世界半导体生产机台安全设计验收标准

1、世界半导体生产机台安全设计验收标准 精品汇编资料GlobalSemiconductorSafetyServices,LLC SEMIS2-93AProductSafetyAssessmentFinalReport世界半导体生产机台安全设计验收标准AppliedMaterialsChemicalMechanicalPolishingSystemModel:MirraTrakCMP 工艺应用材料June19,1998Preparedfor:AppliedMaterials 3111CoronadoDrive SantaClara,CA95054Preparedby:GlobalSemiconduc

2、torSafetyServices,LLC1313GenevaDriveSunnyvale,CA94089GS3JobNo.980029GS3DocumentNo.980029F2Client-Confidential保密合约engineers.TheinformationwasalTheinformationusedtopreparethisreportwasbasedon interviewswithAppliedMaterials sobasedoninspectionsoftheChemicalMechanicalPolishingSystem,Model:MirraTrak.This

3、informationwasgatheredover theperiodbetweenFebruary2,1998andFebruary4,1998,andduringare-inspectionofthesystemonJune3,1998.Apreliminar yassessmentofthesystemwasalsoperformedonSeptember25,1996throughSeptember26,1996andtheresultsofthisevaluat ionwerealsoused.Allobservationsandrecommendationsarebasedonc

4、onditionsanddescriptionsoftheChemicalMechanic alPolishingSystem,Model:MirraTrak,duringthetimeofdatacollectionanduponinformationmadeavailabletoGlobalSemi conductorSafetyServices.ThisreportssignificanceissubjecttotheadequacyandrepresentativecharacteristicsoftheChemi calMechanicalPolishingSystem,Model:

5、MirraTrak,andtothecomprehensivenessofthetests,examinationsand/orsurveys made.ReferencetoGlobalSemiconductorSafetyServices,includingreproductionofGlobalSemiconductorSafetyServices cemark,inpromotionalmaterials,ispermittedonlywithGlobalSemiconductorSafetyServices expresswrittenconsent.Theserviceperfor

6、medhasbeenconductedinaccordancewiththestandardscurrentlyacceptedinourprofession,andatthehigh levelofskillandcareexercisedbyGlobalSemiconductorSafetyServices staff.Lastly,thisreporthasbeenpreparedasaClient-Confidentialdocument,intendedfortheexclusiveuseofAppliedMaterialsand forthepurposeofdocumentati

7、ontoSEMIS2-93A.Therefore,nooutsidedistributionwilloccurunlesswrittenauthorizationis providedbytheclient.TABLEOFCONTENTS目录SectionPageNo.Section2.0SCOPE（范围）Section3.0SYSTEMDESCRIPTION（系统描述）Section4.0ASSESSMENT&TESTINGMETHODOLOGIES（试验方法）Section5.0SAFETYASSESSMENT（安全评估）PURPOSE（目的）COPE（适用范围）AFETYPHILOSOP

8、HY（安全体系）ENERALGUIDELINES（指导方针）AFETY-RELATEDINTERLOCKS（安全互锁）HEMICALS（化学品）5.7IONIZINGRADIATIONON-IONIZINGRADIATIONOISE（噪音）VENTILATIONANDEXHAUST（ 通风与排凤）ELECTRICAL5.12EMERGENCYSHUTDOWN（紧急停机）5.13HEATEDCHEMICALBATHS5.14HUMANFACTORSENGINEERING5.15ROBOTICAUTOMATIONHAZARDWARNING（危险警告）EARTHQUAKEPROTECTION（地震警

9、告）DOCUMENTATION（ 文件）FIREPROTECTION（消防保护）ENVIRONMENTALGUIDELINES（环境方针）Section6.0RECOMMENDATIONS Section7.0-ILLUSTRATIONS ILLUSTRATION1-MirraTrakSystemLayoutATTACHMENTONE-SURFACELEAKAGECURRENTTEST（泄漏测试）ATTACHMENTTWO-GROUNDINGRESISTANCETEST（ 接地电阻测试）ATTACHMENTTHREE-VERIFICATIONOFEMO（紧急按钮确认）ATTACHMENTFOU

