线路板PCB专业英语词汇制造、测试、缺陷名等

1、PC吸语t审匚（一）1.综合词汇Printed circuit印制电路Printed wiring印制线路Printed circuit board印制电路板Printed wiring board印制线路板Printed component印制元件Printed contact印制接点Single-sided printed circuit board (SSB)单面印制电路板double-sided printed circuit board (SSB)双面印制电路板Multilayer printed circuit board (MLB)多层印制电路板Rigid printed cir

2、cuit board刚性印制电路板Flexible printed circuit board挠性印制电路板Flex-rigid printed circuit board挠性印制电路板Build-up printed board积层印制板Surface laminar circuit(SLC)表白层合电路板B2it printd board埋入凸块互连 印制板ALIVH Multilayer printd board层间全内导通 多层印制板Chip on board (COB)载心片板Backplane背板Bare board裸板Break-away board可断拼板nterconnect

3、ion互连Conductor race line导线Substrate基底Real estate基板面Conductor side导线面Component side元件面Solder side焊接面Printing印制grid网格pattern图形Conductive pattern导电图形Non- conductive pattern非导电图形Legend字符Mark标志2.基材基材的种类和结构Base material基材Laminate层压板Copper-clad laminate (CCL)覆铜箔层压板Prepreg预浸材料Bonding sheet/bonding layer粘结片E

4、poxy glass substrate环氧玻璃基板Copper-clad surface铜箔面Foil removal surface去铜箔面Length wise direction纵向cross wise direction横向Core material内层芯材2.2基材的材料A-stage resinA阶树脂B-stage resinB阶树脂C -stage resinC阶树脂epoxy resin环氧树脂Polymer聚合物Photosensitive resin感光性树脂Thermosetting resin热固性树脂Thermoplastic resin热塑性树脂Adhensiv

5、e.狡粘剂Curing agent固化剂Flame retardant阻燃剂opaquer遮光剂Polyester film (PET)聚酯薄膜Polyimide film (PI)聚酰亚胺薄膜Polytetrafluoetylene (PTFE)聚四氟乙烯Non-woven fabric非织布/无纺布Glass fiber玻璃纤维Glass fabric玻璃布Warp-wise经向Weft-wise纬向Copper foil铜箔Eletrodeposited copper foil电解铜箔Rolled copper foil压延铜箔Resin coated copper foil (RCC)

6、涂树脂铜箔2.3基材的制造Polymerize聚合Thermoplastic热塑性Thermoset热固性Clad覆箔Layup叠层aminating层压Postcure后固化Curing time固化时间Resinflow树脂流动度Resin content树脂含量PC吸语词汇（二）3设计3.1通用术语Computer-aided design (CAD)计算机辅助设计Computer-aided manufacturing (CAM)计算机辅助制造Routing布线Layout布图设计Component density元件密度Arry阵列3.2形状与尺寸Conductor导线Conduct

7、or width导线宽度Conductor spacing导线间距Conductor width/space导线宽度/间距Conductor layer导线层Component hole元件孔Mounting hole安装孔Supported hole支撑孔Unsupported hole非支撑孔Via导通孔Plated through hole镀通孔Blind via (hole)盲孔Buried via (hole)埋孔Buried/ blind via埋/盲孔Any layer inner via hole (ALIVH)任意层内部导通孔Tooling/ pilot hole定位孔Lan

8、dless hole无连接盘导通孔Via-in-pad在连接盘中导通孔Pitch节距Fine pitch精细节距3.3电气互连nterfacial connection表卸间连接Interlayer connection层间连接nnerlayer connection内层连接Pad, land连接盘Component lead3.4其他Primary side主面Secondary side辅面Signal layer信号层Crosstalk串扰Capacitance电容Electromagnetic interference (EMT)电磁干扰Electromagnetic shieldin

9、g电磁屏蔽Impedance特性阻抗nductance电感Coplanarity共面性（度）Core material芯板Thin type multilayer board薄型多层板Buried and blind via hole mutilayer board埋/盲孔多层板Buried bump interconnection technology (B2it)嵌入凸块互连技术Multichip module (MCM)多芯片模块Alignment mark对准标记Registration mark对位标记Layer to layer registration层间重合度PC吸语词汇（三）

10、4.制造4.1通用术语Subtractive process减成法Additive process加成法Semi-additive process半加成法Full-additive process全加成法Build up process积层法Solder mask on bare copper (SMOBC)裸铜覆阻焊工艺Tenting掩蔽法Sequential lamination顺序层压法Wet process湿处理Panel plating process板面电镀法Pattern plating process图形电镀法Finishing最终修饰Reworking返工Tooling fe

11、ature工艺标识Panel在制板，拼板First article首板Prototype试样板End product最终产品Process flow工艺流程Process window工艺范围Lot size/ batch批量Job traveller工作流程单4.2照相底版制作Artwork照相底图Phototool照相底版Artwork master照相原版Working master工作原版Production master生产底版Photographic film照相底片Silver film银盐底片Diazo film重氮底片Positive正像Positive pattern正像图

