MPM程序制作篇(共20页)

1、MPM程序制作教材MPM印刷机程序制作教材 黄岛SMT编制一使用SUPERVISOR模式或者MAINTENANCE模式，在Teach下拉菜单中选择Teach Board。 1.系统将会提示如下：About to begin TEACH operation (开始设定操作)Press SELECT to teach a new board or 点击SELECT,重新设定一个新板或Press NEXT to continue on this board setup 点击NEXT,继续当前基板的设定。点击SELECT之后，出现下列讯息窗口：CAUTION, The machine must mov

2、e toTEACH POSITION before teach can beginThe machine is now going to move.Press NEXT to Continue, or EXIT to Quit.CAUTION, The machine must move toTEACH POSITION before teach can beginThe machine is now going to move. Press NEXT to Continue, or EXIT to Quit. 警告,在做新程序之前机器必须将所有轴移动到设定位置，点击 NEXT机器按照指令移动

3、, 点击EXIT离开。2.选择Board Parameters 进入PCB参数设定Board Parameters基板(PCB)参数设定X size 228.600(PCB)基板X轴方向长度Y size 406.400(PCB)基板Y轴方向宽度Thickness 1.570(PCB)基板厚度PCB板Enter Board Dimensions into setup menu.Click on Y size to adjust Track Width.Press Done when finished.Y XEnter Board Dimensions into setup menu. (输入基板

4、X、Y、厚度)Click on Y size to adjust Track Width. (点取Y方向尺寸，可调整轨道宽度)Press Done when finished. (当你做完上述之步骤，按Done)点取X size，输入基板宽度X size，按EXIT完成输入，单位mm。例14.5cm = 145mm点取Y size输入基板宽度Y size，按EXIT之后出现如下讯息窗口：About to adjust the TRACK WIDTH for the board.Press NEXT to Continue, or EXIT to Quit.About to adjust the

5、 TRACK WIDTH for the board. (调整基板的轨道宽度)Press NEXT to Continue, or EXIT to Quit. (按NEXT继续, 按EXIT离开)按NEXT之后，出现下列讯息窗口：This is the current Track widthPress SELECT to fine adjust Press NEXT to acceptThis is the current Track width(这是目前的轨道宽度)Press SELECT to fine adjust (按SELECT微调轨道宽度)Press NEXT to accept(

6、按NEXT，接受目前的轨道宽度)如果，你按SELECT之后，出现下列讯息窗口：Jog ACTIVETRK WIDTH 126.136Press NEXT to quit(調整完後，按EXIT)Jog ACTIVE(这段讯息告诉你，用Jog方式去调整基板的轨道宽度)TRK WIDTH 126.136Press NEXT to quit(调整完后，按NEXT)点取Thickness，输入基板厚度。使用光标卡尺测量。Press Done when finished. (当你做完上述之步骤，按Done)Stencil Dimensions钢板尺寸设定参数Inner 660.400钢板尺寸Enter s

7、tencil inner dimensionPress Done when finished.Enter stencil inner dimension(输入内部钢板尺寸)Press Done when finished. (当你做完上述之步骤，按Done)3.选择Worknest 进入印刷工作平台参数设定Worknest Hardware Required:Board ,Tactile , Vacuum ChucksPlease remove the stencil.Squeegee will now move back.Press SELECT when ready.Please remo

8、ve the stencil. (请移开钢板)Squeegee will now move back. (刮刀组现在将移动到后面)Press SELECT when ready. (准备好后按SELECT)按NEXT之后，出现下列讯息：Now, adjust the vacuum rear and side platesIf you have a dedicated work holder, install it nowPress NEXT to Continue, or EXIT to Quit.Now, adjust the vacuum rear and side plates (现在请

9、调整后隔板和侧(左右)隔板)If you have a dedicated work holder, install it now (若有使用专用PCB板支撑架,请 现在把他装上)Press NEXT to Continue, or EXIT to Quit. (按NEXT继续, 按EXIT离开)按NEXT之后，出现下列讯息：The Z TOWER is about to loadto tooling heightPress NEXT to Continue, or EXIT to Quit.The Z TOWER is about to load (Z轴上升到tooling height的位

10、置)to tooling heightPress NEXT to Continue, or EXIT to Quit. (按NEXT继续, 按EXIT离开)你按NEXT之后，出现下列讯息：If you have X snuggers,adjust snugger pins now.Press NEXT to Continue, or EXIT to Quit.If you have X snuggers,adjust snugger pins now. (若有使用X方向夹板,请调整好)Press NEXT to Continue, or EXIT to Quit. (按NEXT继续, 按EXI

