超声波扫描显微镜sonsca.ppt

超声波扫描显微镜 Scanning Acoustic Microscope,Sonoscan D9500,1. 超声波基础知识 2.超声波扫描微成像工作原理 3. 超声检测设备的参数和软件介绍 4. 超声波成像应用举例 5.超声波检测和X射线检测,1、超声波基础知识,Basics of Acoustics,超声的应用：清洗, 焊接, 治疗, 成像和传感 超声波清洗和焊接：20KHz40KHz 超声波成像：5MHz,Basics of Ultrasound (超声波基础),Ultrasound is an elastic disturbance that propagates through materials (mainly solids and liquids) at frequencies above 20 KHz. (超声波的频率在20KHz以上，人不能听到) An ultrasonic wave cannot propagate through a vacuum at any frequency or through air at frequencies above 10 MHz. (任何频率超声波都不能穿透真空。当超声波频率大于10MHz时，也不能穿透空气) The pressures generated at the focal spot are in the micro Joule range and are not harmful to even moderately delicate samples. The pulse in the acoustic microscope has very low energy in comparison. (C-SAM使用的超声波的频率和能量不会对人体和样品有害。),Basics of Ultrasound (超声波基础),Ultrasound at Interfaces (界面处的超声波) When an ultrasound pulse impinges on an interface, part of the energy is reflected and part transmitted. (在界面处的超声波，有些会被反射，有些会穿过该界面。) The relative strength of the transmitted (T) and reflected (R) ultrasound at an interface is governed by the acoustic impedance of the materials on each side of the interface. (在界面处超声波反射和穿过的相对强度是由界面两边物质的声阻抗决定的。) Acoustic Impedance (Z) - the product of the density of the material and the velocity of ultrasound (Z =V). (声阻抗是物质的密度和超声波在该物质中的传播速度的乘积。),Transmitted wave (穿透波),Reflected wave (反射波),Reflection Coefficient (R) (反射系数R),Transmission Coefficient (T) (穿透系数T),Ultrasound at Interfaces (界面处的超声波),Z 1,Z 2,Acoustic Impedance of Materials (声阻抗值),Acoustic Impedance (Z) - is the product of a materials density times its ultrasonic velocity Z = V In practical terms - Acoustic Impedance is a materials characteristic property that determines the amount of reflected and transmitted energy that occurs when an ultrasonic wave encounters a boundary or interface between two materials.,300 micron,95 micron,60 micron,40 micron,28 micron,4 micron,9 micron,15 micron,20 micron,Low Frequency Greater Penetration,High Frequency Higher Resolution,Sample Back Surface,Sample Surface,Frequency, Resolution and Penetration (频率、分辨率和穿透力),Penetration (穿透能力)- - - - - - - - - - - - - - - - - - - Resolution (分辨率),Frequency, Resolution and Penetration (频率、分辨率和穿透力),Higher frequency, higher resolution, lower penetration. (更高的频率，则拥有更高的分辨率，更低的穿透能力) Thicker parts require lower frequencies to maintain penetration depth. (更厚的样品需要较低频率的探头来维持较好的穿透厚度) Higher attenuation materials such as plastics require lower frequencies. (高衰减的材料：如塑料等要求较低频率) Lower attenuation materials such as Si can be inspected using higher frequencies. (低衰减的材料：如硅材等能使用较高频率来扫描检测),Frequency, Resolution and Penetration (频率、分辨率和穿透力),医用 B超： 分辨率范围 cm-mm 频率范围 500KHz-1MHz,声纳： 分辨率范围 m-cm 频率范围 20KHz-500KHz,超声波显微镜： 分辨率范围 mm-m-nm 频率范围 5MHz-2GHz,Classification (超声波功能仪器的分类),Advantage of Acoustic Micro Imaging (超声波微成像的优点) 超声波显微成像(AMI)利用高频率的超声波(一般在5MHz以上)探测物体内的结构、缺陷、以及对材料做定性分析。 