铝基板制作流程

1、深入深入Thorough Thorough 專注專注Studious Studious 紮實紮實SteadySteady 精精緻緻化化ExquisiteExquisite競華電子競華電子( (深圳深圳) )有限公司有限公司A+PCB Electorics(Shen Zhen)Co.,LTD 鋁基板制作流程介紹鋁基板制作流程介紹 1深入深入Thorough Thorough 專注專注Studious Studious 紮實紮實SteadySteady 精精緻緻化化ExquisiteExquisite競華電子競華電子( (深圳深圳) )有限公司有限公司A+PCB Electorics(Shen Z

2、hen)Co.,LTD 一、鋁基板制程一、鋁基板制程 1 1、噴錫流程：、噴錫流程：來料檢查 一次沖/ 鑽孔圖形轉移圖形檢查蝕刻退膜蝕檢阻焊制作 打定位孔字符制作噴錫噴錫檢查單面磨板（依客戶要求而定） V-CUT/成型通斷測試高壓測試FQC、FQA包裝入庫2深入深入Thorough Thorough 專注專注Studious Studious 紮實紮實SteadySteady 精精緻緻化化ExquisiteExquisite競華電子競華電子( (深圳深圳) )有限公司有限公司A+PCB Electorics(Shen Zhen)Co.,LTD 2 2 、OSP OSP 流程流程来料检查一次冲/

3、 /钻孔图形转移图形检查蚀刻退膜蚀检阻焊制作打定位孔字符制作V-CUT/V-CUT/成型测试FQCFQC、FQAFQAOSPOSPFQCFQC包装入库 3深入深入Thorough Thorough 專注專注Studious Studious 紮實紮實SteadySteady 精精緻緻化化ExquisiteExquisite競華電子競華電子( (深圳深圳) )有限公司有限公司A+PCB Electorics(Shen Zhen)Co.,LTD二、制程制作事项二、制程制作事项 2.1 2.1来料检查来料检查IQCIQCA、铜面检查：不允许有凹坑、擦花和严重氧化痕迹；Cu surface check

4、: Notches, scratches and serious oxidation are not allowed.B、保护膜检查：保护膜不应有破损至铝面露出；Protective film check: Protective film mustnt be broken withCu exposure.C、厚度检查：按流程卡要求检测板厚、铜厚。Thickness check: Check board thickness and Cu thickness according to lot card. 4深入深入Thorough Thorough 專注專注Studious Studious 紮實

5、紮實SteadySteady 精精緻緻化化ExquisiteExquisite競華電子競華電子( (深圳深圳) )有限公司有限公司A+PCB Electorics(Shen Zhen)Co.,LTD 2.22.2一次冲一次冲/ / 钻孔钻孔One-time Hole-punching/One-time Hole-punching/drillingA、一次冲/ / 钻孔主要冲管位孔和工艺孔，孔位和孔徑均要符合图纸要求；One-time hole-punching/drilling is mainly to punchorientation-hole and technical hole. The

6、 hole-position and hole-diameter must be consistent with drawing requirement.B、冲/钻板方向为从铜面到铝面，可有效避免铝面擦花；Punching/drilling direction is from Cu surface to Al surface,which can effectively avoid scratches of Al surface. 5深入深入Thorough Thorough 專注專注Studious Studious 紮實紮實SteadySteady 精精緻緻化化ExquisiteExquis

7、ite競華電子競華電子( (深圳深圳) )有限公司有限公司A+PCB Electorics(Shen Zhen)Co.,LTD 2.32.3、图形转移、图形转移Image TransferImage TransferA、磨板Scrubbinga、为提高干膜和保护膜面的结合力，防止保护膜面干膜、脱落，可轻磨保护膜面；In order to improve the combination of dry film & protective film and to avoid falling off dry film on the protective film, it is necessar

8、y to lightly scrub the surface of protective film.b 、不允许有板面氧化和胶渍现象。Oxidation and left glue stains on the board surface cannot be allowed. 6深入深入Thorough Thorough 專注專注Studious Studious 紮實紮實SteadySteady 精精緻緻化化ExquisiteExquisite競華電子競華電子( (深圳深圳) )有限公司有限公司A+PCB Electorics(Shen Zhen)Co.,LTD B B 贴膜贴膜FilmFil