11、T离开)你按NEXT之后，出现下列讯息：CAUTION, The machine is now going toCenter itself for this size board. The Y AXIS is about to move forward.Press NEXT to Continue, or EXIT to Quit.CAUTION, The machine is now going to(注意,机器现在将移动到基板Center itself for this size board. 中心点)The Y AXIS is about to move forward. (Y轴即将移动

12、到前面(基板中心点)Press NEXT to Continue, or EXIT to Quit. (按NEXT继续, 按EXIT离开)Board Parameters基板(PCB)参数设定Detent12.7PCB停于中心印刷位置值Load speed 432进板轨道皮带转速值(数字越大,转速越快)Unload speed 381出板轨道皮带转速值(数字越大,转速越快)Enter board loading parameters.Click on detent field to test.Press Done when finished.Enter board loading parame

13、ters. (输入PCB进板参数)Click on detent field to test. (点取detent,测试PCB停于中心印刷位置值)Press Done when finished. (按Done完成全部动作)4.选择Teach Boardstops进入基板停止位置参数设定Teach BoardstopsHardware Required, Stencil , Tactile 4.1选择Teach Boardstops-Y进入基板Y方向板边停止位置参数设定Teaching Boardstop-YPlace a board on the input track.Press SELE

14、CT to Continue.Place a board on the input track. (请将PCB板放到轨道输入端)Press SELECT to Continue.(按SELECT 继续)你按SELECT之后，出现开始做板边窗口：Jog to the leading edge of the board.Stay 1/2 inch in from the rails. Press EXIT!Jog to the leading edge of the board. (请将十字光标移动到基板板边Stay 1/2 inch in from the rails. Press EXIT!

15、中间位置后,按EXIT离开)此动作最主要是让视觉系统内基板停止感应器,感应基板是否停止在印刷平台中心点位置 4.2选择Teach Boardstops-X进入PCB板停止到印刷平台中心点位置参数设定与PCB板和钢板对位Mark点)Teaching Boardstop-XIs the board centered correctly?Press SELECT to accept location.Press NEXT to-locate board.Press EXIT to abort process.Is the board centered correctly? (基板有无正确停止到印刷平

16、台中心点位置)Press SELECT to accept location. (按SELECT接受目前位置 )Press NEXT to-locate board. (按NEXT调整基板正确停止到印刷平台中心点位置)Press EXIT to abort process. (按EXIT 中止这一项步骤)你按NEXT之后，出现下列窗口：(将基板往前及往后送到印刷平台中心点位置)你按SELECT之后，出现下列讯息：Please insert a stencil. Press NEXT to continue!Please insert a stencil. (请放入钢板)Press NEXT t

17、o continue! (按NEXT继续)你按NEXT之后，出现下列讯息及窗口：Jog to any target on the board!Center the object. Press EXITJog to any target on the board! (请移动到基板上任一个对位Mark点)Center the object. Press EXIT(对正Mark中心点，按EXIT离开)你按EXIT之后，出现下列讯息及窗口：Jog to the same target on the stencil!Center the object. Press EXITJog to the same

18、 target on the stencil!(请移动到钢板上任一个对位Mark点Center the object. Press EXIT，对正Mark中心点，但必须与基板上Mark点一样,按EXIT离开) 但如果X轴方向,超过软件保护极限会出现下列讯息,可能需重做对位点。-Warning Message-X AXIS SOFTWARE LIMIT WARNING!Press NEXT to Continue.4.3选择Calc. Pre-Boardstops-X进入基板X方向停止位置参数设定Calc. Pre-Boardstop-XPre board stop position learn

19、edPress SELECT to continuePress Done when finished.Pre board stop position learned (机器自行计算基板停止位置)Press SELECT to continue(按SELECT 继续)Press Done when finished. (当你做完上述之步骤，按Done)5.选择Stencil进入测钢板高度参数设定StencilHardware Required:Board , Stencil , Tactile , Please install a stencil now. The FRAME CLAMPS wi

20、ll activate whenyou press NEXT. Press NEXT to Continue, or EXIT to Quit.Please install a stencil now. (请现在放入钢板)The FRAME CLAMPS will activate when (按NEXT后,激活锁住钢板)you press NEXT. Press NEXT to Continue, or EXIT to Quit. (按NEXT继续, 按EXIT离开)你按NEXT之后，出现下列讯息及窗口：The next step is to set STENCIL HEIGHT.Press