10、R-SOUNDPRESSURELEVELSURVEY（声压测试）ATTACHMENTFIVE-ERGONOMICCHECKLIST（人体功力检查表）ATTACHMENTSIX-MANUALHANDLINGLIFTANALYSIS（手动操作分析）ATTACHMENTSEVEN- 摘 HAT- IF? ” HAZARDANALYSIS（危险分析）ATTACHMENTEIGHT-SEMIS10-1296RISKASSESSMENTGUIDELINEMETHODOLOGYCONCLUSIONSectionl.OMANAGEMENTSUMMARYAfollow- upsafetyassessmentof

11、theAppliedMaterials ChemicalMechanicalPolishingSystem,Model:MirraTrak(hereafterreferredtoastheMirraTrak),wasperformedfromFebruary2,1998throughFebruary4,1998.Afurtherre-inspectionofthes ystemwasperformedonJune3,1998.ApreliminaryevaluationofthesystemwasalsoperformedonSeptember25,1996throug hSeptember2

12、6,1996,andtheresultsofthisevaluationwerealsoutilizedinthisreport.Notethatthisreportcoversonlytheconce rnsraisedbyintegratingthreeseparatesystems,theAppliedMaterialsFABSandMirraCMP,andtheOnTrakSynergyIntegra, whichtogetherformtheMirraTraksystem.Forfurtherinformationconcerningtheindividualcomponents,r

13、eferencetheindiv idualSEMIS2-93Areportsfortheseunits.(GS 3ReportNo.970668TF,datedJanuary30,1998fortheFABSsystem;GS 3Repor tNo.7-0100,datedSeptember2,1997fortheMirraCMPsystem;andGS 3ReportNo.980094F,fortheOnTrakSynergyIntegra .)ThisreviewwasperformedusingthecriteriaestablishedbytheSemiconductorEquipm

14、entandMaterialsInternationalSafet yGuidelinesforSemiconductorManufacturingEquipment(SEMIS2-93AGuidelines).GS3hasusedtheSEMIS10-1296GuidelineMethodologytoperformaRiskAssessmentofanyIssuesremainingaftertherevie woftheinformationprovidedbyAppliedMaterials.NotethattheseveritywasrankedbyGS 3;theLikelihoo

15、d(expectedrateofo ccurrence)wasprovidedbyAppliedMaterials.Itemswhichwererankedonlyasa摄ow” or措light “ riskassessmentcategorymaybeconsideredasacceptablewithoutcorrectiveaction,baseduponcriteriaintheSEMIS10 -1296Guidelines.DuringthesafetyassessmentofMirraTrak,GS 3identifiedseveralpositiveengineeringdes

16、igns,aswellasseveralissuesthatwi llneedtobeaddressedinordertoachievefullcompliancewithSEMIS2-93AGuidelines.Thisdescriptionofbothpositiveengi neeringdesignandnon-conformanceissuesarecomprehensivelydescribedinSection5.0ofthisreport.ReferenceSection6.0 forasummaryoftheoutstandingitems.Section2.0SCOPEGS

17、3wascontractedbyAppliedMaterialstoconductaSEMIS2-93AProductSafetyAssessmentoftheMirraTrak.Notethatthi sreportcoversonlytheadditionalconcernsraisedbyintegratingtheAppliedMaterialsFABSandMirraCMPandtheOnTrakS ynergyIntegratogethertoformtheMirraTraksystem.Forfurtherinformationconcerningtheindividualcom

18、ponents,referen cetheindividualSEMIS2-93Areportsfortheseunits.(GS3ReportNo.970668T3F,datedJanuary30,1998fortheFABS;GS 3ReportNo.7-0100,datedSeptember2,1997fortheMirraCMP;andGS 3ReportNo.980094FfortheOnTrakSynergyIntegra).GS3isajointventurepartnershipbetweenIntertekTestingServices,N.A.,(ITS)andEnviro

19、nmentalandOccupationalRiskM anagement,Inc.(EORM ?).GS3isfocusedonprovidingriskmanagement-basedequipmentsafetyconsultingandtestingservi cestosupportabroadrangeofsafetyneedsspecifictosemiconductormanufacturingequipmentanddevicemanufacturers.TheMirraTrakwasevaluatedforcompliancewiththeapplicablecodesan

