smt工艺相关85m贴片元件焊接07m

1、工程师，高级工程师论坛1.0Contents目录Page1111121.02.03.04.0Content Purpose Scope目录目的范围Description定义4.14.2Tools & Equipment工具和-Solder Joint for Surface Mounted Components表面贴装元件的焊接4.2.14.2.24.2.34.2.44.2.54.2.64.2.74.2.84.2.94.2.104.2.114.2.124.2.134.2.14Reference Remarks3-78-910-1112-1516-1718-212223-2526-2728293

2、0-3132-3334-4243434343Chip Component Cylindrical Devices片状元件-圆柱形元件-LCC DevicesPLCC DevicesSOIC Devices (Gull-Wing) -QFP Devices (Gull-Wing) -Flush TerminationsPartial Wraparound Terminations (Tantalum Capacitor) -Round ConductorSolder BallsSolder Splash & Solder Webs -Ball Array Grid(BGA)Illustratio

3、nIllustrationon Acceptable Soldering Requirementson RejectableSolderingRequirements5.06.07.08.0参考资料备注Revision History版本Approval 批准2.0Purpose目的This document provides the soldered joints acceptability requirements to be met for surface mounted components throughout the PCBA surface mount assembly本文件制定

4、了PCBA 表面贴装过程中表面贴装元件的焊接可接受要求。3.0Scope 范围This document established the workmanship standard criteria for soldered joints of surface mounted components to be applied for PCBA throughout the soldering processes. Thestandards are explained ins by illustrations and descriptions本文件为表面贴切装元件的焊接所制定的工艺标准规范适用于P

5、CBA 整个焊接过程。本标准在细节方面由插图和描述作解释。4.0Description定义4.1. Tools and Equipment 工具和Page 1 of 43Corporate Quality Assurance DepartmentCorporate Quality StandardNumber:29007-BTitle:WMS - Soldering(Part 2 : Surface Mounted Components)Date:工程师，高级工程师论坛Refer to Creative Workmanship Standard (Docu. No.: 29000)参照创新工艺

6、标准(Docu. No.: 29000)4.2 Solder Joint For Surface Mounted Components表面贴装元件的焊接4.2.1Chip Component片状元件4.2.1.1 Minimum Solder Coverage覆盖PREFERRED(1) Solder fillet is concave and wetted termination by 100% of the height (H) and 100% of the width (W).焊接带呈现凹形并且终端高度和宽充分润湿。Figure 4.1Page 2 of 43Corporate Qua

7、lity Assurance DepartmentCorporate Quality StandardNumber:29007-BTitle:WMS - Soldering(Part 2 : Surface Mounted Components)Date:工程师，高级工程师论坛ACCEPTABLE(1) The solder fillet extends at least 25% of the height (H) and 50% of the width (W).焊接带延伸至50% 。高度的 25%和宽度的Figure 4.2REJECTABLE(1) Insufficient solder

8、 with fillet extends less than 25% of the height (H) and 50% of the width (W).焊接带，不足高度的 25%和宽度和50% 。Figure 4.34.2.1.2um Solder CoveragePREFERRED(1) Solder fillet is concave and wettedthe termination by 100% of the height (H) and 100% of the width (W).焊接带呈现凹形并且终端高度和宽充分润湿.Figure 4.4Page 3 of 43Corpora

9、te Quality Assurance DepartmentCorporate Quality StandardNumber:29007-BTitle:WMS - Soldering(Part 2 : Surface Mounted Components)Date:工程师，高级工程师论坛ACCEPTABLE(1) Connection area exhibits a concave solder fillet rising to the top of chip. Good wetting to chip and land surface.连接区域呈现出一个延伸到贴片元件上表面的凹形焊接带。贴

10、片元件与焊盘润湿良好。Figure 4.5REJECTABLE(1) Excessive solder overhang the land ornon-metallized portion for fillet. Evidence of non-wetting.a convex多余的焊料悬垂在焊盘或非镀金属表面 上，形成了一个凸形的焊接带。明显的润湿不良。Figure 4.64.2.1.3 Voids, Blow Holes & Pin Holes空隙，气泡与针孔PREFERRED(1) Solder is smooth, bright, shiny and continuous with n