21、 NEXT to Continue, or EXIT to Quit.The next step is to set STENCIL HEIGHT. (然后进行测钢板高度)Press NEXT to Continue, or EXIT to Quit. (按NEXT继续, 按EXIT离开)你按NEXT之后，出现下列讯息及窗口：CAUTION, The machine is now going tomove. STAY CLEAR.Press NEXT to Continue, or EXIT to Quit.CAUTION, The machine is now going to(警告,机器现

22、在要移动,内部不能有move. STAY CLEAR.任何东西,需清除)Press NEXT to Continue, or EXIT to Quit. (按NEXT继续, 按EXIT离开)你按NEXT之后，出现下列讯息及窗口：Press SELECT to JOG the sensor clear ofpaste or stecil apertures,or Press NEXT to CONTINUE.Press SELECT or NEXT to Continue.Press SELECT to JOG the sensor clear of(按SELECT移动侦测感应器,勿paste

23、or stecil apertures,碰到钢板上锡膏及钢板上PAD孔)or Press NEXT to CONTINUE. (按NEXT马上开始在本位置侦测钢板高度)Press SELECT or NEXT to Continue. (按SELECT 或 NEXT继续)你按SELECT之后，出现下列讯息及窗口：JOG ACTIVESQUEEGEE STROKE -112.050Press EXIT to quit.JOG ACTIVE(移动现在刮刀行程位置)SQUEEGEE STROKE -112.050Press EXIT to quit. (按EXIT离开)你按NEXT与EXIT之后，出

24、现下列讯息及窗口：Locating the boardCAUTION：Auto height sensor in progress. Please wait (开始加载PCB,自动侦测钢板高度)Stencil height FOUND.Press NEXT to Continue.Stencil height FOUND. (完成侦测钢板高度)Press NEXT to Continue. (按NEXT继续下一步骤)6.选择Squeegee进入测刮刀高度与刮刀行程参数设定SqueegeeHardware Required:Squeegee Blades , Stencil , TactileT

25、his Utility will set the SQUEEGEE height.Press NEXT to Continue, or EXIT to quit.This Utility will set the SQUEEGEE height.(使用测刮刀高度)Press NEXT to Continue, or EXIT to quit. (按NEXT继续, 按EXIT离开)按NEXT之后，出现下列讯息窗口：Please install a stencil now.The REAME CLAMPS will activate when you press NEXT.Press NEXT t

26、o Continue, or EXIT to quit.Please install a stencil now. (现在请放入钢板)The REAME CLAMPS will activate when(按NEXT之后,激活钢板固定夹)you press NEXT. Press NEXT to Continue, or EXIT to quit. (按NEXT继续, 按EXIT离开)按NEXT之后，出现下列讯息窗口：You must now install the squeegee blade.Press NEXT to Continue, or EXIT to quit.You must

27、now install the squeegee blade. (你现在必须安装刮刀)Press NEXT to Continue, or EXIT to quit. (按NEXT继续, 按EXIT离开)按NEXT之后，出现下列讯息窗口：CAUTION, The machine is now going toMove the Z TOWER and cyclethe SQUEEGEE UP and DOWN.Press NEXT to Continue, or EXIT to Quit. CAUTION, The machine is now going to(注意,机器的Z轴和刮刀上下将Mo

28、ve the Z TOWER and cycle会移动)the SQUEEGEE UP and DOWN.Press NEXT to Continue, or EXIT to Quit. (按NEXT继续, 按EXIT离开)按NEXT之后，出现下列讯息窗口：Press SELECT to find Stencil Heightor NEXT to Bypass.Press NEXT to Continue, or EXIT to Quit. Press SELECT to find Stencil Height(按SELECT之后,再测一次钢板高度or NEXT to Bypass. 按NEX

29、T之后,不测钢板高度)Press NEXT to Continue, or EXIT to Quit. (按NEXT继续, 按EXIT离开)按NEXT之后，出现下列讯息窗口：Press SELECT to JOG the sensor clear ofpaste or stencil aperturesor press NEXT to CONTINUE.Press SELECT or NEXT to Continue. Press SELECT to JOG the sensor clear of(按SELECT移动侦测感应器,勿paste or stencil apertures碰到钢板上锡