20、drequirementsoftheUnitedStates.There-inspectionassessmentwasperformedbyMr.AndrewKileyandMr.MichaelVargaofGS 3andreviewedbyMr.PavolBr ederandMr.AndrewMcIntyre,CIH,alsoofGS 3.Thesafetyassessmentwasbasedonanin-plantinspectionoftheMirraTrak,discussionswithMs.LisaPowellofAppliedMater ials,aswellasareview

21、ofthesystemsmanuals.2.1STANDARDSUSEDTheassessmentwasconductedinaccordancewiththeapplicableportionsofthefollowingcodesandstandards:A) SEMIS2-93A,SafetyGuidelinesForSemiconductorManufacturingEquipment(1996Edition)B) ANSIS1.13-1971,MethodsfortheMeasurementofSoundPressureLevels(1986Edition)C) ANSI/UL126

22、2,SafetyStandardforLaboratoryEquipment(ThirdEdition)D) ANSI/NFPA79,ElectricalStandardforIndustrialMachinery(1994Edition)E) ANSI/NFPA70,NationalElectricalCode(1996Edition)F) UL50,SafetyStandardforEnclosuresforElectricalEquipment(TenthEdition) G)SEMIDoc.S8-95,SafetyGuidelineforErgonomics/HumanFactorsE

23、ngineeringofSemiconductorMan ufacturingEquipment.(1995Edition)H) SEMIS1-90,SafetyGuidelineforVisualHazardAlerts(1993Edition)I)ANSI/UL73,SafetyStandardforMotor-OperatedAppliances(EighthEdition)J)ANSI/S1.4-1984,SpecificationsforAcousticalCalibratorsK)21CFR,CodeofFederalRegulations,Part1000to1050.L) AN

24、SI/UL3101-1,SafetyStandardforElectricalEquipmentforLaboratoryUse(FirstEdition)M) SEMIS10-1296,SafetyGuidelinesforRiskAssessment(1996Edition)2.2TESTSPERFORMEDInordertoverifycompliancewithSEMIS2-93AGuidelinesandtheotherapplicablestandards,thefollowingtestswereperfor med:SurfaceLeakageCurrentTestGround

25、ingResistanceTestVerificationofEMOsSoundPressureLevelSurveyNotethatonlythetestsnotedabovewererepeated,asthetestingoftheindividualassemblies(FABS,Mirra,andOnTrakSynerg yIntegra)wasperformedasapartoftheindividualevaluationsforeach.Referencetheindividualreportsforeachfortestresults.Section3.0SYSTEMDESC

26、RIPTIONTheMirraTrakconsistsofaFABSwaferhandlingmodule,aMirraChemicalMechanicalPolisher(CMP),andanOnTrakSyne rgyIntegra.Anoperatorcanloaduptofour8” wafercassettesatthefrontoftheFABSmoduleatonetime.CassettesmaybemovedintopositionforhandlingbytheFABSusinganoptionalergoloaderorbymanualrotationofthecasse

27、tte.TheFABSrobotthen picksupthewafersfromthecassettes,placestheminanalignmenttool,andthenpassesthewaferstotheCMP担extendedrobotwaferhandlingmoduleforconveyancetotheCMP.TheCMPsystemismodularandconsistsofawaferhandlingmodule(whichmovesbetweentheFABS,SynergyIntegra,andC MP),apolishingmodule,aslurrydeliv

28、erymodule,andacontrolsystemmodule.Thesystemusesde-ionizedwater,cleandryair (CDA),nitrogen,vacuum,andslurry.Theslurryisprovidedbytheend-usertothesystemthroughabulkheadfacilityconnectio n.TheCMPisdesignedforoxideetchingandmetaletchingandisintendedforusewithavarietyofslurrychemistries,including basican

29、dacidicslurries,butthissystemwasdesignedonlyfortheuseofapotassiumhydroxide(KOH)slurry,eventhoughother chemistriescouldbeused.Thewaferhandlingmoduleisanexternalrobotictoolthatmanipulatesthewafercassettesfordeliver ytothepolishingmodule.Thepolishingmoduleconsistsofthreepolishingheadsarrangedonamechani