11、o evidence of pin holes, blow holes or voids.焊接光滑、明亮有光泽并呈现出良续性，没有明显的针孔、气泡或空隙。连Figure 4.7Page 4 of 43Corporate Quality Assurance DepartmentCorporate Quality StandardNumber:29007-BTitle:WMS - Soldering(Part 2 : Surface Mounted Components)Date:工程师，高级工程师论坛ACCEPTABLE(1) The solder connection may exhibit

12、voids, blow hole or pin hole in which the surface area covers less than 50% of the component width (W).焊接处有空隙、气泡或针孔，总体覆盖面积小于元件宽度的 50% 。Figure 4.8REJECTABLE(1) The entire surface area of the voids, blow hole or pin holes cover more than 50% of the component width (W).整个表面区域有空隙、气泡或针孔，总体覆盖面积大于元件宽度的 50%

13、 。Figure 4.94.2.1.4 Tombstone 立碑PREFERRED(1) Chip component is mounted properly on the terminal pads with complete wetting of solder on the land surface and the end metallization of the component.贴片元件恰当的贴装于终端 焊盘，并且元件终端和焊盘均润湿良好。Figure 4.10Page 5 of 43Corporate Quality Assurance DepartmentCorporate Qu

14、ality StandardNumber:29007-BTitle:WMS - Soldering(Part 2 : Surface Mounted Components)Date:工程师，高级工程师论坛ACCEPTABLE(1) Chip component mounted sideways is permissible provided that there is a complete wetting of solder on the land surface and the end metallization of the component.贴片元件贴装移位但仍润湿良好。(2) Hei

15、ght of sideway mounted component isnot theum for the whole PCBA.贴装移位的元件的高度不是整个PCBA 的最大高度。Figure 4.11REJECTABLE(1)Chip component standing on one side of the terminal pad (tombstoning).立碑Height of sideway mounted component is um for the whole PCBA.贴装移位的元件的高度是整个PCBA 的最大高度。(2)Figure 4.12Page 6 of 43Corp

16、orate Quality Assurance DepartmentCorporate Quality StandardNumber:29007-BTitle:WMS - Soldering(Part 2 : Surface Mounted Components)Date:工程师，高级工程师论坛4.2.2Cylindrical Devices 圆柱形元件4.2.2.1 Minimum Solder Coverage最少焊锡覆盖W = Termination Width H= Termination Height=Diameter of Cylindrical Device Diameter o

17、f Cylindrical DevicePREFERRED(1) Solder fillet is concave and wetted the termination by 100% of the height (H) and 100% of the width (W).呈现出凹形焊接带且终端润湿良好。Figure 4.13ACCEPTABLE(1) Solder fillet extends at least 50% of the height (H) and 50% of the width (W) of the device.焊接带至少延伸至高度的 50%和宽度的50% 。Figure

18、 4.14REJECTABLE(1) Insufficient solder with fillet extends less than 50% of the height (H) and 50% of the width (W) of the device.，焊接带不能延伸至元件高度和宽度的50%Figure 4.15Page 7 of 43Corporate Quality Assurance DepartmentCorporate Quality StandardNumber:29007-BTitle:WMS - Soldering(Part 2 : Surface Mounted Co

19、mponents)Date:工程师，高级工程师论坛4.2.2.2um Solder Coverage 最大焊锡覆盖W = Termination Width H = Termination Height=Diameter of Cylindrical Device Diameter of Cylindrical DevicePREFERRED(1) Solder fillet is concave and wetted the termination by 100% of the height (H) and 100% of the width (W).呈现出凹形焊接带且终端润湿良好。Figu

20、re 4.16ACCEPTABLE(1) Solder fillet is slightly convex but does not overhang the termination or land with evidence of proper wetting.焊接带呈现出轻微凸起但焊盘或终端没有悬垂，呈现出适当的润湿。Figure 4.17REJECTABLE(1) Excessive solder overhangs the land ortermination fora convex fillet.多锡，焊锡悬垂在焊盘与终端上形成了一个凸形焊接带。Figure 4.184.2.3LCC

21、 DevicesPage 8 of 43Corporate Quality Assurance DepartmentCorporate Quality StandardNumber:29007-BTitle:WMS - Soldering(Part 2 : Surface Mounted Components)Date:工程师，高级工程师论坛7.2.3.1 Minimum Solder CoveragePREFERRED(1) Solder wetting extends to the top of the castellation fora concave solder fillet (F)