12、形Negative负像Negative pattern负像图形Photo plotting光绘图Laser platting激光绘图Gerber fileGerber文件Photoplotter光绘机Laser plotter激光绘图机Registration mark定位标记4.3图形转移Printing ink印料Etching resist ink抗蚀印料Plating resist ink耐电镀印料Resist抗蚀剂Photo resist光致抗蚀剂Dry film photoresist干膜光致抗蚀剂Liquid photoresist液体光致抗蚀剂Positive-acting r

13、esist正性抗蚀剂Negative-acting resist负性抗蚀剂Plating resist耐电镀抗蚀剂Plated resist抗蚀镀层Permanent resist永久性保护层Electro-deposited photoresist电沉积光致抗蚀剂Mask掩膜Solder resist 、solder mask阻焊剂Solder mask ink阻焊印料Dry film solder mask阻焊干膜Liquid photosensitivesolder resist液体光致阻焊剂Marking ink 、legend ink标记印料Conductive paste导电膏Ho

14、le filing ink堵孔油墨Peelable solder mask ink可剥性防焊油墨Thermally curable 、heat cured热固化Ultraviolet curable (UV cured)紫外线固化Screen printing网版印刷Silk screen丝印网版Stencil网版Screenability网印能力Chase、frame网框Fabric、cloth丝网Mesh count网目数Squeegee刮板PCB英语词汇（四）（续上一页）Skip printing漏印Thinner、diluent稀释剂Viscosity粘度Imaging成像Imagin

15、g transfer图像转移Dry film imaging干膜制图形Lamination贴膜Wet lamination湿法贴膜Exposure曝光holding time停留时间developing显影developer显影液anti-foamer/消泡剂resolution分辨率anti-foaming agentdefinition逼真度ghost image重影halation晕环air inclusion夹杂气泡tackiness粘着性post cure后固化shelf life保存期pot life/ working life适用期dip coating浸涂法roller coa

16、ting辐涂法spray coating喷涂法curtain coating帘幕法laser direct imaging激光直接 成像4.4清洗与蚀刻rinsing / rinse水洗electrolytic cleaning电解清洗alkaline degreasing化学除油electrolytic degreasing电解除油overflow溢流deionized water去离子水表卸活性 剂surface active agent /surfactantsurface tension表曲张力wetting润湿wetting agent / wetter润湿剂tarnish污化dra

17、g in/ drag out带进/带 出brushing / scrubbing磨刷abrasive磨料scrubber磨刷机mechanical cleaning机械清洗chemical clearing化学清洗浮石粉/ 火山灰pumice powersand blasting喷砂deburring去披峰/ 去毛刺mechanical polishing机械抛光chemical polishing化学抛光electropolishing电抛光etchant蚀刻剂/ 蚀刻液under etch侧蚀microetch微蚀over etching过腐蚀stripper剥离液bright dip浸亮

18、4.5电镀和涂覆Plating镀覆electrochemistry电化学electrolyte电解质electrolytic solution电解液electrochemical corrosion电化学腐 蚀chemical corrosion化学腐蚀onization电离migration迁移solubility溶解度addition agent/additive添加剂brightening agent/brightener光亮剂levelling agent整平剂catalyst/catalyzer催化剂activator/activating agent活化剂acceleration

19、agent/accelerator增速剂chelating agent/chelant螯合剂complex络和物swelling agent/sweller膨松齐1Jplasma等离子体electroplating电镀metal electroplating金属电沉 积bright plating光亮电镀PCB英语词汇（五）alloy plating合金电镀strike plating冲击镀flash/flash plating闪镀pulse plating脉冲电镀rack plating挂镀barrel plating滚镀brush plating刷镀selective plating选择性

20、电镀Auxiliary anode辅助阳极Auxiliary cathode辅助阴极Preplating镀前处理Postplating镀后处理Plating up电镀加厚Pattern plating图形电镀Panel plating整板电镀Copper (electro) plating电镀铜Tin-lead plating电镀锡铅Plating line电镀线Electroless plating, electroless deposition无电电镀Immersion plate浸镀Plated throughElectroless copper了 1仝屋伊holeplatingDire

21、ct plating直接电镀Roughening粗化Activating敏化Catalyzing催化Mentallization金属化Acceleration增速Chemisorption化学吸附Swelling溶胀Hole conditioning整孔Hole cleaning洗孔Desmear, smear去钻污Etchback凹蚀removalPlasma desmear等离子去钻污passivation钝化acid dipping弱浸蚀pickling强浸蚀hot melting热熔fusing fluid热熔液solder levelling焊料整平tin immersion浸锡so

22、lder焊锡solder coat焊锡涂层flux助焊剂preflux预焊剂organic solderability preservatives (OSP)有机保护剂black oxidation黑氧化brown oxidation棕氧化Pink ring粉红圈（环）pits麻点peeling起皮blister起泡orange peel桔皮pores针孔porosity孔隙率hardness硬度tarnish金属变色4.6机械加工和压制drilling钻孔numerical control (NC)数控back-up垫板entry material盖板spindle主轴ring / coll