30、calpositionercalledac arrousel.Apolishingheadpicksupawaferanddeliversittoapolishingpadwhereitispolished.Asthewaferispolished,theslurr ydeliverymoduledispersesameasuredflowofslurry.Whenallpolishingstepsarecomplete,thecarouseltransfersthewaferba cktotheexternalCMProbotwhereitisdeliveredtotheOnTrakSyne

31、rgyIntegra.TheOnTrakSynergyIntegraisadoublesidedwafercleanerusingoptionsforavarietyofchemicalprocesseswhichoperateinc onjunctionwiththemechanicalprocesses.TheSynergyIntegrausesCDA,nitrogen,orargon.ItalsousesD.I.waterandammo niumhydroxide(NH 4OH)ata2%or29%concentration.WhiletheSynergyIntegraisabletou

32、sehydrofluoricacid(HF)inoneof itsprocesses,thecurrentMirraTrakconfigurationisnotdesignedtouseHFandwasnotevaluatedforitsuse.TheSynergyIntegr aconsistsofaninputstation,twobrushstations,aspinstation,anunloadhandler,andanoutputstationwhichpassesthewafersba cktotheFABSwhichreturnsthewaferstotheiroriginal

33、cassetteswheretheyareunloadedbytheoperator.FacilitiesRequirements:ElectricalPower: 208VAC,200A,3phase,60Hz.ExternalFluids: Cleandryair: 90-110psi,1.2cfmNitrogen:90-110psi,1cfmVacuum:25inch.HgDIwater:75psi,6gpmSlurry:0-5psi,0.25lpmSection4.0ASSESSMENT&TESTINGMETHODOLOGIESThecriteriaforthisevaluationw

34、asbasedupontheSemiconductorEquipmentandMaterialsInternationalSEMIS2-93AGuid elines.SEMIS2-93AGuidelinesareperformance-basedguidelinesdesignedtoidentifypotentialhazardsduringtheoperatio nandmaintenanceofequipment,sothattheeffectivenessoftheengineeringcontrolsandfail-safesystemscanbemaximized.T heguid

35、elinesaddressthefollowingaspects:APPLICABLESECTIONS Safety-RelatedInterlocks ChemicalsAudioNoiseVentilationandExhaustNON-APPLICABLESECTIONSIonizingRadiationNon-IonizingRadiationHeatedChemicalBathsRoboticsandAutomationElectricalEmergencyShutdownErgonomics/HumanFactorsHazardWarningEarthquakeProtection

36、DocumentationFireProtectionEnvironmentalThenon-applicablesectionsaresupportedbyengineeringrationaleprovidedwithinthisreport.Toverifycompliancewiththeapplicableguidelinesandstandards,thefollowingtestswereperformed.Thetestdatasheetsarei ncludedintheattachmentstothisreport.SurfaceLeakageCurrentTest(Sec

37、tion11.3.3ofS2-93AandSection6.7ofUL1262) -Surfaceleakagecurrentmeasureme ntsweremadebetweenallaccessiblemetalpartsandground,toverifycompliancewiththemaximumacceptablesurfaceleaka gecurrentof3.5milliamperes.(AttachmentOne)GroundingResistanceTest(Section11.3.3ofS2-93AandSection6.4.2ofUL1262) -Groundin

38、gresistancemeasurements weremadebetweenallaccessiblemetalpartsandground,toverifycompliancewiththemaximumacceptablegroundpathresis tanceof0.1ohm.(AttachmentTwo)VerificationofEMO/Interlocks(Sections5.6and12.1) -Withthesystemrunningatmaximumnormalload,theemergency offbuttonswereactivatedtoverifypropero

39、peration.(AttachmentThree) SoundPressureLevelSurvey(Section9.1) -SoundpressurelevelsweremeasuredperANSIS1.13-1971(R1986),MethodsfortheMeasurementofSoundPressureLevels.Soundpressurelevelswererecordedwiththesystemrunningatmaximumno rmalloadtoverifycompliancewiththemaximumacceptablenoiselevelof80dB(A).

