IPC提供的标准清单080221

AssembelyMaterials,,装配材料

Flux/Solder,,焊锡与助焊剂

J-STD-004,J-STD-004A-RequirementsforSolderingFluxes,焊锡之助焊剂要求

J-STD-005,J-STD-005-RequirementsforSolderingPastes,锡膏要求

J-STD-006,J-STD-006B-RequirementsforElectronicGradeSolderAlloysandFluxedandNon-FluxedSolidSoldersforElectronicSolderingApplications,电子焊接应用中的电子级锡焊合金与助焊和非助焊固体焊锡的技术指标

IPC-TP-1043,TP-1043-Cleaning&CleanlinessTestProgramPhase3WaterSolubleFluxesPart1,清洗和洁净度测试程序第3阶段水溶助剂第1部分

IPC-TP-1044,TP-1044-Cleaning&CleanlinessTestProgramPhase3WaterSolubleFluxesPart2,清洗和洁净度测试程序第3阶段水溶助剂第2部分

Adhesives,,粘合剂

IPC-SM-817,SM-817-OBSOLETEWITHOUTREPLACEMENT,SM-817废弃无替代产品

IPC-CA-821,CA-821-GeneralRequirementsforThermallyConductiveAdhesives,CA-821导热粘合剂通用要求

IPC-3406,3406-GuidelinesforElectricallyConductiveSurfaceMountAdhesives,3406表面贴装导电胶使用指南

IPC-3408,3408-GeneralRequirementsforAnisotropicallyConductiveAdhesivesFilms,3408-各向异性导电胶膜的一般要求

Coat/Mask,,涂料及阻焊

IPC-CC-830,CC-830B-QualificationandPerformanceofElectricalInsulatingCompoundforPrintedWiringAssemblies,印制板组装电气绝缘性能和质量手册

IPC-HDBK-830,"HDBK-830-GuidelinesforDesign,SelectionandApplicationofConformalCoatings",保形涂层的设计、选择和应用手册.

IPC-SM-840,SM-840C-QualificationandPerformanceofPermanentSolderMask-IncludesAmendment1,永久性阻焊剂的鉴定及性能(包括修正条例1)

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COMPONENTS,,元器件

J-STD-020,J-STD-020C-IPC/JEDECMoisture/ReflowSensitivityClassificationforNonhermeticSolidStateSurfaceMountDevice,J-STD-020C-IPC/JEDEC非密封固态表面贴装器件湿度／回流焊敏感度分类

IPC-9501,9501-PWBAssemblyProcessSimulationforEvaluationofElectronicComponents,9501-评估印制板组装过程中电子元器件的模拟装配工艺

IPC-9502,9502-PWBAssemblySolderingProcessGuidelineforElectronicComponents,9502-印制板组装过程中电子元器件的焊接工艺指南

IPC-9503,9503-MoistureSensitivityClassificationforNon-ICComponents,9503-非集成电路元器件的湿度敏感性分类

IPC-9504,9504-AssemblyProcessSimulationforEvaluationofNon-ICComponents(PreconditioningNon-ICComponents),9504-评估非集成电路元器件的模拟装配工艺

J-STD-027,J-STD-027-MechanicalOutlineStandardforFlipChipandChipSizeConfigurations,J-STD-027-倒装片和芯片级封装的外形轮廓标准

J-STD-032,J-STD-032-PerformanceStandardforBallGridArrayBalls,J-STD-032-BGA球形凸点标准规范

J-STD-033,"J-STD-033B-Handling,Packing,ShippingandUseofMoisture/ReflowSensitiveSurfaceMountDevices",J-STD-033B-对湿度、回流焊敏感的表面贴装器件的处置、包装、发运及使用方法

J-STD-035,J-STD-035-AcousticMicroscopyforNon-HermeticEncapsulatedElectronicComponents,J-STD-035-用于非气密封装电子元件的声波显微镜

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CLEANING/CLEANLINESS,,清洗及清洗工艺

IPC-SC-60,SC-60A-PostSolderSolventCleaningHandbook,SC-60A-锡焊后溶剂清洗手册

IPC-SA-61,SA-61A-PostSolderSemi-AqueousCleaningHandbook,SA-61A-锡焊后半水溶剂清洗手册.

IPC-AC-62,AC-62A-AqueousPostSolderCleaningHandbook,AC-62A-锡焊后水溶液清洗手册

IPC-CH-65,CH-65A-GuidelinesforCleaningofPrintedBoards&Assemblies,CH-65A-印制板及组装件清洗导则

IPC-TR-468,TR-468-FactorsAffectingInsulationResistancePerformanceofPrintedBoards,"TR-468-影响印制板绝缘电阻性能的因素

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IPC-TR-476,TR-476A-ElectrochemicalMigration:ElectricallyInducedFailuresinPrintedWiringAssemblies,TR-476A-电化学迁移：印制电路组件的电气诱发故障

IPC-TR-580,TR-580-CleaningandCleanlinessTestProgramPhase1TestResults,TR-580-测试程序1：测试结果

IPC-TR-581,TR-581-IPCPhaseIIIControlledAtmosphereSolderingStudy,TR-581-第3阶段：受控环境下的锡焊研究

IPC-TR-582,TR-582-Cleaning&CleanlinessTestProgramfor:Phase3-LowSolidsFluxes&PastesProcessedinAmbientAir,TR-582-测试程序3：环境空气下的低固相阻焊及锡焊的清洗测试工艺