9、ma、干膜种类： *film type: *b 、预烘和贴膜时间间隔要尽量短。The interval between pre-cure and film- pasting time should be as short as possible C C、静置冷却Placing and CoolingPlacing and Cooling.為了對位的准确，需將已貼膜的鋁基板靜置冷卻至室溫。In order to assure accurate registration, it is necessary to place aluminous board with pasted film for a

10、 while until it reaches room temperature. 7深入深入Thorough Thorough 專注專注Studious Studious 紮實紮實SteadySteady 精精緻緻化化ExquisiteExquisite競華電子競華電子( (深圳深圳) )有限公司有限公司A+PCB Electorics(Shen Zhen)Co.,LTD D D、曝光a、负片黄菲林；Negative Yellow Filmb、注意丝印孔对位的准确性。Pay attention to the registration accuracy of silkscreening hol

11、e. E E 、静置PlacingPlacing线路部分发生光聚反应, 经15min左右充分聚合。The light-gathering reaction happens at the circuit part and reaches full aggregation after 15 minutes. F F 、显影DevelopingDeveloping 8深入深入Thorough Thorough 專注專注Studious Studious 紮實紮實SteadySteady 精精緻緻化化ExquisiteExquisite競華電子競華電子( (深圳深圳) )有限公司有限公司A+PCB E

12、lectorics(Shen Zhen)Co.,LTD 2.4 2.4 圖形檢查圖形檢查Image CheckImage CheckA 、檢查重點在于開路、短路、缺口、顯影不淨等；Mainly check open circuit, short circuit, gap andunclean developing etc.B 、修板時不能用黑油筆，只能用黑油補；Black oil-pen cannot be used when mending board but black oil. 9深入深入Thorough Thorough 專注專注Studious Studious 紮實紮實Steady

13、Steady 精精緻緻化化ExquisiteExquisite競華電子競華電子( (深圳深圳) )有限公司有限公司A+PCB Electorics(Shen Zhen)Co.,LTD 2.5 2.5 蚀刻蚀刻A、必须在首板试验合格方可批量生产；It is obligatory to conduct mass production after the first batch of boards is confirmed to be qualified.B、不允许有保护膜破损现象，如发现保护膜破损，则应先用皱纹胶贴好再过机蚀刻；The dilapidation of protective film

14、 is not allowed and if the protective film is broken, it should use adhesive tape to mend it before placing boards on the etching machine.C、尽量控制一次蚀刻干净；Assure one-time clean etching as possible as it can.D、图形内任何地方的残铜或绝缘层上的垃圾都不允许用刀片来刮；Using knife to scrape off left Cu on any part of the pattern or the

15、 dirt on the insulated layer is not allowed. 10深入深入Thorough Thorough 專注專注Studious Studious 紮實紮實SteadySteady 精精緻緻化化ExquisiteExquisite競華電子競華電子( (深圳深圳) )有限公司有限公司A+PCB Electorics(Shen Zhen)Co.,LTD 2.6 2.6退膜退膜/ /清洗清洗Film-stripping/CleaningFilm-stripping/CleaningA、退膜不能浸泡在退膜缸中，必须直接过机退膜，一次性退膜干净；To strip the

16、 films clearly at one time, use tackle roller instead of immersing in the stripping chemistry.B、退膜过程中残留在板面的药水会影响铝基板成品的耐用程度，故需对剥膜后的铝基板进行有效的清洗；The residues of the stripping chemistry would affect the durability of the IMS, so which need efficient cleaning after stripping films.C 、退膜干净后的铝基板必须进行烘干处理后方可往

17、下流程；Baking is required after stripping.D 、所有铝基板均不能进行手动蚀刻；No manual etching is allowed.E 、如有蚀刻不净的板子，可进行快速过机返蚀;If etching was not well done, re-etch is needed quickly.11深入深入Thorough Thorough 專注專注Studious Studious 紮實紮實SteadySteady 精精緻緻化化ExquisiteExquisite競華電子競華電子( (深圳深圳) )有限公司有限公司A+PCB Electorics(Shen

18、Zhen)Co.,LTD 2.72.7蚀刻检查蚀刻检查Etching CheckEtching CheckA、绝缘层上的任何地方都不允许用刀片来刮；Using knife to scratch any part of the insulated layer is not allowed.B、主要检查短路、缺口、开路，报废单元不能钻孔，只能用黑油笔打“” ；Mainly check short circuit, gap, open circuit.Abandoned unit mustnt be drilled and can only be marked with “X” by black o

