物理实验室QC(Qual

5、ity con trol)品质控制Chemistry Laboratory化学实验室Docume nt con trol cen ter文件控制中心2nd Drilli ng二钻Rout ing锣板，铣板Brow n oxidati on棕化Waste water treatme nt污水处理V-cutV坑WIP ( worA in process)半成品Store/stocA仓库F.G( Fini shed goods)成品Useful Documents2、概述Prin ted Circuit Board印制电路板Flexible Prin ted Circuit, FPC软板Double

6、-Side Prin ted Board双面板IPC ( The Institute for In terc onnecting and PacA ing Electro nic Circuits)电子电路互连 与封装协会CPAR ( Corrective & Preve ntive Actio n Reques)要求纠正预防措 施Flammability Rate燃性等级Characteristic impeda nee特性阻抗BUM (Build-up multilayer)积层多层板Date Code周期代码CCL (Copper-clad laminate覆铜板Ionic con ta

7、m in ati on离子性污染Accepta nee Quality Level (AQL)允收水平HDI( Highden sityin terc onnecting)高密度互连板Base Material基材Radius半径Capacity生产能力Diameter直径Capability工艺能力PPM(Parts Per Millio n)百万分之几CAM( computer-aidedmanu facturi ng)计算机辅助制造Un derwritersLaboratoriesInc.美国保险商实 验所CAD (computer-aided desig n)计算机辅助设计Statis

8、tical Process Con trol统计过程控制Specificati on规格，规范Via导通孔Dime nsio n尺寸Buried /bli nd via埋/盲孔Tolera nee公差Tooli ng hole定位孔Ove n焗炉Output/throughput产量3、湿流程PTH ( plated through hole):镀通孔（俗称沉铜）Acid clea ning酸性除油PP(Pa nel Plati ng)；板电Acid dip酸洗Pattern plat ing图电Pre-dip预浸Line width线宽AlAali ne clea ning碱性除油Spaci

9、 ng:线隙Flux松香Deburri ng去毛刺（沉铜前磨板）Hot air leveli ng喷锡Carbon treatme nt碳处理SAip plati ng跳镀，漏镀TracA/c on ductor导线Un dercut侧蚀Aspect ratio:深径比Water rinsing水洗Etch Factor蚀刻因子Tran sportati on行车BacA Light Test:背光测试RacA挂架Pi nA ring粉红圈Maintenance保养4、干流程Hole locati on孔位Annu lar ring孔环Image Tran sfer图象转移Compo nent

10、 Side(C/S)元件面ArtworA底片Solder Side(S/S)焊接面Mylar胶片Matte Solder MasA哑绿油SilAscree n/lege nd/Comp onent MarA文字Hole breaAout破孔Fiducial marA基点，对光点Scrubb ing磨板Expose曝光Develop ing显影2Useful Docume nts5、内层制作Corematerial内层芯板Thermalpad散热PADPre-pregPP片Resincontent树脂含量AraftPaper牛皮纸Brow no xidati on棕化Layup排版BlacAOxidati on黑化Registrati on对位Basematerial板材Delam ination分层6、其它WicA ing灯芯效应Holesize孔径（尺寸）Yield良品率TouchUp修理Warpa ndTwist板曲度Solve ntTest溶剂测试Peel