MEMS与纳米技术课程总结_MEMS部分.ppt

1、MEMS课程部分总结,卢德江 王海容 Tel: 82668616-149,西安交通大学精密工程研究所 Institute of Precision Engineering, XJTU,MMicro- EElectro-MMechanical-SSystem,-“Microelectron Technology Applied to Electronical Mechanical System”,西安交通大学精密工程研究所 Institute of Precision Engineering, Xian Jiaotong University,1,Whats MEMS?,国际电技术委员会 （In

2、ternational Electrotechnical Commission) “微系统是微米量级内的设计和制造技术。它集成了多种元件，并适应于以低成本大量生成。,综合表述： MEMS是由微加工技术制备，特征结构在微米尺度（1m1mm）的，集成有微传感器、微致动器、微处理与控制单元的微系统。,2,Why MEMS?,3,Actuators in MEMS,Scaling laws: Size effect on forces: weak forces are preferred in the micro-domain (electrostatics magnetics) Dominance

3、of surface effects (S/V) e.g. friction increases, heat dissipates faster, etc. Mechanical, thermal, electromagnetic response time constants (and other time constants) are all shorter in the microdomain. Power budgets are much smaller Energy sources scale poorly (l3),4,Features of MEMS Structures,Inf

4、luence by Silicon Process: Poor 3D shaping ability Decrease of manufacturing accuracy Polygons preferred to curves Relative motion replaced by elastic distortion Crystal direction dependency Self-assembly,Silicon Process developed in IC Physical properties of Silicon based materials are good enough

5、to mechanical applications.,5,Why Silicon?,ax + by + cz = 1,采用（a b c）的形式表示晶面，例如(1 1 1) 、(1 0 0)、 (1 1 0)等，表示晶面法线方向。,6,Miller Indices for What?,7,Basics of Photolithography,8,What Happen on Surface in VD?,9,PVD and CVD,Step coverage (%) = (ts/tn) x 100%,10,How Step Coverage Occurs?,11,Control Regions

6、 of CVD,12,Comparison of CVDs,13,How about an Etching?,RE = Y/T,AE = 1- X/Y,t0,t1,d,SE = d/(t0-t1),14,Isotropic & Anisotropic Wet Etching,15,Dry Etching Mechanisms,16,Dry Etching Models,A) FC刻蚀模型,B) 离子辅助氯刻蚀模型,C) Bosch 工艺(深刻蚀),D) 低温刻蚀技术,17,Bulk Processes,18,Surface Processes,19,LIGA & UV-LIGA, LIGA VS Silicon Micromachining 1、LIGA相比硅微工艺而言，能够制备更大深刻比的结构。 2、硅微工艺所加工的材料主要是硅和硅基材料，LIGA制备的结构则可以是金属、陶瓷、塑料等。