FPC-专业词汇-中英文对照

1、FPC名词中英对照1. 目的通过对行业标准的FPC工程名词引用及我司标准的整合，旨在为我司FPC名词的中英用语实现使用上的统一化2. 适用范围标准FPC相关工程上出现之不良工程，生产使用之材料、设备、治具以及可靠性试验等中英文名 词3. 定义无类别一：FPC不良工程名词工程类别不良名称中文-Mr央文导线VisualIn spect ion of Con ductors导线Con ductors开路Ope n短路Short缺口Nicks针孔Pin holes额外铜刺Extra neous Copper Betwee n Con ductors毛刺Spurs结瘤Nodules蚀刻凹痕Etched

2、Con cave导线分层Con ductor Delam in ati on裂纹Cracks导线划痕Scratches on Con ductor凹坑Den ts变色Discolorati on基底薄膜VisualIn spect ion ofBase Film凹坑Den ts划痕Scratches on Base Film覆盖层和覆盖涂层VisualIn spect ion of Coverlay and Covercoat凹坑Dents on Coverlay and Covercoat划痕Scratches on Coverlay and Covercoat空洞Void偏位Coverla

3、y Misalig n毛刺Coverlay Burrs外来物导电性异物Con ductive Foreig n MattersForeig n Matters非电性异物Non-con ductive Foreig n Matters起泡和分层Blisteri ng and Delam in ati on覆盖层粘结剂挤出Squeeze-out of Adhesive of Coverlay覆盖涂层渗出Ooze-out of Covercoat覆盖涂层跳漏Skipp ing of Con vercoat电镀金属或焊锡的 外表条件SurfaceCon diti on ofPlated Men tai

4、 and Solder镀金Gold Plati ng镀金层缺陷Gold Plat ing Defects镀锡Tin Plat ing电镀金属或焊料的渗透Penetration of Plated Metal or Solder变暗变黑Darke ned Appeara nee (Blacke ning Discolorati on)镀铜孔内镀层空洞Plating Voids in Plated-though Hole镀金粗糙Rough Gold镀金白雾Gold Discolorati on镀金变色Gold Discolorati on镀金层龟裂Gold Crack镀金针孔Gold Pi nho

5、le电镀露铜Plated Expose Wetti ng剥离Plated Peeled Off电镀渗入Plated Wicki ng漏镀No Plat ing外表伤痕Plating Scratch电镀粗糙Rough Plated药水渗入Wicki ng外形和孔边缘VisualIn spect ion of Edges of Outli ne and Holes撕裂和缺口Tears and Nicks毛刺Burrs丝状毛刺Thready Burrs弯曲、变形Warpage微连筋不良Poor Micro-jo int外形偏移Outli ne Misalig n外形漏冲No Outli ne反折偏位

6、Bending Line Misalig n增强板Visual Imperfectio ns Related to Stiffe nerBondingFPC与增强板之间 的外来物Foreign Matter Between Flexible Printed Board and Stiffe nerFPC与增强板之间 的空洞Voids Betwee n Flexible Prin ted Board and Stiffe ner裂纹Cracks缺角Chip-off划痕Scratches变形Deformati on外表附着物AffixedSubsta nces on增强板贴偏移Stiffe ner

7、 Misalig n热固胶Thermosett ing Adhesive焊剂残渣Flux Residues金属粉末残渣Residue of Metal Powdersthe Surface粘结剂残渣Residue of Adhesive突起Protrusi ons凹坑Den ts弓曲Bow扭曲Twist标t记 Marking尺寸检验Dime nsional In spect ions尺寸测量Measureme nt of Dime nsions外部尺寸Exter nal Dime nsions厚度Thick ness孔Holes元件孔Comp onent Holes导通孔Via Holes导通

8、孔偏移Via Hole Misalig n安装孔Moun ti ng Holes导线宽度Co nductor Widths导线之间的间距Cleara nces Betwee n Con ductors孔中心间距Dista nee Betwee n Hole Cen ters板边和导线之间的 最小距离Minimum Dista nee Betwee n Board Edges and Con ductors标记错误Wrong Marking字符不清晰Un clear Letter疋位精度Positi onalAccuracy孔的定位精度Positi onal Accuracy of Holes孔

9、与焊盘的重合性Registration of Hole to Land覆盖层与焊盘的重合性Registrati on of Coverlay (or Covercoat) to Land增强板与FPC的重 合性Registratio n ofStiffe ner to FPC孔的重合性Registration of Holes外形的重合性Registratio n of Outl ines冲外形与导线图形 的重合性Registratio n of Pun ched Outli ne to Con ductor Patterns压敏胶或热固胶与FPC和增强板的重 合性Registration o