其优点如下： Non Destructive (无损检测，非破坏性) Sensitive inspection technique for bond evaluation (对粘结层面非常敏感) Penetrates most materials (能穿透大多数的材料) Subsurface structures (浅表层结构的分析) Mechanical properties (材料力学性能的检测-非线性超声测试),Grain boundary structures, Textures 材料的晶格结构,Cracks 裂纹,Delamination, Adhesion, Artefact 分层缺陷、附着物以及其他夹杂物,Particles, inclusions, Precipitations 杂质颗粒、夹杂物、沉淀物等,Voids, Holes,bubbles, 空洞、空隙、气泡等,Detection and Application of AMI (超声波微成像的主要用途),SAM Principle,2、超声波扫描微成像工作原理,CASE 1 Z2 Z1 (由软-硬是正波),CASE 2 Z2 Z1 (由硬-软是负波),CASE 3 Z2 = Z1 (材质没有变化),两种物质的声阻抗的差异决定反射波(回声)的正负极性和幅值,Determining Echo Polarity (确定回声正负极性),Color Mapping (着色图),Ultrasound is either Reflected or Absorbed or Scattered or Blocked by flaws differently than by the surrounding material. (超声波会被材料反射、散射、吸收或是阻挡。),Acoustic Micro Imaging (超声波微成像),Time - Distance Relationship,Ultrasound Two Modes (超声波两种工作方式) 1. Pulse Echo or C-Mode Technique (反射方式) Level specific (针对特定的层面) 2. Through Transmission or T-Scan Technique (透射方式) Entire thickness of the sample (整个厚度),Graphical Presentation of Working Principle (基本工作原理图示),Transmitter (发射器),Pulser (脉冲发生器),Water (媒介水),Lens (镜头),Transducer (传感器),Pulse Echo or C-Mode technique is a level specific scan. The images have a sharp focus as the data from the C-Mode scan is based on data from a specific level in the device.,Pulse-Echo or C-Mode Technique (反射方式),Amplifier (信号放大),Sample (样品),Through Transmission or T-Scan is a non-level specific scan. The ultrasound is passed through the entire thickness of the device. T-Scan is a non-ambiguous technique as ultrasound can not pass through an air gap.,Through Transmission or T-Scan Technique (透射方式),Transmitter (发射器),Amplifier (信号放大),Pulser (脉冲发生器),Transducer (传感器),Transducer (接收传感器),Water (媒介水),Lens (镜头),Sample (样品),Pulse-Echo vs. Thru-Scan (反射vs.透射),Reflection Mode (反射模式): One Transducer both sends and receives the ultrasound,Transmission Mode (透射模式): Sending Transducer Receiving Transducer,Pulse-Echo vs. Thru-Scan (反射vs.