封装工艺介绍.ppt

1、Assembly Process Introduction- Internal Training Material,Zhang Weida 2009.5.31,2,IC Package Basic Introduction; Process Flow of QFP Process Flow of BGA Package Summary,Index,3,IC Package Basic Introduction,Assembly Process Flow,4,Wafer晶圆Street Width 街区宽度Thickness 厚度 Substrate(S/B) 基板 Leadframe(LF)

2、框架,IC Package Basic Introduction,5,IC Package Basic Introduction,6,IC Package Basic Introduction,7,IC Package Basic Introduction,8,QFP Process Flow,Back Grounding,Taping,De-taping,Mount,Die Saw(Dicing),Die Bond,Epoxy Cure,Plasma,Wire Bond,Molding,PMC,Mark,D/D,Plating,Trim/Form,FVI,IC Package Basic I

3、ntroduction,9,Back Grounding,Taping,De-taping,Mount,Die Saw(Dicing),Die Bond,Epoxy Cure,Plasma,Wire Bond,Molding,PMC,Mark,Ball Attack,Singulation,FVI,IC Package Basic Introduction,BGA Process Flow,10, TM2633 B92283.1 #6 9852Z,Process Flow of QFP,Process Flow of QFP,11,Place wafers in the tape frame

4、to facilitate the die saw process.,WAFER MOUNT WAFER SAW DIE ATTACH WIRE BOND MOLD MARK POST MOLD CURE DEJUNK / TRIM SOLDER PLATING FORMING/SINGULATION PACKING,Process Flow of QFP,12,Cut wafers into single die unit according to the specific die size.,WAFER MOUNT WAFER SAW DIE ATTACH WIRE BOND MOLD M

5、ARK POST MOLD CURE DEJUNK / TRIM SOLDER PLATING FORMING/SINGULATION PACKING,Process Flow of QFP,13,Attach dice to the lead frame,WAFER MOUNT WAFER SAW DIE ATTACH WIRE BOND MOLD MARK POST MOLD CURE DEJUNK / TRIM SOLDER PLATING FORMING/SINGULATION PACKING,Process Flow of QFP,14,WAFER MOUNT WAFER SAW D

6、IE ATTACH WIRE BOND MOLD MARK POST MOLD CURE DEJUNK / TRIM SOLDER PLATING FORMING/SINGULATION PACKING,To connect the die pad and the lead frame by gold wire, which makes the die function work when lead frame is connected with outside device.,Process Flow of QFP,15,WAFER MOUNT WAFER SAW DIE ATTACH WI

7、RE BOND MOLD MARK POST MOLD CURE DEJUNK / TRIM SOLDER PLATING FORMING/SINGULATION PACKING,To encapsulate the wire-bonded I.C. to protect the die and gold wire from damage, contamination & oxidation.,Process Flow of QFP,16,WAFER MOUNT WAFER SAW DIE ATTACH WIRE BOND MOLD MARK POST MOLD CURE DEJUNK / T

8、RIM SOLDER PLATING FORMING/SINGULATION PACKING,xxx TM2633 B92283.1 #6 9852Z,To imprint legend on top side of the product by ink or laser for Identification of device type. The marking content include logo, lot no., date code device type and so on.,Process Flow of QFP,17,WAFER MOUNT WAFER SAW DIE ATT

9、ACH WIRE BOND MOLD MARK POST MOLD CURE DEJUNK / TRIM SOLDER PLATING FORMING/SINGULATION PACKING,175oC,To stabilize the property of plastic package chemically and physically to ensure the reliability of I.C.,Process Flow of QFP,18,WAFER MOUNT WAFER SAW DIE ATTACH WIRE BOND MOLD MARK POST MOLD CURE DE

10、JUNK / TRIM SOLDER PLATING FORMING/SINGULATION PACKING,Dejunk: is to cut/remove the resin between dambars and mold compound.Trim: is to cut dambars of lead frame.,Process Flow of QFP,19,WAFER MOUNT WAFER SAW DIE ATTACH WIRE BOND MOLD MARK POST MOLD CURE DEJUNK / TRIM SOLDER PLATING FORMING/SINGULATI

11、ON PACKING,Solder plating is to form a thin film on the lead frame by electrodeposits. This thin solder can ensure the usage of the product and protect the leads from oxidation.,Process Flow of QFP,20,WAFER MOUNT WAFER SAW DIE ATTACH WIRE BOND MOLD MARK POST MOLD CURE DEJUNK / TRIM SOLDER PLATING FO

12、RMING/SINGULATION PACKING,To separate finished units on the leadframe stripe into single unit, and them bend the lead of each unit to the specific shape.,Process Flow of QFP,21,WAFER MOUNT WAFER SAW DIE ATTACH WIRE BOND MOLD MARK POST MOLD CURE DEJUNK / TRIM SOLDER PLATING FORMING/SINGULATION PACKIN

13、G,To separate finished units on the leadframe stripe into single unit, and them bend the lead of each unit to the specific shape.,Process Flow of QFP,22,WAFER MOUNT WAFER SAW DIE ATTACH WIRE BOND MOLD MARK POST MOLD CURE DEJUNK / TRIM SOLDER PLATING FORMING/SINGULATION PACKING,To separate finished u

14、nits on the leadframe stripe into single unit, and them bend the lead of each unit to the specific shape.,Process Flow of QFP,23,WAFER MOUNT WAFER SAW DIE ATTACH WIRE BOND MOLD MARK POST MOLD CURE DEJUNK / TRIM SOLDER PLATING FORMING/SINGULATION PACKING,Select suitable tube, tray or box for packing

15、in according to product type and customer requirement.,Process Flow of QFP,24,Process Flow of BGA,Process Flow of BGA,25,FRONT END 前线,BACK END 后线,BACK GRINDING 晶圆背面研磨 WAFER SAW 晶圆切割 DIE BOND 上片 WIRE BOND 焊线,MOLDING 塑封(压模) MARKING 印字 BALL ATTACH 植球 SINGULATION 分离成型 LEAD SCAN/FVI 外观检查,ASSEMBLY FLOW 组

16、装 流 程,Process Flow of BGA,26,WAFER 晶圆,Back Grinding 晶圓背面研磨 (减薄 ),WAFER,TRUCK TABLE,GRINDING WHEEL,Process Flow of BGA,27,Wafer Saw 晶 圆 切 割,WAFER,BLUE TAPE,WAFER MOUNT,SAW BLADE,DIE,Process Flow of BGA,28,Die Bond (Die Attach) 上 片,BOND HEAD,SUBSTRATE,EPOXY,EPOXY CURE ( DIE BOND CURE),Process Flow of BGA,29,Wire Bond 焊 线,GOLD WIRE,FINGER(INNER LEAD),DIE,PAD,CAPILLARY,Process Flow of BGA,30,Molding 塑封(压模),Compound,Mold chase,Process Flow of BGA,31,Marking 印字(盖印),INK MARK 油墨印字,LASER MARK 激光印字,Process Flow of BGA,32,175oC,Post Mold Cure 塑封后固化,Process Flow of BG