软硬结合板简介及关键参数介绍

1、Rigid-Flex Presentation软硬结合板简介及关键参数介绍第1页2Content: Material Introduction Design rule Standard Process Flow Open Discussion软硬结合板简介及关键参数介绍第2页3 1.軟板基材薄膜種類 聚脂樹脂(Polyester,PET)-尺寸熱安定性不如 PI Aramid纖維布-高吸水性，單價及使用性並不理想 強化型介電材料 撓曲性較差且供應者與使用者不多 氟素樹脂膜-無法在高溫下維持尺寸穩定 聚亞醯胺樹脂(Polymide,PI)- 熱聚合後仍保一定柔軟與彈性，同時在很寬操作範圍下有不

2、錯電氣特征故最常使用。Material Introduction软硬结合板简介及关键参数介绍第3页4 2.聚亞醯胺基材種類 依軟板結構分為兩大類 1.有接著劑三層軟板基材(3L FCCL) 2.無接著劑二層軟板基材(2L FCCL) 兩者分屬不一样製造過程，製造方式與材料特征不一样。3L應用在大宗軟板產品， 2L用在較高階軟板製作上，例：軟硬複合板、COF。以單面板為例COPPERPI銅箔基板(FCCL)高尺寸安定需求高密度線路需求耐化性需求電氣特征需求耐燃性需求環保需求COPPERAdhesivePI銅箔基板(FCCL) 2L-FCCL 3L-FCCLMaterial Introductio

3、n软硬结合板简介及关键参数介绍第4页5 2-1.聚亞醯胺薄膜簡介 聚亞醯胺薄膜(Polyimide,簡稱 PI)，外觀呈黃棕色，是由芳香族雙酐類 及雙胺類合成聚亞醯胺酸高分子(簡稱PAA)，之後經高溫熱化脫水形成。 2-2.品目型號說明 各家標示項目不盡相同， 以台虹3L-FCCL為例： Material Introduction软硬结合板简介及关键参数介绍第5页63.2L-FCCL製造方式與比較Production MethodCross-Section塗佈法(Casting)濺鍍法(Sputtering)壓正当(Lamination)Chill rollPI filmTargetVaccu

4、mChamberPAAHeaterPAAHeaterCopper foilPlating CuSputter metalPI filmCopper foilPAACopper foilTPIPI filmMaterial Introduction软硬结合板简介及关键参数介绍第6页73.2L-FCCL製造方式與比較方法塗佈法(Casting)濺鍍法(Sputtering)壓正当(Laminate)銅箔選擇性ED,RA限EDED,RA銅箔厚度薄銅(9um)有良率問題可自由控制厚度薄銅(9um)有良率問題雙面板製造性較複雜與困難相對轻易相對轻易接著特征優尚可優生產性優差尚可基板透明性尚可(有改进空間

5、)優優成本低高中生產廠商代表Nippon Steel（新日鐵）Sumitomo Metal(住友）Ube(宇部興業)Material Introduction软硬结合板简介及关键参数介绍第7页8 資料來源：JMS；工研院IEK-ITIS計劃(/3)4.全球 FCCL廠商 3L FCCL / 2L FCCL概況ManufacturerAdhesive typeAdhesiveless typeARISAWATORAYNippon Steel(新日鐵)NIKKANNippon Mektron(NOK)UBE(宇部興產)Mitsui Chemical(三井化學)Dupont(杜邦)3MTHINFLE

6、X(台虹) 表量產 表小量產、試產或送樣中Material Introduction软硬结合板简介及关键参数介绍第8页9CVL Cover layStructureRemark1.Protect circuit2.IsolationPI film AdhesiveRelease paperMaterial Introduction软硬结合板简介及关键参数介绍第9页10StructureRemarkPPNon-flow or Low-flow PPBSThickness:15um, 25um, 40umBonding material1.PP Prepreg1.BS Bonding sheetR

7、elease paperAdhesivePET filmEpoxy &Glass fiberMaterial Introduction软硬结合板简介及关键参数介绍第10页11EMI material1.Silver filmStructureRemarkEx: SF-PC5000SF-PC1000(32um)SF-PC5000(22um)SF-PC5500(22um)Material Introduction软硬结合板简介及关键参数介绍第11页12Content: Material Introduction Design rule Standard Process Flow Open Disc