40、(AttachmentFour)Notethatonlythetestsnotedabovewererepeatedasthetestingoftheindividualassemblies(FABS,MirraandOnTrakSynergy Integra)wasperformedasapartoftheindividualevaluationsforeach.Referencetheindividualreportsforeachfortestresults.Section5.0SAFETYASSESSMENTAnassessmentoftheMirraTrakwasperformedi

41、naccordancewiththeSEMIS2-93AGuidelinesandotherapplicablestandard snotedinSection2.0(Scope).EXPLANATIONOFREPORTFORMATUnlessotherwisespecified,allreferencedsectionsbelowrefertotheSafetyGuidelinesforSemiconductorManufacturingEq uipment(SEMIS2-93AGuidelines).Thereportstructureismodeledafterthedocumentat

42、ionrequirementsofSEMIS2-93A Guidelines.EachparagraphoftheSEMIS2-93AGuidelinesiseitherpresentedverbatimorparaphrasedinaboxontheleftofthepage.Thep aragraphsfromtheSEMIS2-93AGuidelinesarepresentedwiththeircorrespondingnumbersfromtheGuidelines,withtheex ceptionthatthesenumbersareproceededbya5.Directlyto

43、therightofthisboxisasecondboxwhichisusedtoindicatethestat usoftheequipmentwithrespecttothegivenrequirementoftheGuidelines.SEMIS2-93AParagraphNo.( precededby5.) Statementoftherequirement.MEETS口ISSUEINFOREQUIRED RESPONDEDN/A口ADD口 REFBelowtheseboxes,anexplanationisgivenwhichexplainswhythatparticularsta

44、tusboxwaschecked.Thisexplanationtakeso neofthefollowingnineformswhichcorrespondtotheninestatusboxesabove.MEETSAsectionmarked MEETS withrespecttoagivenparagraphoftheGuidelinessignifiestheconstructionfeaturescritic altocompliancewiththeSEMIS2-93Acriteriaweredirectlyobservedbytheengineerduringtheevalua

45、tion.Thesecritic alfeaturesareidentifiedanddescribed.ISSUESIfaconstructionfeaturedoesnotmeetthespecifiedparagraph,thewayinwhichitdeviatesfromtheGuidelinescriteriaisde scribed.ISSUES wererankedusingariskassessmentmethodologybaseduponSEMIS10-1296.Eachitemwasassig nedanoverallriskrankingbaseduponadeter

46、minationoftheseverityofthehazardposedbytheIssueandthelik elihoodthatthehazardwouldoccurresultinginahazardousconsequence(i.e.,injury,equipmentdamageoren vironmentalhazard).Issueswith摄ow” or措light “ riskassessmentcateesonaybeconsideredasacceptablewithoutcorrectiveaction,baseduponcriter iaintheSEMIS10-

47、1296Guideline.Asummaryoftheriskassessmentmethodologyusedforthisevaluationisi ncludedinAttachmentEightofthisreport.INFORMATIONREQUIRED(INFOREQUIRED)Ifinadequateinformationisavailabletodeterminecomplianceornon-compliance,then INFORMATIONREQUIREDismarked.Theadditionalinformationwhichisneededtoevaluatet

48、hesystemisalsoidentified.RESPONDEDIftheoriginalevaluationrevealedthatthesystemdoesnotmeetaparticularrequirementoftheGuidelinesandthemanufac turerhascommittedtomakingsuitablechangeswhichwillbringthesystemintocompliance,thenthisparticularrequirem entoftheGuidelinesismarked RESPONDED .The RESPONDED des

49、ignationrequiresthatthemanufacturerscor rectiveactionadequatelyaddresstheissuesraisedintheoriginalevaluation.Also,themanufacturermustcommittoanact iondatebywhichtheconstructionchangeswillbefullyimplemented.All RESPONDED sectionswilldescribetheori ginalissuesraised,theconstructionchangesproposedbythe

50、equipmentmanufacturer,andthedatebywhichthosechang eswillbeimplemented. NON-APPLICABLE(N/A) AnyrequirementsoftheGuidelineswhichdonotapplytoaparticularsystemareidentifiedas NON-APPLICABLE . ADDRESSED(ADD) IftherequirementsstatedinagivenparagraphoftheGuidelinesaremoreappropriatelydiscussedindetailunder