10、f Pressure Sensitive or Heat Activated Adhesives to FPC and Stiffe ner镀通孔的镀铜层厚 度Plati ng Thick ness of Copper Pan ted-through Holes其它Other短装Shortage混装Mixed Stowage/Pack ing离型纸脱落Released Paper Peeled off材料错误Wrong Material类别二：PFC工程用语工程类别中文-Mr央文板Board Type单面板Sin gle Sided Flex Circuits单面双接触Double Acces

11、s or Back-bared Flex Circuits板 面 双具e 模DD纸 图 具 模ng wira Dre DD具 模 产 量具模 钢eDDeDD pTo割 切 线具 模 外具具具 模 、杀具ie r e ilv spost模 割 分ie g "5 R el te SS ng cutt钉 销pm爲e 孔HOI孔 位 定 7t孔 位 定 具 模ie r fo e d H e 泊 ui G孔 锡 渗孔 配 装e d H g n tti Fi艇f孔 占 ¥g in Dr镀铜 学 化膜 干 贴光啄影>ng N tc 巳膜 脱ng固化烘烤Curi ng黑孔Black

12、Hole外表处理Surface Treatme nt循环水洗Cascade Rinse微蚀Micro-etchr酸洗Acid Clea ning水洗Water Clea ning防锈处理An ti-corrosio n Treatme nt前处理Pre-treatme nt刷板Brush ing:枯燥Dry up电镀金、锡、 镍(Gold、Solder、Nickel) Plating:闪镀(Gold ) Flash Plat in g/Strike Plat ingr局部电镀Pattern Plate化学镍金Immersio n Gold有机保焊膜Orga nic Solderability

13、Preservatives (OSP)丝印字符Prin ti ng of Lege nd贴补强板Back Board Lam in ati on电性能测试Electrical In spect ionr贴胶纸Double Faced Adhesive Tape打孔Punching雷射切割Laser Cut自动光学检验Automatic Optical In specti on AOI外表贴装Surface Mou nting Techn ology SMT外形冲切Punching:冲孔Punching外观检杳Final In specti on目视检查Visual In specti on F

14、inal In spect ion)线路显微镜检 验镜检Con ductor Microscope In specti on性能测试Reliability Test包装Pack ing原材料Material铜箔Copper Foil (CU)电解铜Electro-deposited Copper Foil (ED)压延铜Rolled Ann ealed Copper Foil (RA)保护膜Coverlay (CVL)基材Base Materialr挠性覆铜板Flexible Copper Clad Laminate (FCCL)无胶基材Adhesiveless FCCL粘接剂胶Adhesiv

15、es (Ad)压克力Acrylic顶层补强Top Stiffe ner底层补强Bottom Stiffe nerr顶层银浆膜Top Silver Paste底层银浆膜Bottom Silver Paste银浆油墨Sliver Ink顶层线路Top Circuits/C on ductorsP底层线路Bottom Circuits/C on ductors半固化片Bo nding Film (BOD)聚酰亚胺Polyimide(PI)聚酯Polyester Film (PET)钢片Sheet Steel玻璃纤维布Wove n Glass ClothP FR4补强板Fiberboard液态感光油墨

16、Liquid Photoimageable Resist Ink压敏胶Pressure Sen sitive Adhesive PSA:离型膜Release Paper导电胶Con duct ing Resin导电布Electric Fabric泡棉Foam导向导电胶An isotropic Con ductive Film ACF导电泡棉Con ductive/Electric Foam:屏蔽膜Shield Film金属薄膜开 关Metal Dome DOME:连接器Conn ector电容Capacita nee ( C )电阻Resista nee ( R )r集成电路In tegrat

17、ed CircuitIC:二极管Diode (D)静电Electro-Static Discharge ESD其它Others:机械方向Machi ne Direction MD垂直方向Tran sverse Direct ion TD进刀Feed进刀量Chip Load转速Speed焊接Solderi ngr手工焊接Hand Solderi ng波焊Wave Solderi ng品质允收标准Acceptable Quality Level AQL；菲林Film字符Legend烘箱Ove n温度Temperature湿度Humidity速度Speed压力Pressure卩贲淋压力Spout i

18、ng Pressure浓度Concen trati on原理图纸Schematic Diagram线宽Line Space线距Line Width1线路间距Pitch类别三：FPC可靠性测试工程中文央文电气性能Testi ng of Electrical Performanee导线电阻Con ductor Resista nee外表层绝缘电阻Surface In sulati on Resista nee (SIR)外表介质层耐电压强度Dielectric Withsta nding Voltage of Surface Layers机械性能测试Testi ng of Mechanical Property剥离强度Peel Stre ngth孔和焊垫的拉脱强度Pull-out Stre ngth for Pla in Holes and Footpri nts镀层附着力Plati ng Adhesi on可焊性Solderabi