19、il-pen. 12深入深入Thorough Thorough 專注專注Studious Studious 紮實紮實SteadySteady 精精緻緻化化ExquisiteExquisite競華電子競華電子( (深圳深圳) )有限公司有限公司A+PCB Electorics(Shen Zhen)Co.,LTD2、8阻焊制作阻焊制作Solder Mask MakingSolder Mask MakingA A、单面磨板（线路面），不允许板面有氧化和胶渍现象；Single-side scrubbing (circuit side). Oxidation and glue stains on the

20、 board surface are not allowed.B B、待板子冷却至室温后印阻焊Print solder mask after the board is cooled into room temperature.C C、待铝基板冷却至室温后，方可对位曝光；Register and expose aluminous PCB after it is cooled into room temperature.a 、对位前应认真检查板面是否有感光油堆积及不均匀，如有且多则应及时返工；Before registration, it is necessary to seriously che

21、ck if the sensitization oil accumulates on the board surface or is uneven. If there is a lot of sensitization oil on the board surface, it must re- process such boards in time.b 、对位时应注意菲林与板面MARK点的同心度；During registration, it is necessary to pay attention to the concentricity of the film and mark poin

22、t. 13深入深入Thorough Thorough 專注專注Studious Studious 紮實紮實SteadySteady 精精緻緻化化ExquisiteExquisite競華電子競華電子( (深圳深圳) )有限公司有限公司A+PCB Electorics(Shen Zhen)Co.,LTDD、曝光：ExposingE、顯影：DevelopingF、檢查：重點檢查顯影不淨和綠肥油上焊盤；Check: Mainly check unclean developing and solder mask on the PAD.G、無特殊要求的板在顯影后須撕掉鋁面保護膜，鋁面不能有膠漬和保護膜殘留

23、；It must rip off the protective film on the Al surface after developing forunspecialized boards. Glue stains and protective film leftover on the Alsurface are not allowed.注：若有特殊要求，則在顯影后及全制程都不可撕掉鋁面保護膜；Remark: If the customer has special requirements, the protective filmmustnt be ripped off after deve

24、loping even during the whole production.H 、返洗绿油板返洗绿油前不能撕掉铝面保护膜，并检查有无破损，如有必须用皱纹胶纸贴好。The protective film cannot be ripped off before washing off solder maskfor re-process and should be checked if is broken. If the protective film isbroken, it must be mended with adhesive tape. 14深入深入Thorough Thorough

25、專注專注Studious Studious 紮實紮實SteadySteady 精精緻緻化化ExquisiteExquisite競華電子競華電子( (深圳深圳) )有限公司有限公司A+PCB Electorics(Shen Zhen)Co.,LTD如下工序为打定位孔工序必须先固化阻焊后在送板如下工序为打定位孔工序必须先固化阻焊后在送板下工序。下工序。 2.92.9打定位孔打定位孔Orientation-hole PunchingOrientation-hole PunchingA 、用层压打靶在做好的线路相应靶位图上打靶。Punch orientation-hole at correspondi

26、ng position of the board with finished circuits by layerpressing punching 15深入深入Thorough Thorough 專注專注Studious Studious 紮實紮實SteadySteady 精精緻緻化化ExquisiteExquisite競華電子競華電子( (深圳深圳) )有限公司有限公司A+PCB Electorics(Shen Zhen)Co.,LTD 2.102.10字符制作字符制作( (根据根据MIMI要求而定要求而定) Component Mark) Component MarkMaking (bas

27、ed on the requirement of MI)Making (based on the requirement of MI)A 、每印一块工作板后都需认真自检，合格后再继续印刷，不合格板需分开及时返工；Conduct self-check for every printed working boardand continue printing when the previous one isconfirmed to be qualified. Unqualified boards must beseparated from qualified ones and be re-proce

28、ssed intime.B、字符不允许有模糊、重影、残缺、渗油等现象；Component mark mustnt be ambiguous, broken, oilseeped or with ghost image.16深入深入Thorough Thorough 專注專注Studious Studious 紮實紮實SteadySteady 精精緻緻化化ExquisiteExquisite競華電子競華電子( (深圳深圳) )有限公司有限公司A+PCB Electorics(Shen Zhen)Co.,LTD 2.11 喷锡喷锡HALSHALSA、锡炉温度控制在*；The Tin-oven te