22、.焊锡润湿至接带。顶端，形成了一个凹形焊Figure 4.19ACCEPTABLE(1) Solder fillet is evident and extends at least 25% of the castellation height (H) equal to 50% of the fillet height (F).形高度的 25%相当于焊接带延伸至焊接带高度的 50% 。Figure 4.20REJECTABLE(1) Insufficient solder with fillet extends less than 25% of the castellation height (

23、H) and 50% of the fillet height (F).，焊接带延伸少于高度的 25%即少于焊接带高度的 50% 。Figure 4.214.2.3.2um Solder Coverage多锡Page 9 of 43Corporate Quality Assurance DepartmentCorporate Quality StandardNumber:29007-BTitle:WMS - Soldering(Part 2 : Surface Mounted Components)Date:工程师，高级工程师论坛PREFERRED(1) Solder wetting exte

24、nds to the top of the castellation fora concave solder fillet (F).焊锡润湿至接带。顶端，形成了一个凹形焊Figure 4.22ACCEPTABLE(1) Solder fillet is slightly convex with evidence of proper wetting. Solder does not overhang the castellation or land area. 焊接带轻微凸起但适当润湿。焊锡没有悬垂在或焊盘上。Figure 4.23REJECTABLE(1) Excessive solder o

25、verhangs the castellation or land area fora convexfillet. No evidence of proper wetting.多余焊锡悬垂于或焊盘上形成了一个凸形焊接带。明显润湿不良。Figure 4.244.2.4PLCC Devices4.2.4.1 Minimum Solder CoveragePage 10 of 43Corporate Quality Assurance DepartmentCorporate Quality StandardNumber:29007-BTitle:WMS - Soldering(Part 2 : Su

26、rface Mounted Components)Date:工程师，高级工程师论坛PREFERRED(1) Solder fillet is evident and extends onto the inner surface of the lead and covers all four sides of the lead and land.焊接带明显且延伸到引脚内表面并且引脚四面和焊盘润湿良好。(2) Solder fillet extends 25% up the lead height (H).焊接带延伸至引脚高度的 25% 。Figure 4.25ACCEPTABLE(1) Sold

27、er fillet is evident on at least 3 sides of the lead with solder cover at least 50% of the lead width (W).至少引脚的三面覆盖有焊锡形成了明显的焊接带且至少为引脚宽度的 50% 。(2) Solder fillet must extend at least 10% up the lead height (H).焊接带至少延伸至引脚高度的 10% 。Figure 4.26REJECTABLE(1) Insufficient solder cover less than 3 sides of t

28、he lead and 50% of the lead width (W).，引脚覆锡少于 3 面且每面少于引脚宽度的 50% 。(2) Solder fillet extends less than 10% of the lead height (H).焊接带没有延伸至引脚高度的 10% 。Figure 4.27um Solder Coverage4.2.4.2多锡Page 11 of 43Corporate Quality Assurance DepartmentCorporate Quality StandardNumber:29007-BTitle:WMS - Soldering(Pa

29、rt 2 : Surface Mounted Components)Date:工程师，高级工程师论坛PREFERRED(1) Solder fillet is evident and extends onto the inner surface of the lead and covers all four sides of the lead and land with no evidence of overhang.焊接带明显且延伸至引脚的内表面，引脚四面和焊盘没有焊料悬垂。(2) Solder fillet extends 25% up the lead height (H).焊接带延伸至

30、引脚高度的 25% 。Figure 4.28ACCEPTABLE(1) Solder fillet is evident and covers all four sides of the lead and solder overhang the land must not be greater than 50% of the lead width (W).焊接带明显并且引脚四面覆有焊锡，焊锡悬垂不得超过引脚宽度的 50% 。(2)um solder fillet extends up the leadis 50% of the lead height (H).最大焊接带为引脚高度的 50% 。

31、Figure 4.29REJECTABLE(1) Solder fillet overhangs the land more than 50% of the lead width (W) with no evidence of proper wetting.焊接带悬垂在焊盘上，大于引脚宽度的50% ，明显的润湿不良。(2) Excessive solder extends more than 50% up the lead height (H).多余焊锡超出引脚高度的 50% 。Figure 4.30Page 12 of 43Corporate Quality Assurance Depart

32、mentCorporate Quality StandardNumber:29007-BTitle:WMS - Soldering(Part 2 : Surface Mounted Components)Date:工程师，高级工程师论坛4.2.4.3Unsoldered Connection & Bridging未焊接与桥接PREFERRED(1) Good wetting of solder within the boundaries of the pad. The wetting angle of the solder to the component and to the pad is

