IC封装大全及世界各大品牌VIP

1、 IC 封装介绍BGABall Grid Array EBGA 680LLBGA 160LPBGA 217LPlastic Ball Grid ArraySBGA 192LTSBGA 680LCLCCCNRCommunication and Networking Riser Specification Revision 1.2 CPGACeramic Pin Grid ArrayDIPDual Inline Package DIP-tabDual Inline Package with Metal HeatsinkFBGAFDIPFTO220Flat PackHSOP28ITO220ITO3p

2、JLCCLCCLDCCLGALQFPPCDIPPGAPlastic Pin Grid Array PLCCPQFPPSDIPLQFP 100LMETAL QUAD 100LPQFP 100LQFPQuad Flat PackageSOT220SOT223SOT223SOT23SOT23/SOT323SOT25/SOT353SOT26/SOT363SOT343SOT523SOT89SOT89Socket 603FosterLAMINATE TCSP 20LChip Scale PackageTO252TO263/TO268SO DIMMSmall Outline Dual In-line Mem

3、ory ModuleSOCKET 370For intel 370 pin PGA Pentium III & Celeron CPUSOCKET 423For intel 423 pin PGA Pentium 4 CPUSOCKET 462/SOCKET AFor PGA AMD Athlon & Duron CPUSOCKET 7For intel Pentium & MMX Pentium CPUQFPQuad Flat PackageTQFP 100LSBGASC-70 5LSDIPSIPSingle Inline PackageSOSmall Outline PackageSOJ

4、32LSOP EIAJ TYPE II 14LSOT220SSOP 16L SSOPTO18TO220TO247TO264TO3TO5TO52TO71TO72TO78TO8TO92TO93TO99TSOPThin Small Outline PackageTSSOP or TSOP IIThin Shrink Outline PackageuBGAMicro Ball Grid ArrayuBGAMicro Ball Grid ArrayZIPZig-Zag Inline PackageTEPBGA 288LTEPBGA 288LC-Bend Lead CERQUADCeramic Quad

5、Flat PackCeramic CaseLAMINATE CSP 112LChip Scale PackageGull Wing Leads J-STDJ-STDJoint IPC / JEDEC StandardsJEPJEPJEDEC PublicationsJESDJESDJEDEC StandardsLLP 8LaPCI 32bit 5VPeripheral Component InterconnectPCI 64bit 3.3VPeripheral Component InterconnectPCMCIAPDIPPLCCPS/2PS/2mouse port pinoutSIMM30SIMM30PinoutSIMM30Single In-line Memory ModuleSIMM72SIMM72PinoutSIMM72Single In-line Memory ModuleSIMM72Single In-line Memory ModuleSLOT 1For intel Pent