29、mperature is controlled within*.B、喷锡后要充分冷却后方可进行后处理；Conduct post-treating when the board is fully cooled after HALS.C、后处理的热水洗段要将板面充分清洗干净，防止板面哑色；Completely clean the board surface at the hot-waterwashing section of the post-treating to avoid dim colorof the board surface.17深入深入Thorough Thorough 專注專注St

30、udious Studious 紮實紮實SteadySteady 精精緻緻化化ExquisiteExquisite競華電子競華電子( (深圳深圳) )有限公司有限公司A+PCB Electorics(Shen Zhen)Co.,LTD 2.12 2.12 喷锡检查喷锡检查HALS CheckHALS CheckA、锡面平整，无锡堆、锡高等现象；The Tin surface must be smooth without Tin-piling andhigh Tin.B 、所有焊点不允许有不上锡现象；Assure all solder points are covered with Tin.C

31、、MARK.一定要平整，不允許錫面凸出或錫面不均勻；All MARK points must be smooth. It is not allowed thatthe Tin surface is protruded or uneven.D、錫面顏色一致，光亮度要好，不允許有啞色；The color of Tin surface must be unified with goodbrightness and no dim color.18深入深入Thorough Thorough 專注專注Studious Studious 紮實紮實SteadySteady 精精緻緻化化ExquisiteExq

32、uisite競華電子競華電子( (深圳深圳) )有限公司有限公司A+PCB Electorics(Shen Zhen)Co.,LTD 2.132.13单面磨板（视客户要求而定）单面磨板（视客户要求而定） Single-sideSingle-sideScrubbing (according to customers requirements)Scrubbing (according to customers requirements)A 、磨板前要彻底洗机、换水，水洗缸；Completely clean the machine and change dirty water beforescrub

33、bing and there must be *B、磨刷使用毡辘，前磨刷为*#，后磨刷为*#，磨痕试验宽度为*mm；Using felt tackle for scrubbing. The type of former scrubbingbrush is *# and the latter is *#. The tested width of scrubbingtrace is within *mm.C、磨板前要注意清洗烘干段行辘；Pay attention to cleaning transporting tackle at the baking sectionbefore scrubbin

34、g.D、磨板时只使用一对上磨刷，线路面向下，注意下磨刷要关闭；Use a pair of upper scrubbing brush for scrubbing. Put the circuitside adown and turn off the nether scrubbing brush.19深入深入Thorough Thorough 專注專注Studious Studious 紮實紮實SteadySteady 精精緻緻化化ExquisiteExquisite競華電子競華電子( (深圳深圳) )有限公司有限公司A+PCB Electorics(Shen Zhen)Co.,LTDE、铝面如

35、有擦花，须用*#砂纸打磨平整后再磨板If there are scratches on the Al surface, it is necessary to use *# sand paper to smooth the board and then conduct scrubbing.F、不能污染锡面，不能有哑色现象；The Tin surface mustnt be polluted and shouldnt has dim color.G、铝面磨板要均匀，不能有没磨到的地方；All parts of the Al surface must be scrubbed evenly.H、在铝面

36、、锡面检查合格后，铝面须贴透明专用保护薄膜；Paste special colorless protective film on the Al surface after the Al and Tin surfaces are confirmed to be qualified.20深入深入Thorough Thorough 專注專注Studious Studious 紮實紮實SteadySteady 精精緻緻化化ExquisiteExquisite競華電子競華電子( (深圳深圳) )有限公司有限公司A+PCB Electorics(Shen Zhen)Co.,LTD2.14 V-CUT2.1

37、4 V-CUTA、使用电脑V-CUT；Apply computer-assistant V-CUT.B、在V-CUT过程中不能撕掉或揭开胶纸，更不能用手去摸铝面；During the course of V-CUT, it mustnt rip off or uncover the gummed paper and touch the Al surface by hand21深入深入Thorough Thorough 專注專注Studious Studious 紮實紮實SteadySteady 精精緻緻化化ExquisiteExquisite競華電子競華電子( (深圳深圳) )有限公司有限公司

38、A+PCB Electorics(Shen Zhen)Co.,LTD2.152.15成型成型MouldingMouldingA A、在冲压过程中全程都不能撕掉或揭开胶纸，更不能用手去摸铝面；、在冲压过程中全程都不能撕掉或揭开胶纸，更不能用手去摸铝面；During the whole production, it mustnt rip off or uncover the gummed paper and touch During the whole production, it mustnt rip off or uncover the gummed paper and touch the A