8、ussion软硬结合板简介及关键参数介绍第12页13Working Panel Size Popular Working Panel SizeB. Usable area , Border (A, B) and Routing Path (C)Structure typeMIN. AMIN. BMIN. CMIN. C *InchmmInchmmInchmmInchmmPCB (1 press)0.4711.430.6516.510.12.540.31.07.6225.4PCB (2 press)0.5513.970.7017.780.12.540.31.07.6225.4HDI (1 pre

9、ss)0.5513.970.7017.780.12.540.31.07.6225.4HDI (2 press)0.6516.510.8020.320.12.540.31.07.6225.4HDI (3 press)0.7519.051.0040.31.07.6225.418X20 inch457.2 x 508 mmWidth XLength YC C A B PCBPCBPCBPCB* PCB with 1. G/F Design2. Impedance couponDesign Rule软硬结合板简介及关键参数介绍第13页14Optimized. Array Size1

10、6“X19.685”4.4212“x4.6”(77%)3.517“x4.6”(77%)4.4212“x3.425”(77%)3.517“x2.72”(76%)17“X19.685”4.4212“x4.8”(76%)3.517“x4.8”(76%)4.4212“x3.675”(77%)3.517“x2.92”(76%)18“X19.685”4.4212“x5.1”(76%)3.517“x5.1”(76%)4.4212“x3.925”(78%)3.517“x3.12”(77%)Panel typePanel size Optimized Panel Utilization Design Rule软

11、硬结合板简介及关键参数介绍第14页15NF Prepreg NF Prepreg FCCLNF Prepreg NF PrepregL1L2L3L4L5L6Flex areaRigid AreaTransition ZoneRigid AreaDesign Rule软硬结合板简介及关键参数介绍第15页16FCCLFCCL: Flex Copper Clad LaminateCVL: Cover layerStiffener: FR4/PI/Stainless base ReinforcementLow flow Prepreg: Resin scale flow lower than norm

12、al typeBS: Bonding SheetSF: Silver Foil (EMI shielding)Partial CVLComponent on flexPlus II- stack viaSqueeze out (from Low flow Prepreg)Terms & Definition:Design Rule软硬结合板简介及关键参数介绍第16页17UMT StandardUMT Advanced1eSMT pad (edge of pad) to board edge spacingRigid/Flex400um300um2dShield can (edge of gro

13、und) to board edge spacingRigid/Flex300um200um3dGround plane to board edge spacingRigid/Flex300um200um4dPower plane to board edge spacingRigid/Flex300um200um5cTrace (edge of trace) to board edge spacing Rigid/Flex400um250um6aMicro-via (edge of pad) to board edge spacingRigid/Flex400um300um7bPlated t

14、hrough hole (edge of pad) to board edge spacingRigid/Flex400um300um8bNon plated through hole to board edge spacing (no pad)Rigid/Flex300um200um9bBuried via (edge of pad) to board edge spacingRigid/Flex400um300umdFlex AreaBoard edgeBoard edgeabcFlex AreaBoard edgeBoard edgeeFlex AreaBoard edgeBoard e

15、dgeTrace and component pad at transition zone:Design Rule软硬结合板简介及关键参数介绍第17页18UMT StandardUMT Advanced10FAdhesive squeeze outRigid/Flex0.80mm0.50mm11GMinimum flex width Flex2.00mm1.00mm12HFlex outline radiusFlex1000um500um13IMilling pathRigid/Flex1.00mm0.80mmGHRigid PCBRigid PCBFIFlex areaMechanical

16、design at transition zone:Design Rule软硬结合板简介及关键参数介绍第18页19ItemDesign IssueUMTStandard GuidelineUMTAdvanced GuidelineS1Minimum S1 bending to board edge distance1.00mm0.80mmS2minimum flexible area (edge of FPC) to board edge spacing2.00mm1.50mmS1Flexible areaRigid areaS2Mechanical design at transition

17、zone:Design Rule软硬结合板简介及关键参数介绍第19页20Rigid sectionRigid sectionPunch with hard die requirement, UMT suggest to place radius 0.50mm. (Change from right angle to radius. Only UV laser cutting can make it right angle.)BeforeBeforeAfterAfterMechanical design for flex radius:Design Rule软硬结合板简介及关键参数介绍第20页2

18、1Rigid sectionRigid sectionRadius only 0.2mmPunch with hard die requirement, UMT suggest to place radius 0.50mm. (Change from right angle to radius. Only UV laser cutting can make it right angle.)BeforeAfterMechanical design for flex radius:Design Rule软硬结合板简介及关键参数介绍第21页22UMT suggest to make this was