23、ar钻套feed rate进给速率off set钻面不匀resin smear树脂钻污foil burr铜箔毛刺break-out破出hole counter数孔机laser via hole激光钻孔photo via hole光致穿孔plasma via hole等离子穿孔counterboring沉头孔（埋头孔）countersinking锥形孔platen热压板opening/daylight开档press plate压模板bonding layer /粘结层kraft paper牛皮纸bonding sheetamination void层间空洞dent凹蚀crease皱褶punchi

24、ng冲切bugle hole冷冲die冲模shearing / cutting喇叭孔routing铳切bevelling倒斜边chamfer倒角scoring刻糟V cutV槽切割Sewing hole缝纫孔Fixture夹具Indexing hole基准孔Tooling feature定位特征PCB英语词汇（六）（续上一页）5 .检测5.1通用术语nspection检验test试验as received验收态production board成品板test board测试板coupon附连板qualification testing鉴定试验acceptance tests验收试验acceler

25、ated test加速试验aging老化quality conformance testing质量一致性试验storage life贮存期specification规范standard标准tolerance容差/公差nonconformity不合格nonconforming item (unit)不合格品defect缺陷sampling11inspection抽样检验acceptable quality level (AQL)可接收质量水平5.2外观和尺寸visualblister起泡examination/visual目检nspectionblow hole气孔bulge凸起cracking

26、裂缝crazing微裂纹burr毛刺dishdown凹陷measling白斑delamination分层dent / indentation压痕fiber exposure露纤维wrinkle皱褶haloing晕圈hole breakout破环void空洞hole void孔壁空洞foreign material（基材内）外来物ifted land连接盘起翘nail heading钉头nick缺口nodule结瘤pin hole针孔pit麻点resin recession树脂凹缩scratch划痕bump凸瘤laminate void层压空洞mealing粉点shadowing / etch

27、back凹蚀阴影5.3电性能Surface insulation resistance (SIR)表明绝缘电阻Dielectric constant介电常数Dielectricstrength介电强度Dielectric breakdown介电击穿Dielectric withstanding耐电压 1Metal migration金属迁移voltageElectro migration电迁移Known good board (KGB)已知好板PCB英语词汇（七）（续上一页）5.4非电性能Bond strength粘合强度Pull-off strength拉脱强度Pull-out streng

28、th拉出强度Pull strength拉离强度Peel strength剥离强度Flexural strength弯曲强度Tensile strength拉伸强度Shear strength剪切强度Torsional strength抗扭强度Hole pull strength孔拉脱强度Pull away拉禺Tear strength撕裂强度Bow弓曲Twist扭曲Coefficient ofthermalexpansion (CTE)热导率Dimensional stability尺寸稳定性Machinability机械加工性Heat resistance耐热性Thermal stress热

29、应力Thermal shock热冲击Substrate bending test基板弯曲试验Bendability弯曲能力Fatigue life疲劳寿地Fatigue limit疲劳极限Fatigue strength疲劳强度Abrasion resistance耐磨（擦）性Wear resistance耐磨（损）性Crease褶痕Solderability可焊性Wetting焊料润湿Dewetting半润湿Nonwetting不润湿Microsectioning显微剖切Porosity test孔隙率试验Cleanliness清洁度Ionic cleanliness离子清洁度cni7ahi

30、a离子污染Nonionic contaminant非离子污染contaminantOrganic contamination有机污染Outgassing排气Self-extinguishing自熄性Chemical resistance耐化学性bleeding渗出6.组装surface mountsurface mount表卸组装技术component表卸组装兀件technology (SMT)(SMC)chip scale package (CSP) /chip scale mounting芯片级组装flip chip package (FCP)倒芯片封装soldering焊接reflow

31、soldering再流焊wave soldering波峰焊assembly density组装密度ead引线lead foot / lead引脚（腿）ead pitch引脚节距fine pitch devices (FPD)精细节距器件node连接节点chip carrier芯片载体ball grid array (BGA)球栅阵列chip / die / dice裸芯片flip chip倒装芯片active devices (parts)有源器件passive devices (parts)无源器件embedded component埋入元件add-on component附加元件integ

32、rated circuit (IC) |集成电路resin flux树脂（松香）助焊 剂bond焊（连）接electrical电桥接dross焊渣bridgingresidue残留物stress relief消除应力印制电路技术英语缩略语ALIVH (any layer inner via hole)任意层内部导通孔AOI (automatic optional inspection)自动光学检验BGA (ball grill array)球栅阵列BUM (build-up multilayer)积层式多层板BUT (build-up technology)积层式技术CAM (computer aided manufacturing)计算机辅助制造CCL (copper clad laminate)覆铜箔层压板CMT (chip mount technology)芯片安装技术CNC (computer numerical control)计算机数字控制COB (chip-on-board)载心片板CPCA (China Printed Circuit Association)中国印制电路行业协会CSP (chip scale packaging)芯片级封装DI (direct imagi