39、l surface by hand.the Al surface by hand.B B、冲压过程要从线路面冲到铝面；、冲压过程要从线路面冲到铝面；The punching & pressing direction is from circuit side surface to. AlThe punching & pressing direction is from circuit side surface to. AlC C 、铝面不能有明显的披锋；、铝面不能有明显的披锋；There mustnt be obvious burs on the Al surface.There

40、 mustnt be obvious burs on the Al surface.D D 、不能被压伤，线路面不能有任何污染；、不能被压伤，线路面不能有任何污染；The board mustnt be broken when pressing and the circuit side mustnt be polluted.The board mustnt be broken when pressing and the circuit side mustnt be polluted.E E、不能有绝缘层脱落现象；、不能有绝缘层脱落现象；The insulated layer mustnt be

41、 fallen off.The insulated layer mustnt be fallen off.F F、外形及管位要符合设计的公差要求；、外形及管位要符合设计的公差要求；The tolerance of outline and controlling position should be consistent with design The tolerance of outline and controlling position should be consistent with design requirement.requirement.G G、在冲压过程中要注意模具上、下模的

42、清洁，任何的金属屑存在都会导致绝缘、在冲压过程中要注意模具上、下模的清洁，任何的金属屑存在都会导致绝缘层的破坏，从而影响其电气性能；层的破坏，从而影响其电气性能；Pay attention to cleaning the upper and nether molds during punching & pressing for Pay attention to cleaning the upper and nether molds during punching & pressing for any metal crumb may result in the damage of

43、 insulated layer and influence the any metal crumb may result in the damage of insulated layer and influence the electrical capacity of PCB.electrical capacity of PCB.22深入深入Thorough Thorough 專注專注Studious Studious 紮實紮實SteadySteady 精精緻緻化化ExquisiteExquisite競華電子競華電子( (深圳深圳) )有限公司有限公司A+PCB Electorics(She

44、n Zhen)Co.,LTD2.16高压测试高压测试High-pressure TestHigh-pressure TestA、为了保证铝基板有足够的绝缘强度， 需按客户要求100%作耐高压测试；In order to assure sufficient insulated intensity for the aluminous PCB, the high-pressure test must be operated according to customers requirements.B 、耐压测试电压为*KV（DC），漏电电流为*mA/PCS；The pressure of high-p

45、ressure test is *KV（DC）and the creepage current is*mA/PCS.C 、耐压测试时如有漏电现象则需逐片测试，找出漏电单元；If there is creepage of high-pressure test, it must test board one by one to find out the creepage unit.D 、测试者要穿绝缘胶鞋，戴绝缘手套，以免觸电；Testers must wear insulated rubber overshoes and insulated gloves to avoid electrical

46、hurt.23深入深入Thorough Thorough 專注專注Studious Studious 紮實紮實SteadySteady 精精緻緻化化ExquisiteExquisite競華電子競華電子( (深圳深圳) )有限公司有限公司A+PCB Electorics(Shen Zhen)Co.,LTD 2.17 OSP2.17 OSPA、OSP膜厚在要求范圍內；The OSP film thickness must be in the required scope.B、OSP膜均勻；The OSP film should be even.C、鋁面不能有變色及划傷。The color of A

47、l surface cannot be changed and the Alsurface mustnt be scratched.24深入深入Thorough Thorough 專注專注Studious Studious 紮實紮實SteadySteady 精精緻緻化化ExquisiteExquisite競華電子競華電子( (深圳深圳) )有限公司有限公司A+PCB Electorics(Shen Zhen)Co.,LTD2.18 FQC2.18 FQC、FQAFQA检查检查FQC and FQA CheckFQC and FQA CheckA 、按下列铝基板品质标准结合客供标准进行检查Che

48、ck the board according to the combination ofaluminous PCB standard below and customer standard.B、在检查过程中将铝面胶纸揭去，用白纸隔开存放；Uncover the gummed paper on the Al surface duringchecking and separate the boards with white paper.C 、在检查过程中不能污染铝面和线路面；The Al surface and circuit side cannot be polluted during checking.25深入深入Thorough Thorough 專注專注Studious Studious 紮實紮實SteadySteady 精精緻緻化化ExquisiteExquis