30、膏及钢板上PAD孔)or press NEXT to CONTINUE. (按NEXT马上开始在本位置侦测刮刀高度)Press SELECT or NEXT to Continue. (按SELECT 或 NEXT继续)你按SELECT之后，出现下列讯息及窗口：JOG ACTIVESQUEEGEE STROKEPress EXIT to quit.JOG ACTIVE(移动现在刮刀行程位置)SQUEEGEE STROKE -112.050Press EXIT to quit. (按EXIT离开)你按NEXT与EXIT之后，出现下列讯息及窗口并开始测前后刮刀高度：Leveling front b

31、lade.Leveling rear blade.CAUTION：Auto height sensor in progress. Please wait (开始侦测刮刀高度。测前刮刀时,侦测感应器先下降碰到钢板后,前刮刀下降,第一次先压平刮刀,第二次自动侦测前刮刀高度;测后刮刀时, 侦测感应器先下降碰到钢板后,后刮刀下降,第一次先压平刮刀,第二次自动侦测后刮刀高度)7.测完刮刀高度后,开始设定刮刀行程 About to set SQUEEGEE STROKE.Press NEXT to Continue, or EXIT to quit.About to set SQUEEGEE STROKE

32、. (开始设定刮刀行程)Press NEXT to Continue, or EXIT to Quit. (按NEXT继续, 按EXIT离开)You must now jog to the Rear squeegee position. Press NEXT to Continue, or EXIT to quit.You must now jog to the Rear squeegee position. (你必须现在移动后刮刀位置)Press NEXT to Continue, or EXIT to quit. (按NEXT继续, 按EXIT离开)JOG ACTIVESQUEEGEE S

33、TROKE -0.050Press EXIT to quit.(开始移动刮刀行程,完毕按EXIT离开)You must now jog to the front squeegee position. Press NEXT to Continue, or EXIT to quit.You must now jog to the(你必须现在移动前刮刀位置)Rear squeegee position. Press NEXT to Continus, or EXIT to quit. (按NEXT继续, 按EXIT离开)JOG ACTIVESQUEEGEE STROKE -0.050Press EX

34、IT to quit.(开始移动刮刀行程,完毕按EXIT离开)8.选择Print Parameters进入印刷参数设定Print ParametersHardware Required:NoneSqueegee刮刀设定参数Total Force 5.4刮刀向下压力(刮刀长度X1.2)/2.2Down Stop 1.905刮刀碰到钢板后再向下压之距离Print Speed 25刮刀印刷行程之速度Enter squeegee printing parameters. (输入刮刀印刷参数)(this affects front AND rear squeegees) (包含前后刮刀)Press Do

35、ne when finished. (按Done完成)Board Parameters基板(PCB)参数设定Snap off 0.000PCB与钢板之间隙(数字越大,间隙越大)Tooling TypeUnier. Dedicat.治具不使用治具使用治具Enter Snapoff into setup menu. (输入PCB与钢板之间隙印刷参数)Set to zero for CONTACT printing. (接触式印刷时，请设为”0”)Press Done when finished. (按Done完成)Slow Snop off慢速脱模参数设定Enabled NoYes不使用慢速脱模使

36、用慢速脱模Down Delay 0.00脱离钢板前延迟时间Distance 1.570慢速脱模之距离Speed 123456慢速脱模速度1脱模速度 5mil/s2脱模速度 10mil/s3脱模速度 15mil/s4脱模速度 20mil/s5脱模速度 25mil/s6脱模速度 30mil/sEnter Slow snapoff parameters. (输入慢速脱模参数)Press Done when finished. (按Done完成)10.Teach Vision做一片PCB新程序的Mark点about to enter VISION TEACH operation.Press NEXT

37、to Continue, or EXIT to Quit. about to enter VISION TEACH operation. (即将进入视觉系统设定操作)Press NEXT to Continue, or EXIT to Quit. (按NEXT继续, 按EXIT离开)你按NEXT之后，出现下列讯息：Place a board on input track.Press NEXT to Continue, or EXIT to Quit. Place a board on input track. (请将基板放到轨道输入端)Press NEXT to Continue, or EX

38、IT to Quit. (按NEXT继续, 按EXIT离开)你按NEXT之后，出现下列讯息：Locating the boardADD or DELETE targets to change the(新增或删除,所指Mark点位置或变更目current vision layout.前Mark点位置) Press EXIT when you are FINISHED. (当你已完成Teach vision按EXIT)ADD增加一个Mark点DELETE删除一个Mark点VIEW辨视做完的PC板与钢板Mark点ZOOM IN将点选到位置放大与缩小你按ADD之后，出现下列讯息：Are you training synthetic fiducials?SELECT for YES, NEXT for NOAre you training synthe