SMT常用专业术语

1、SMT常用专业术语SMT: surface mounting tech no logy ;Al :Auto-Insertion自動插件AQL :acceptable quality level 允收水準ATE :automatic test equipment 自動測試ATM :atmosphere 氣壓BGA :ball grid array 球形矩陣CCD :charge coupled device監視連接元件（攝影機）CLCC :Ceramic leadless chip carrier 陶瓷引腳載具COB :chip-o n-board 晶片直接貼附在電路板上cps :centipo

2、ises（黏度單位）百分之一CSB :chip scale ball grid array 晶片尺寸 BGACSP :chip scale package 晶片尺寸構裝CTE :coefficient of thermal expansion 熱膨脹系數DIP :dual in-line package雙內線包裝（泛指手插元件）FPT :fine pitch tech no logy 微間距技術FR-4 :flame-retardant substrate玻璃纖維膠片（用來製作PCB材質）IC :integrate circuit 積體電路IR :infra-red 紅外線Kpa :kilop

3、ascals（壓力單位）LCC :leadless chip carrier引腳式晶片承載器MCM :multi-chip module 多層晶片模組MELF :metal electrode face 二極體MELF :metal electrode face Bonding Type:金屬電極無引腳端面元件MQFP :metalized QFP金屬四方扁平封裝NEPCON :National Electronic Package andProduction Conference國際電子包裝及生產會議PBGA :plastic ball grid array 塑膠球形矩陣PCB :print

4、ed circuit board 印刷電路板PFC :polymer flip chipPLCC :plastic leadless chip carrier塑膠式有引腳晶片承載器Polyurethane聚亞胺酯（刮刀材質）PPM :parts per million 指每百萬 PAD（點）有多少個不良 PAD（點）PSI :pounds/inch2 磅/英吋 2PWB :printed wiring board 電路板QFP :quad flat package四邊平坦圭寸裝SIP :single in-line packageSIR :surface in sulati on resist

5、a nee 絕緣阻抗SMC :Surface Mount Component 表面黏著元件SMD :Surface Mount Device 表面黏著元件SMEMA :Surface Mount EquipmentManufacturers Association表面黏著設備製造協會SMT :surface mou nt tech no logy 表面黏著技術SOIC :small outline integrated circuitSOJ :small out-line j-leaded packageSOP :small out-line package 小外型圭寸裝SOT :small

6、outline transistor 電晶體SPC :statistical process control 統計過程控制SSOP :shrink small outline package 收縮型小外形圭寸裝TAB :tape automaticed bonding 帶狀自動結合TCE :thermal coefficient of expansion 膨脹（因熱）係數Tg :glass transition temperature 玻璃轉換溫度THD :Through hole device須穿過洞之元件（貫穿孔）TQFP :tape quad flat package帶狀四方平坦圭寸裝U

7、V :ultraviolet 紫外線uBGA :micro BGA微小球型矩陣cBGA :ceramic BGA陶瓷球型矩陣PTH :Plated Thru Hole 導通孔IA Information Applianee 資訊家電產品MESH網目OXIDE氧化物FLUX助焊劑LGA （Land Grid Arry）圭寸裝技術LGA圭寸裝不需植球，適合輕薄短小產品 應用。TCP （Tape Carrier Package）ACF An isotropic Con ductive Film 異方性導電膠膜製程Solder mask 防焊漆Soldering Iron 烙鐵Solder balls

8、 錫球Solder Splash 錫渣Solder Skips 漏焊Through hole 貫穿孑LTouch up 補焊Briding稿接（短路）Solder Wires 焊錫線Solder Bars 錫棒Resistor NetworksCapacitor NetworksHybrid IC:Resistor: RN , RK;Green Strength未固化強度（紅膠）Transter Pressure轉印壓力（印刷）Screen Printing刮刀式印刷Solder Powder 錫顆粒Wette ng ability 潤濕能力Viscosity 黏度Solderability

9、焊錫性Applicability 使用性Flip chip 覆晶Depaneling Machine組裝電路板切割機Solder Recovery System 錫料回收再使用系統Wire Welder主機板補線機X-Ray Multi-layer Inspection System X-Ray 孔偏檢查機BGA Open/Short X-Ray Inspection Machine BGA X-Ray 檢測機Prepreg Copper Foil Sheeter P.P.銅箔裁切機Flex Circuit Connections 軟性排線焊接機LCD Rework Station液晶顯示器修

10、護機Battery Electro Welder電池電極焊接機PCMCIA Card Welder PCMCIA卡連接器焊接Laser Diode半導體雷射Ion Lasers離子雷射Nd: YAG Laser石榴石雷射DPSS Lasers半導體激發固態雷射Ultrafast Laser System 超快雷射系統MLCC Equipment積層元件生產設備Green Tape Caster, Coater 薄帶成型機ISO Static Laminator積層元件均壓機Green Tape Cutter元件切割機Chip Terminator積層元件端銀機MLCC Tester積層電容測試

11、機MTBF: Mean Time between Failures;Components Vision Inspection System 晶片元件外觀檢查機High Voltage Burn-In Life Tester高壓恆溫恆濕壽命測試機Capacitor Life Test with Leakage Current 電容漏電流壽命測試機Taping Machine晶片打帶包裝機元件Surface Mounting Equipment 表面黏著設備Silver Electrode Coati ng Machi ne 電阻銀電極沾附機TFT-LCD（薄膜電晶體液晶顯示器）筆記型用STN-L

12、CD（中小尺寸超扭轉向液晶顯示器行動電話用PDA（個人數位助理器）CMP（化學機械研磨）製程研磨液（Slurry），Compact Flash Memory Card （簡稱 CF記憶卡）MP3、PDA、數位相機 Dataplay Disk（微光碟）。SPS交換式電源供應器（）EMS專業電子製造服務（），PCB高密度連結板（HDI board，指線寬/線距小於4/4 mil）微小孔板（Micro-v ia board)，孔徑5-6mil以下水溝效應(Puddle Effect):早期大面積鬆寬線 路之蝕刻銀貫孔(STH)銅貫孔(CTH)組裝電路板切割機 Depaneling MachineNO

13、NCFO無氟氯碳化合物。Support pin =支撐柱F.M.=光學點FC :SOL: Silic on-on-I nsulator;ENTEK裸銅板上塗一層化學藥劑使 PCB的pad比較不會生鏽QFD:品質機能展開PMT:產品成熟度測試ORT:持續性壽命測試FMEA:失效模式與效應分析TFT-LCD(薄膜電晶體液晶顯示器)(Liquid-Crystal Displays Addressed by Thin -Film Transistors)導線架(Lead Frame):單體導線架(Discrete Lead Frame )及積體線路導線 架(IC Lead Frame)二種ISP的全名是In ternet Service Provider，指的是網際網路服務提供ADSL即為非對稱數位用戶迴路數據機SOP: Standard Operation Procedure (標準操作手冊)DOE: Design Of Experiment (實驗計劃法Wire Bon di ng打線接合Tape Automated Bon di ng, TAB 捲帶式自動接合覆晶接合(Flip Chip)光電耦合器品質規範：JIS日本工業標準ISO國際認證M.S.D.S國際物質安全資料FLUX SIR加溼絕緣阻抗值1. RMA (Return Mater