19、te slot as min. 1.50mm wide.Rigid sectionRigid section1.25mmNominal 2.00mmOr min. 1.50mmBeforeAfterMechanical design for flex outline:Design Rule软硬结合板简介及关键参数介绍第22页23UMT suggest to make these corners as full radius.Rigid sectionRigid sectionKey points:The quality of appearance inspection for these co

20、rners will be better. (Burr-both rigid and flex material will be less than previous design.BeforeAfterMechanical design for flex outline:Design Rule软硬结合板简介及关键参数介绍第23页24UMT suggest to place two pcs in zero degree direction and the other two pcs in 180 degree rotation.YXRigid sectionRigid sectionKey P

21、oints:All outline should be symmetrical. (Incl. waste material slot)Mechanical design for panelization:Design Rule软硬结合板简介及关键参数介绍第24页25Provide tear resistance, UMT suggest to place recessed slot at the transition zone.Rigid sectionRigid sectionKey Points:A recess slot would decrease the stress. Recom

22、mended slot width:Min. 1.50mm; Nominal:2.00mmMechanical design for transition zone: Design Rule软硬结合板简介及关键参数介绍第25页26Mechanical design for bending criteria: Radius & Flex lengthDesign Rule软硬结合板简介及关键参数介绍第26页27Content: Material Introduction Design rule Standard Process Flow Open Discussion软硬结合板简介及关键参数介绍

23、第27页28TYPE 1 (STANDARD PROCESS)TYPE 2 (PMF PROTECT FLEX) LASER CUTTING (For Remove FR4)TYPE 3 (FR4 PROTECT FLEX) CONTENT:软硬结合板简介及关键参数介绍第28页TYPE 1 PROCESS (Standard)(For Flex Without Edge Finger or SMT Pads)软硬结合板简介及关键参数介绍第29页30UnimicronUnimicron(TYPE 1)A. Stack up & Structure 3+(2F)+3软硬结合板简介及关键参数介绍第3

24、0页31(L45)Flex Material Wait for Combination With Rigid materialCover layer Material Lamination(Flex core with CVL)CVL- CuttingMechanical Drilling(I)Inner Layer (image transfer) DES Line (develop, etch, strip) AOI (automatic optical inspection) Oxide Treatment P.T.H & Copper PlatingLaminate Cutting(T

25、YPE 1)B. Process Flow - Flex(L4-L5)Sub processMain process软硬结合板简介及关键参数介绍第31页32L36 Plus I ProcessConformal Mask (image transfer) DES Line (develop, etch, strip) AOI (automatic optical inspection) Ply-Up Of LayerLamination L45-coreBlind & Copper PlatingLaser DrillingBlaser AOIInner Layer (image transf

26、er) DES Line (develop, etch, strip) AOI (automatic optical inspection) Oxide Treatment Wait for Build up to L27Non flow Prepreg Material Prepreg Routing (TYPE 1)B. Process Flow - Rigid-Flex (L3 & L6) Plus ISub processMain process软硬结合板简介及关键参数介绍第32页33L27 Plus II ProcessConformal Mask (image transfer)

27、DES Line (develop, etch, strip) AOI (automatic optical inspection) Ply-Up Of LayerLamination L36-coreBlind & Copper PlatingLaser DrillingBlaser AOIInner Layer (image transfer) DES Line (develop, etch, strip) AOI (automatic optical inspection) Wait for Build up to L18Non flow Prepreg Material Prepreg

28、 Routing Oxide Treatment (TYPE 1)B. Process Flow - Rigid-Flex (L2 & L7) Plus IISub processMain process软硬结合板简介及关键参数介绍第33页34L18Plus III ProcessLay UpLamination L27-coreConformal Mask (image transfer) DES Line (develop, etch, strip) AOI (automatic optical inspection) P.T.H & Copper PlatingMechanical Dr

29、illing(I)Laser DrillingBlaser AOIOuter Layer (image transfer) DES Line (develop, etch, strip) AOI (automatic optical inspection) Solder MaskImmersion GoldRouting Hard Die PunchingO/S TestingOQCPacking &ShippingNon flow Prepreg Material Prepreg Routing (TYPE 1)B. Process Flow - Rigid-Flex (L1 & L8) P

