SMT回流焊工艺中英文对照

1、SMT回流焊工艺中英文对照1.FundamentalsofSoldersandSoldering（焊料及焊接基础知识）SolderingTheory（焊接理论）MicrostructureandSoldering（显微结构及焊接）EffectofElementalConstituentsonWetting（焊料成分对润湿的影响）EffectofImpuritiesonSoldering（杂质对焊接的影响）SolderPasteTechnology（焊膏工艺）SolderPowder（锡粉）SolderPasteRheology（锡膏流变学）SolderPasteComposition&

2、Manufacturing（锡膏成分和制造）SMTProblemsOccurredPriortoReflow（回流前SMT问题）FluxSeparation（助焊剂分离）PasteHardening（焊膏硬化）PoorStencilLife（网板寿命问题）PoorPrintThickness（印刷厚度不理想）PoorPasteReleaseFromSqueegee（锡膏脱离刮刀问题）Smear（印锡模糊）Insufficiency（印锡不足）NeedleClogging（针孔堵塞）Slump（塌落）LowTack（低粘性）ShortTackTime（粘性时间短）SMTProblemsOccur

3、redDuringReflow（回流过程中的SMT问题）ColdJoints（冷焊）Nonwetting（不润湿）Dewetting（反润湿）Leaching（浸析）Intermetallics（金属互化物）Tombstoning（立碑）Skewing（歪斜）Wicking（焊料上吸）Bridging（桥连）Voiding（空洞）Opening（开路）SolderBalling（锡球）SolderBeading（锡珠）Spattering（飞溅）SMTProblemsOccurredatPostReflowStage（回流后问题）WhiteResidue（白色残留物）CharredResidu

4、e（炭化残留物）PoorProbingContact（探针测接问题）SurfaceInsulationResistanceorElectrochemicalMigrationFailure（表面绝缘阻抗或电化迁移缺陷）Delamination/Voiding/Non-curingOfConformalCoating/Encapsulants（分层/空洞/敷形涂覆或包封的固化问题）ChallengesatBGAandCSPAssemblyandReworkStage（BGA、CSP组装和翻修的挑战）StarvedSolderJoint（少锡焊点）PoorSelf-Alignment（自对位问题）

5、PoorWetting（润湿不良）Voiding（空洞）Bridging（桥连）UnevenJointHeight（焊点高度不均）Open（开路）PopcornandDelamination（爆米花和分层）SolderWebbing（锡网）SolderBalling（锡球）ProblemsOccurredatFlipChipReflowAttachment（倒装晶片回流期间发生的问题）Misalignment（位置不准）PoorWetting（润湿不良）SolderVoiding（空洞）UnderfillVoiding（底部填充空洞）Bridging（桥连）Open（开路）UnderfillCrack（底部填充裂缝）Delamination（分层）FillerSegregation（填充分离）InsufficientUnderfilling（底部填充不充分）OptimizingReflowProfileviaDefectMechanismsAnalysis（回流曲线优化与缺陷机理分析）FluxReaction（助焊剂反应）PeakTemperature（峰值温度）CoolingStage（冷却阶段）HeatingStage（加热阶段）TimingConsiderations（时间研究）OptimizationofProfile（曲线优化）Com