IPC-TR-583,TR-583-AnIn-DepthLookAtIonicCleanlinessTesting,TR-583-深入离子洁净度测试

IPC-SM-839,SM-839-Pre&PostSolderMaskApplicationCleaningGuidelines,SM-839-焊接前/后阻焊膜的清洗指南

IPC-9201,9201-SurfaceInsulationResistanceHandbook,9201-表面绝缘电阻手册

IPC-5701,5701-UsersGuideforCleanlinessofUnpopulatedPrintedBoards,5701-裸板清洁应用指南

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EHS,,环境健康与安全

IPC-WP/TR-584,WP/TR-584-IPCWhitePaperandTechnicalReportonHalogen,WP/TR-584-IPC有关卤素的白皮书及技术报告

IPC-1331,1331-VoluntarySafetyStandardforElectricallyHeatedProcessEquipment,1331-电气加热工艺设备义务安全标准

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ASSEMBLY,,装配

IPC-D-279,D-279-DesignGuidelinesforReliableSurfaceMountTechnologyPrintedBoardAssemblies,D-279-高可靠表面贴装技术印制板组装件设计导则

IPC-D-326,D-326A-InformationRequirementsforManufacturingPrintedCircuitBoardsandOtherElectronicAssemblies,D-326A-生产制造印制板及其他电子装配件的信息要求

IPC-C-406,C-406-Design&ApplicationGuidelinesforSurfaceMountApplicationsConnectors,C-406-贴装应用连接器设计应用指南

IPC-CI-408,CI-408-Design&ApplicationGuidelinesfortheUseofSolderlessSurfaceMountConnectors,CI-408-采用无焊贴装连接器的设计应用指南

IPC-7351,7351-GenericRequirementsforSurfaceMountLandPatternandDesignStandard,7351-表面贴装焊盘形状以及设计标准通用要求

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INTERFACES,,数据接口

IPC-D-310,D-310C-GuidelinesforPhototoolGenerationandMeasurementTechniques,"D-310C-照相版制作指南和测量技术

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IPC-A-311,A-311-ProcessControlsforPhototoolGenerationandUse,A-311-照相版制作和使用的工艺过程控制

IPC-D-350,D-350D-PrintedBoardDescriptioninDigitalForm,D-350D-印制板的电子版技术说明

IPC-D-351,D-351-PrintedBoardDrawingsinDigitalForm,D-351-印制板的电子版图纸

IPC-D-356,D-356B-BareSubstrateElectricalTestDataFormat,D-356B-裸底板电气测试数据格式

IPC-D-390,D-390A-AutomatedDesignGuidelines,D-390A-自动设计指南

IPC-2501,2501-DefinitionforWeb-BasedExchangeofXMLData,2501-XML数据网格交换定义

IPC-2511,2511A-GenericRequirementsforImplementationofProductManufacturingDescriptionData&TransferMethodology,2511A-实施产品制造数据描述及其传输方法学的通用要求

IPC-2531,2531-StandardRecipeFileFormatSpecification,2531-标准“菜单”（过程控制）文件格式规范

IPC-2541,2541-GenericRequirementsforElectronicsManufacturingShopFloorEquipmentCommunication(CAMX),2541-电子制造车间现场设备信息沟通(CAMX)通用要求

IPC-2571,2571-GenericRequirementsforElectronicsMfg.SupplyChainCommunication-ProductDataeXchange(PDX),2571-电子制造供应链信息沟通分要求-产品数据交换

IPC-2581,2581-GenericRequirementsforPrintedBoardAssemblyProductsManufacturingDescriptionDataandTransferMethodology,2581-印制板组装产品制造种类数据和传送方法

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PCB,,PCB

SMC-WP-004,WP-004-DesignforSuccess,WP-004-成功设计案例分析手册

IPC-D-859,D-859-DesignStandardforThickFilmMultilayerHybridCircuits,D-859-厚膜多层混合电路设计标准

IPC-1902,1902-IPC/IECGridSystemsforPrintedCircuits,1902-IPC/IEC印制板网格系统

IPC-2141,2141A-DesignGuideforHigh-SpeedControlledImpedanceCircuitBoards,2141A-高速可阻抗电路板设计指南

IPC-2221,2221A-GenericStandardonPrintedBoardDesign,2221A-印制板设计通用标准

IPC-2222,2222-SectionalStandardonRigidOrganicPrintedBoards,2222-`刚性有机印制板设计分标准

IPC-2223,2223A-SectionalDesignStandardforFlexiblePrintedBoards,2223A-揉性印制板设计分标准

IPC-2224,2224-SectionalStandardofDesignofPWBforPCCards,2224-PC卡用印制电路板分设计分标准

IPC-2225,2225-SectionalDesignStandardforOrganicMultichipModules(MCM-L)andMCM-LAssemblies,2225-有机多芯片模块(MCM-L)及其组装件设计分标准

IPC-2252,2252-DesignGuideforRF/MicrowaveCircuitBoards,2252-射频/微波电路板设计指南

IPC-2251,2251-DesignGuideforthePackagingofHighSpeedElectronicCircuits,2251-高速电子电路封装设计指南

IPC-2226,2226-SectionalDesignStandardforHighDensityInterconnect(HDI)Boards,2226-高密度互连(HDI)印制板设计分标准

IPC-2315,2315-DesignGuideforHighDensityInterconnects&Microvias,2315-高密度互连(HDI)和微通孔设计指南

IPC-2615,2615-PrintedBoardDimensionsandTolerances,2615-印制板尺寸和公差

IPC-1065,1065-MaterialDeclarationHandbook,1065-材料申报手册

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