30、lus IIISub processMain process软硬结合板简介及关键参数介绍第34页TYPE 2 PROCESS (PMF Protect Process)(For Flex With Edge Finger or SMT Pads)软硬结合板简介及关键参数介绍第35页36UnimicronUnimicron(TYPE 2)A. Stack up & Structure 1+(1+2F+1)+1 软硬结合板简介及关键参数介绍第36页37(L34)Flex Material Tooling DrillLaminate CuttingInner Layer L3/L4 (image t

31、ransfer) DES Line (develop, etch, strip) AOI (automatic optical inspection) Wait for Combination With Rigid materialCover layer Material Lamination(Flex core with CVL)CVL- CuttingPumiceStiffener Material Stiffener ShearingLamination(Flex core with stiffener)PMF Material PMF ShearingLamination(Flex c

32、ore with PMF)BakingLaminationFlex core with PMFSub processMain processPlasma Brown OxideB. Process Flow - Flex(L3-L4)(TYPE 2)软硬结合板简介及关键参数介绍第37页38Build Up L2-L5(Plus I)Wait for Build up to L1/L6PP CuttingLamination(with flex core)Blaser AOIMechanical Drill(L2-L5)Plug viaburied via L2-L5)ScrubbingInne

33、r Layer L2/L5 (image transfer)AOI (automatic optical inspection)Conformal Mask (image transfer) DES Line (develop, etch, strip) AOI (automatic optical inspection) Laser Drilling(L2-L3/L4-L5)P.T.H & Copper PlatingDES Line (develop, etch, strip)B. Process Flow - Rigid-Flex (L2 & L5) Plus I(TYPE 2)Sub

34、processMain process软硬结合板简介及关键参数介绍第38页39L1-L6 ProcessLay upLamination Conformal Mask (image transfer) DES Line (develop, etch, strip) AOI (automatic optical inspection) L25-build up ICopper Reduction(by chemical)Electro-plating(filled via)Laser Drilling(L1-L2/L5-L6)Blaser AOIMechanical Drill P.T.H &

35、Copper PlatingOuter Layer L1/L6 (image transfer)DES Line (develop, etch, strip)AOI (automatic optical inspection)Routing-2O/S Testing OQCPacking &ShippingSolder MaskImmersion GoldRouting-1Remove rigid waste area above flex areaPSF Lamination(cover rigid area)Plating hard gold(finger on flex)Remove P

36、SF Flex PunchPP routingB. Process Flow - Rigid-Flex (L1 & L6) Plus II(TYPE 2)Sub processMain process软硬结合板简介及关键参数介绍第39页LASER CUTTINGDIAGRAM软硬结合板简介及关键参数介绍第40页41LASER CUTTING DIAGRAM FOR CAP REMOVAL Step 1Transition LineTransition LineStep 2Step 3Laser stop (target) copper design in L2/5Laser Drill fro

37、m top to L2 & bottom to L5Etch away target copper in L2&5Remove FR4 cap above Flex along with laser cutting path软硬结合板简介及关键参数介绍第41页TYPE 3 PROCESS (FR4 Protect Process)(For Flex With Edge Finger or SMT Pads)软硬结合板简介及关键参数介绍第42页43(TYPE 3)A. Stack up & Structure 2+(2F)+2 软硬结合板简介及关键参数介绍第43页44B. Process Flo

38、w - Flex(L3-L4)(L34)Flex Material Mechanical Drilling(I)P.T.H & Copper PlatingLaminate CuttingInner Layer & DES (image transfer)AOI (automatic optical inspection)Oxide TreatmentWait for Combination With Rigid materialCover layer Material Lamination(Flex core with CVL)CVL- DrillingLaminationFlex core

39、 with CVLCVL- PunchSub processMain processSub processMain process(TYPE 3)软硬结合板简介及关键参数介绍第44页45B. Process Flow Rigid Inner CoreRigid Inner Core ProcessWait for Build up to L25Bonding Sheet Material BS DrillingCore drillingLaminate CuttingInner Layer & DES (image transfer)AOI (automatic optical inspect

40、ion)CORE-CuttingSoft Bonding(Core with BS) BS - PunchSub processMain process(TYPE 3)Bonding Sheet (BS)Inner core (one side copper)软硬结合板简介及关键参数介绍第45页46B. Process Flow Rigid-Flex (L2 & L5) Plus IIL25 ProcessLamination(Flex with Rigid )Micron viaCopper PlatingInner Layer & DES (image transfer)(L2/L5) AOIOxide TreatmentWait for Build up to L16Rigid Rigid FlexConformal Mask (image transfer) DES Line (develop, etch, strip) AOI (automatic optical inspection) Laser Drilling(L2-L3/