IC_芯片封装流程ppt课件

1、;.1Introduction of IC Assembly ProcessIC;.2IC 制作沙子硅熔炼单晶硅锭硅锭切割涂覆光刻胶光刻蚀刻注入离子电镀抛光切割IC Using In Life集成电路在生活中的应用集成电路在生活中的应用Electrical product can be see everywhere.They come to be the necessary of everyones life.All these products contain one piece IC or more . 电子产品随处可见，已经成为每个人生活的必需品。而这些电子产品几乎都有一颗或多颗集成电路

2、。Why Assemble the die？为什么要封装芯片？为什么要封装芯片？1.Electrical Interconnection 电连接2.Mechanical Support/Protection/Soldering 提供机械支持/保护/可焊性3.Power dissipation 散热Assembly Process Flow封装流程图封装流程图Taping贴膜Backside Grinding背面磨晶Detaping &Wafer Mount去膜贴片Die Saw切片Adhesive Attach涂胶Die Attach粘片Wire Bond焊线Molding模封模封Ma

3、rking打标Ball Mount植球Saw Singulation分割AVI 自动检查Taping贴膜贴膜 Operation:Taping on the front side of wafer操作：在晶圆的正面贴上一层蓝膜Purpose:Protect wafer front side目的：保护晶圆正面;.10Backside Grinding背面磨晶背面磨晶Operation:Grinding backside of the wafer操作：磨晶圆的背面Purpose:Thinning the wafer目的：减小晶圆的厚度Wafer Mount & Detaping去膜贴片去膜

4、贴片Operation:Detaping and wafer mount操作：将晶圆背面贴在钢圈固定的蓝膜上，然后去除正面的保护膜Purpose:fix the wafer on the ring目的：将晶圆用钢圈固定Die Saw切片切片Operation:Sawing of the wafers through scribe street.操作：沿切割道切割晶圆。Purpose:separate the die.目的：将单个芯片分开。Adhesive Attach涂胶涂胶Operation:Printing adhesive on the substrate操作：在基板正面印胶Purpos

5、e:For next step目的：为下道工序准备Die Attach粘片粘片Operation:Attach die on substrate操作：将芯片贴到基板上Purpose:fix die on substrate目的：在基板上固定芯片BacksideFront sideWire Bond焊线焊线Operation:bonding wire on die pad and lead操作：在芯片和管脚上焊线Purpose:interconnect lead and die目的：芯片和管脚的内连接Molding模封模封Operation:To encapsulate the substrat

6、e and the bonded die in compound操作：用模封材料将基板和焊过线的芯片连接起来Purpose:To protect the die and the bonded wire from damage目的：防止芯片和线受到损伤Marking打标打标Operation: using laser mark information on the surface操作：用激光在表面打标Purpose:shown product information目的：提供产品信息;.18Ball Mount植球植球Operation:plant solder ball on crunodes操作：在结点植球Purpose:for outer electrical connect 目的：提供外部电连接的接口;.19Saw Singulation分割分割Operation:saw the sub