33、less than 90 degrees.焊盘分界线润湿良好。元件与焊盘之间的焊接润湿角小于 90。Figure 4.31REJECTABLE(1) No wetting or bonding between the lead and the terminal pad.在引脚与终端焊盘之间没有润湿或没有结合物。Figure 4.32REJECTABLE(1) Solder projects beyond the pad or leadfora short circuit between adjacentpads, leads or traces.焊锡突出焊盘与引脚，在相邻的焊盘、引脚或迹线之间

34、形成短路。Figure 4.33Page 13 of 43Corporate Quality Assurance DepartmentCorporate Quality StandardNumber:29007-BTitle:WMS - Soldering(Part 2 : Surface Mounted Components)Date:工程师，高级工程师论坛4.2.5SOIC Devices ( Gull-Wing )4.2.5.1 Minimum Solder Coverage最少焊锡覆盖PREFERRED(1) Solder fillet is evident and wetted on

35、 all four sides of the lead and land.焊接带明显 ，引脚四面与焊接面润湿良好。Figure 4.34ACCEPTABLE(1) At least 50% of perimeter of each lead have good wetted solder fillets with solder cover at least 50% of the lead side (L), 50% of the lead width (W) and 50% of the lead thickness (T).每个引脚周长至少 50% 焊接带润湿良好， 且至少引脚长宽高的 50

36、%覆有焊锡。(2) Must have sufficient solder to form a properly wetted fillet.必须形成一个适当润湿的焊接带。Figure 4.35REJECTABLE(1) Insufficient solder cover less than 50% of perimeter of the lead with solder cover less than 50% of the lead side (L) and / or less than 50% of the lead width (W) and / or less than 50% of

37、the lead thickness (T).，每个引脚周长少于 50% 焊接带润湿且引脚长宽高覆锡少于 50% 。Figure 4.364.2.5.2um Solder Coverage多锡Page 14 of 43Corporate Quality Assurance DepartmentCorporate Quality StandardNumber:29007-BTitle:WMS - Soldering(Part 2 : Surface Mounted Components)Date:工程师，高级工程师论坛PREFERRED(1) Solder fillet is evident a

38、nd wetted on all four sides of the lead and land.焊接带明显且引脚四面与焊接面润湿良好。Figure 4.37ACCEPTABLE(1) Solder wetted on all sides of the lead and extends less than 50% of the distance (D)between the upper and lower bs.引脚的所有面均润湿，且小于上下弯曲点间距离的 50% 。um height of the solder joint (H) is 3 times the lead thickness

39、(T).焊点的最大高度是引脚厚度的 3 倍。(2)Figure 4.38REJECTABLE(1) Excessive solder cover the whole lead and extends more than 50% of the distance (D) between the upper and lowerbs.整个引脚多锡覆盖，且超出上下弯曲点之间距离的 50% 。(2) The height of the solder joint (H) is greater than 3 times the lead thickness (T).焊点高度大于引脚厚度的 3 倍。Figure

40、 4.39Page 15 of 43Corporate Quality Assurance DepartmentCorporate Quality StandardNumber:29007-BTitle:WMS - Soldering(Part 2 : Surface Mounted Components)Date:工程师，高级工程师论坛4.2.6QFP Devices ( Gull-Wing )4.2.6.1 Minimum Solder CoveragePREFERRED(1) Solder fillet is evident and wetted on all four sides of

41、 the lead and land.焊接带明显，引脚四面与焊接面润湿良好Figure 4.40ACCEPTABLE(1) At least 50% of perimeter of each lead have good wetted solder fillets with solder cover at least 50% of the lead side (L), 50% of the lead width (W) and 50% of the lead thickness (T).每个引脚周长至少 50% 焊接带润湿良好， 且至少引脚长宽高的 50%覆有焊锡。(2) Must have

42、sufficient solder to form a properly wetted fillet.必须形成一个适当的焊接带。Figure 4.41REJECTABLE(1) Insufficient solder cover less than 50% of perimeter of the lead with solder cover less than 50% of the lead side (L), less than 50% of the lead width (W) and / or 50% of the lead thickness (T).，每个引脚周长少于 50% 焊接带