51、anothers ection,thenthissectionoftheGuidelinesisidentifiedas ADDRESSED .Theparagraphunderwhichtheseissuesaredis cussediscitedforreferencepurposes. REFERENCEONLY(REF)SomeparagraphsoftheGuidelinespresentdefinitionsonsafetyorphilosophyandareforreferenceonly.Therearenospec ificrequirementsdesignatedbyth

52、eseparagraphs.Allsectionsofthistypearemarked REFERENCEONLY .5.1PURPOSE5.1-Theseguidelinesareintendedasaminimumsetofperformancebasedenvironme ntal,healthandsafetyconsiderationsforequipmentinsemiconductormanufacturin g.MEETS口ISSUE口INFOREQUIRED口RESPONDED口N/A口ADD口 REFXREFERENCEONLYAnassessmentofAppliedM

53、aterials MirraTrak,wasconductedinaccordanceWShfhtyGuidelinesforSemiconductorManufacturingEquipment(SEMIS2-93AGuidelines)basedonsoundengineeringanddesignpractices.Referenceswereals omadetoanyknownapplicableIndustrySafetyStandards,Building,Fire,andElectricalCodes,aswellasanyGovernmentRe gulatoryRequir

54、ements.5.2SCOPE25.2SCOPE025.2SCOPE5.2-Theseguidelinesapplytoequipmentinthemanufacturing,metrology,assembly andtestingofsemiconductorproducts.MEETS口ISSUE口INFOREQUIRED口RESPONDED口N/A口ADD口 REFXREFERENCEONLYTheintegrationoftheindividualmodules(FABSwaferhandlingmodule,aMirraChemicalMechanicalPolisher(CMP)

55、,anda nOnTrakSynergyIntegra)wasevaluatedagainsttheSEMIS2-93AGuidelinesandotherapplicablestandards.5.3SAFETYPHILOSOPHY25.3SAFETYPHILOSOPHY025.3SAFETYPHILOSOPHY5.3.1-Theseguidelinesshouldbeusedtohelpeliminateknownsafetyandhealthha zardsinherentintheoperationandmaintenanceofprocessequipment.Industrysta

56、 ndards,building,electricalandfirecodes,governmentregulatoryrequirements,an dgoodpracticeshouldbeconsideredinallequipmentdevelopmentprograms.MEETS口ISSUE口INFOREQUIRED口RESPONDED口N/A口ADD口 REFXREFERENCEONLYTheintentofSEMIS2-93AGuidelinesistominimizeoreliminateknownsafetyandhealthhazardsbyhavingthemanufa

57、cturer designtheequipmentwiththeapplicableindustrialsafetystandards,codes,andregulatoryrequirementsinmind.Aspartofthis safetyassessment,GS3hasevaluatedtheMirraTrakagainstseveralapplicablestandards,codes,andregulatoryrequirements, asnotedinSection2.0 SCOPE ofthisreport.Resultsofourfindingsaresummariz

58、edinthisS2-93AEngineeringReport.5.3.2-Nosinglepointfailureoroperationalerrorshouldallowimmediateexposuresit uationofpersonnel,facilitiesorcommunitytohazardsordirectlyresultininjury,deat horequipmentloss.Allequipmentshouldbefail-safeorofafault-tolerantdesign.MEETS口ISSUE口INFOREQUIRED口RESPONDED口N/A口ADD

59、X REFADDRESSEDThereviewofpotentialhazardsasaresultofsinglefailureoroperationalerrorisaddressedinSection5.4,Paragraph5.3.3-Thefollowingareasofconcernintheoperationandmaintenanceoftheequipm entareaddressed:Chemicalshazards/Radiationhazards/Electricalhazards/Physic alhazards/Mechanicalhazards/Environme

60、ntalhazards/Fireandexplosions/Seism icactivityhazards/VentilationandErgonomics.MEETS口ISSUEINFOREQUIRED口 RESPONDEDN/A口ADD口 REFXREFERENCEONLYThisS2-93AEngineeringReportdocumentsanyapplicablesafetyconcernsrelatingtothesemiconductormanufacturingequ ipment.Refertothespecificsectionsofthisreportfordetails