PCB专业术语名词解释A50.ppt

,线路板专业名词解释,Title,印制电路：printed circuit 印制线路：printed wiring 印制板：printed board 印制板电路：printed circuit board (pcb) 印制线路板：printed wiring board(pwb) 印制元件：printed component 印制接点：printed contact 印制板装配：printed board assembly 板：board,第一篇： 常用术语,10. 单面印制板：single-sided printed board(ssb) 11. 双面印制板：double-sided printed board(dsb) 12. 多层印制线路板：mulitlayer printed wiring board 13. 刚性印制板：rigid printed board 14. 刚性单面印制板：rigid single-sided printed board 15. 刚性双面印制板：rigid double-sided printed board 17. 刚性多层印制板：rigid multilayer printed board,18. MI: Manufacture Instruction (制作指示) 19. ECN: Engineering Change Notice (工程更改通知) 20. MOR：Marketing Order Release OC : Order Confirmation (定单) 21. IPC - The Institute for Interconnecting and packaging Electronic Circuits (美国电子电路互连与封装协会),22. UL :Underwrites Laboratories(美国保险商实 验所),23. ISO -International Standards Organization 国际标准化组织,24. On hold and Release :暂停和释放,25. SPEC : specification 客户规格书,26. WIP: Work in process 正在生产线上生产的 产品,27. Gerber file :软件包,28. Master A/W : 客户原装菲林,29. Net list : 客户提供的表明开短路的文件,30. HMLV : High Mixed Low Volume, 多批少量,31. TCN： Temporary Change notice 临时更改通知,32. ENIG : Electroless Nickel /Immersion Gold (IPC-4552),33. OSP : Organic Surface protection,34. IT : Immersion Tin 35. IS: Immersion Silver 36.HAL: Hot air leveling,第二篇： 有关材料,1. Copper-clad Laminate :覆铜箔基材,2. Prepreg: 聚酯胶片,3. FR-4(Flame Retardant -4): 一种用玻璃布和环氧樹脂制造有阻燃性能的材料,4. Solder mask: 阻焊剂,5. Peelable solder mask: 蓝胶,7. Dry film :干膜,6. Carbon Ink:碳油,8. RCC : Resin Coated Copper (不含玻璃布),9.基材：base material 10. 层压板：laminate 11. 覆金属箔基材：metal-clad bade material 12、 覆铜箔层压板：copper-clad laminate (ccl) 13、 单面覆铜箔层压板：single-sided copper-clad laminate 14、 双面覆铜箔层压板：double-sided copper-clad laminate 15、 复合层压板：composite laminate 16、 薄层压板：thin laminate 17、 金属芯覆铜箔层压板：metal core copper-clad laminate 18、 金属基覆铜层压板：metal base copper-clad laminate,第三篇： 有关工序,PTH,1. PTH: (Plated through hole) 电镀孔,A. Via hole: 通路孔。,作用：,B. IC hole: 插件孔。,作用：,仅作为导通用（不作插件或焊接），如测试点和一般导通孔。,用于插件或焊接，也可导通内外层。,2. NPTH：,作用： 一般是作为装配零件的定位孔或工具孔。,NPTH,(Non-plated through hole) 非电镀孔,3. SMT/SMD,Surface Mounting Technology: 表面贴覆技术,SMT Pad:,SMT,指在线路板表面帖覆焊接元件的Pad，包括QFP (Quad flat pad)，2-Roll等。,这些也是SMT pad,4. BGA/CSP: BGA-Ball Grid Array CSP- Chip Scale package,要求： 一般BGA区域VIA孔要求塞孔,说明： 它们都是一种封装技术。在PCB上都表现为一 VIA孔联了一个焊接PAD。,BGA/CSP,BGA Pad,Line,Via Hole,5. Fiducial mark : 作用： 装配时作为对位的标记,说明： 它是非焊接用的焊盘，通常为圆形或方形，有金属窗和绿油窗。,Fiducial mark,6. Dummy pattern(thief pattern)：,作用： 使整块板的线路分布更均匀，从而提高图电质量和减少板的曲度和扭度。,要求： 通常以不影响线路为标准， 一般为又有三种： 圆形/ 方形-命名为“Dummy” 网状-命名为“网状Dummy” 铜皮-命名为“铜皮”,Dummy,7. 无孔测试Pad：,Text Pad/Breaking Tab,此类Pad仅供装配完后作为测试点，不装配零件。 不包括SMT PAD, BGA PAD, Fiducial mark pad.,8. Breaking Tab：,印制板上无电气性能，在制作过程中用于加工具孔、定位孔或Dummy等的部分。与线路板主体部分相连处有折断孔或V-Cut。,Breaking Tab,V-Cut,9. Thermal：,作用：它使在焊接时因截面过分散热而产生虚焊的可能性减少。