43、润湿且引脚长宽高覆锡少于 50% 。Figure 4.42Page 16 of 43Corporate Quality Assurance DepartmentCorporate Quality StandardNumber:29007-BTitle:WMS - Soldering(Part 2 : Surface Mounted Components)Date:工程师，高级工程师论坛4.2.6.2um Solder Coverage多锡PREFERRED(1) Solder fillet is evident and wetted on all four sides of the lead

44、and land.焊接带明显且引脚四面与焊接面润湿良好Figure 4.43ACCEPTABLE(1) Solder wetted on all sides of the lead and extends less than 50% of the distance (D)between the upper and lower bs.引脚的所有面均润湿，且小于上下弯曲点间距离的 50% 。um height of the solder joint (H) is 3 times the lead thickness (T).焊点的最大高度是引脚厚度的 3 倍。(2)Figure 4.44REJEC

45、TABLE(1) Excessive solder cover the whole lead and extends more than 50% of the distance (D) between the upper and lowerbs.多锡覆盖整个引脚，且大于上下弯曲点间距的 50% 。(2) The height of the solder joint (H) is greater than 3 times the lead thickness (T).焊点高度大于引脚厚度的 3 倍。Figure 4.45Page 17 of 43Corporate Quality Assuran

46、ce DepartmentCorporate Quality StandardNumber:29007-BTitle:WMS - Soldering(Part 2 : Surface Mounted Components)Date:工程师，高级工程师论坛4.2.6.3Cold Solder Joint & Flux Residue冷焊与助焊剂残留物PREFERRED(1) Solder is smooth, bright, continuous and feathered to a thin edge indicating proper flow and wetting action.焊接光滑

47、、明亮连续性良好，有一个羽翼状的显示出良与润湿。Figure 4.46REJECTABLE(1) Solder connection exhibiting poor wetting and a grayish, porous / lumpy appearance due to insufficient heat, inadequate cleaning prior to soldering or excessive impurities in the solder.焊接显示出润湿不良，灰暗、多孔状/粗糙，这是由于加热不足或焊接前没有清洁或焊料中有过多的杂质。Figure 4.47REJECTA

48、BLE(1) Flux is entrapped between lead and land, reducing or preventing metallic continuity. 引脚与焊接面间有助焊剂，降低或阻碍了金属间的熔合。Figure 4.48Page 18 of 43Corporate Quality Assurance DepartmentCorporate Quality StandardNumber:29007-BTitle:WMS - Soldering(Part 2 : Surface Mounted Components)Date:工程师，高级工程师论坛4.2.6.4

49、Conductor & Pad Lifted And Lead Unsoldered 导线与焊盘和引脚未焊PREFERRED(1) Solder is smooth, bright, continuous and feathered to a thin edge indicating roper flow and good wetting action.焊接光滑、明亮、连续性，有一个羽翼状的，呈现出良与润湿。(2) Land area has total adhesion to board base laminate with no evidence of heat related damag

50、e.焊接区域总体粘着在基板上，没有加热引起的损坏。Figure 4.49REJECTABLE(1) No wetting or bonding between the lead and the terminal pad.在引脚与终端间没有润湿或形成结合物。Figure 4.50REJECTABLE(1) Land area and / or lead separating from base laminate due to overheating of connection.由于焊接过热而导致焊接区域和/或引脚与基板分离。Figure 4.51Page 19 of 43Corporate Qu

51、ality Assurance DepartmentCorporate Quality StandardNumber:29007-BTitle:WMS - Soldering(Part 2 : Surface Mounted Components)Date:工程师，高级工程师论坛4.2.7Flush Terminations4.2.7.1 Solder CoveragePREFERRED(1) Solder fillet is evident along the entire length of the termination.整个终端长度形成一个焊接带。(2) No evidence of

52、lead detachment.引脚没有明显的分离。Figure 4.52ACCEPTABLE(1) Solder fillet is evident and covers at least 50% of the termination length (L).焊接带明显，至少终端长度的 50%覆有焊锡。(2) If the lead is partially detached, at least 75% of the termination length (L) must be attached and soldered.如果引脚部分分离，至少终端长度的 75%接触焊锡。Figure 4.53

53、REJECTABLE(1) Insufficient solder covers less than 50% of the termination length (L).，引脚覆锡少于 50% 的引脚长度。(2) If the lead is partially detached, less than 75% of the termination length (L) is attached and soldered.如果引脚部分分离，少于终端长度的 75%接触焊锡。Figure 4.54Page 20 of 43Corporate Quality Assurance DepartmentCorporate Quality StandardNumber:29