,(heat shield）热隔离盘 （大面积导电图形上，元件周 围被蚀刻掉的部分）,Thermal/Clearance,10. Clearance：,无铜空间（通常指铜皮上为孔开的无铜区域）,11. S/M Bridge：,作用：防止焊接时 Pad间被焊锡短路。,阻焊桥（装配 Pad间的阻焊条）,S/M bridge,S/M Bridge Solder mask in these areas,S/M bridge,12. Gold finger：金手指,说明：电镀金耐磨。一般金指的S/M OPENING 均为整体开窗。,13. Key slot：键槽,作用：使印制板（金手指）只能插入与之配合的连接器 中，防止插入其他连接器中的槽口。,要求：一般公差要求较紧。,14. Beveling：金指斜边,Gold finger/Key slot/Beveling,15. VIP：,要求：一般为S面塞孔，C面作为SMT PAD。,16. VOP：,(Via In Pad) Via 孔位于SMT Pad上。,说明： (Via On Pad) Via 孔先被树脂塞满，其表面（一面或两面）经过打磨、沉铜、板电镀等工序后，要求作为装配Pad。,VIP/VOP,S面塞孔,SMT Pad,Via hole,树脂塞孔,SMT Pad,Blind/Buried hole,17. Blind/Buried hole：,盲/埋孔,盲孔：从一个表面开始，在内层结束，未贯穿整板的孔。,埋孔：不经过两外表面，只在某些内层中贯穿的孔。,19. LDI,High Density Interconnection : 高密度互联,-特点：直接用激光在干膜上曝光，不必用菲林 ，能保证完成线宽更细 。,18. HDI,Laser Direct Image -镭射直接曝光,-特点：一般线宽/线间小于3mil/3mil 导通孔小于8mil, microvia 一般 要求用激光钻孔。,20. Heat sink:,Side face,Bottom Side,Top Side,PCB,Pallet大铜块,Prepreg,PCB+Prepreg+Pallet,Aspect ratio,21. Aspect Ratio：,纵横比（板厚孔径比）-影响电镀和喷锡,说明：一般采用板厚最大值与最小孔径之比。,Aspect Ratio = d / H,22. AGP:,显卡,主显示芯片,AGP,23. Mother board:,内存插孔,PCI插槽,CPU插座,AGP插槽,主(机)板,Motherboard,24. Memory bank:,Memory bank,内存条,内存芯片组,第四篇： 检查与测试,欧盟 RoHS & WEEE指令对无铅PCB要求 无铅PCB必须满足欧盟 RoHS（Restriction of the use of certain Hazardous Substances in electrical and electronic equipment）2002/95/EC指令 和电子信息产品生产污染防治管理办法的规定，从2006年7月开始禁用六种物质 （铅、镉、六价铬、水银、PBB（多溴化联苯）、PBDE（多溴联苯醚）。其中PCB板主要检测项目包括：PCB基材、阻焊、丝印、铜皮等。,If this specification conflicts with any other documents the following order of precedence shall apply: a) Purchase order b) Printed wiring board drawings and drill and trim documentation c) This specification d) Documents referred to in this speciation. Supplier shall use applicable fabrication panel coupon as defined in IPC-2221.Micro-sections coupon ,and solder samples shall be provided with each shipment for validation requirement.,1. Maximum 3 repair operations are allowed on each board and the number of repaired PCBS cannot exceed the 10 percent of the entire lot population. 2. Unless otherwise specified on the engineering drawing ,plated through via holes with a nominal size of 0.020inch or less may be partially or completely plugged with solder. 3. As a preventive precaution .before the laying down of the solder ,the PCBS will have to be washed to remove the residuals due to the production process, the clearing degree of the PCBS before the coating has to be the following one MAX 1 ug /square cm,1. Solder mask (SMOBC)-Apply LPI solder masks per IPC-SM-840 type B. class 3. color green and minimum solder masks thickness over the edges shall be 0.001”.LPI solder mask and solder shall meet the UL 94v-o requirements. There shall be no solder masks over the SMT pads ,there shall be no exposed traces on outside layers and solder mask opening should be 0.002”side larger than pad. 2. PCB “Stack-Up” construction requirements are to be determine