透射),3、超声检测设备的参数和软件介绍,Systems and Software,主要组成,Stepper motors 步进马达 Linear motion systems & linear encoders 线性驱动系统和编码器,X/Y/Z 工作台和 轴系 快速移动和专利平衡和防震系统 探头装置和连接系统,power supply units 供电系统 electronic boards 电控系统 ADC 数模转换 HF electronics,脉冲发生器 / 接收器装置 A, B, C, Q, M, T, LOBE, STAR, 3D, ZIP等等多种扫描模式,Transducer 探头,Electronics 电子控制系统,Mechanical Parts 机械系统,特定配置,Stages 平台,Software 软件,Window XP control software VHR software user licenses Menu setup Image setup,15-75 MHz 100-300 MHz 0.8-1 GHz更高频率 各种不同聚焦长度的探头,水槽 探头固定架 其他保护装置和自动系统,2个硬盘和电脑配置 客制化设计,软件设置包 软件分析包 图像分析包 软件保护包 软件帮助包,更明亮的扫描观测范围 Thru-Scan穿透式扫描样品支架 应用特别设计 水槽水温恒加热和保持装置,Shared and Specific Components 超声波显微镜主要组成部分,配置图,Printer / CD /U盘 打印机/CD刻录/U盘,Monitor 1 设置显示器,parallel port,grafic interface,AD converter,RF-interface,video scan,interface,X/Z Motor controller X-Y-Z机械移动控制单元,scanner system 扫描系统,Encoder 编码器,Sample 样品,Transducer 探头,Pulser / Receiver高频发射接收器,Echo 回波,PC Workstation 计算机工作站,Trigger Unit 信号触发器,Acoustic Microscope Systems 超声波扫描显微镜系统配置,Monitor 2 图像显示器,High Frequency Ultrasonic Transducers 不同频率超声波探头,低频：5 MHz 50 MHz 中频：75MHz 100MHz,高频：230 MHz, 不同聚焦尺寸和F# 更高频率的探头,15, 30, 50, 75, 100 MHz, 使用穿透扫描臂以及瀑布杯 (选件),Transducer parameters: 换能器选择的主要参数： - FL (Focal Length) 焦距长度 - Frequency 频率 - Bandwidth 带宽,Hourglass shaped beam that narrows to the spot size at the waist,Transducer Resolution (探头分辨率),每一款传感器的Spot Size是由传感器的频率，焦距和镜头半径决定的。,Beam from a Focused Transducer 聚焦超声波传感器探头,Sonoscan拥有自己研发制造唯一的多款同一频率不同FL的探头,Focal plane,Spot size,Hourglass shaped beam that narrows to the spot size at the waist,Depth of Field,X = Spot size = 1.22F# Resolution (reflection mode) = X(0.707) Z = Depth of field = 7.1(F#)2 Example: 50MHz and F#2 in water DX is 0.073 mm, resolution is 0.052mm and DZ is 0.85 mm,Focal Length Diameter Velocity (mm/ms) Frequency (MHz),F# =, =,Beam from a Focused Transducer 聚焦超声波传感器探头,Sonoscan拥有自己研发制造唯一的多款同一频率不同FL的探头,一、分辨率： 超声波显微镜的分辨率主要受探头的频率影响，理论分辨率可以达到声波在材料内的波长L的 1/21/3, 这里波长L， L V / f 这里V表示声波在材料内纵向传播速度，f 表示探头的频率，可见探头频率越大，则分辨率越大。 但同时可见，超声波显微镜的实际分辨率还受到声波在材料内部纵向传播速度，探头聚焦长度，焦点直径的影响，因此对于不同性质的材料或不同聚焦长度、直径的探头，仪器实际的分辨率是有差异的。,Special Parameter of Transducers for AMI 超声波扫描探头选择的主要参数,二、灵敏度： 超声波显微镜探头的灵敏度影响到仪器分辨率所能达到的水平，一般的探头只能达到波长L的1/2，而比较好的探头则能达到波长L的 1/3。影响灵敏度的因素主要决定于探头焦点的直径，通常来说焦点直径越小，灵敏度越大。但实际的焦点直径非常难精确的测量出来，因为声波聚焦点没有明确的边界，而是以不同灰度形状环绕在一起。目前Sonoscan公司自己研发的探头焦点直径能做到微米以下直径。林状波,Special Parameter of Transducers for AMI 超声波扫描探头选择的主要参数,三、穿透深度： 超声波显微镜探头对材料的穿透深度主要受到二个因素影响： 探头聚焦声波波束在被检测材料与中间耦合剂之间的折射率N： N= CL, Material / C L,Water 这里C L, Material表示声波在被检测材料内的纵向速度，C L,Water表示声波在中间介质中的传播速度（通常用水C L,Water =1.5 mm/s）； 材料对声波的吸收系数： 吸收系数是由材料内部的晶格大小、材料性质，空隙度等决定，因此比较难以仅用探头来决定穿透的深度，还取决于不同的材料，或同一种材料内部的晶格、空隙等因素。,Special Parameter of Transducers for AMI 超声波扫描探头选择的主要参数,General Application for Different Frequency of Transducers 不同频率探头的应用领域举例,Low Frequency (10-50 MHz): Anodic bonding, welding structures, packages: 低频探头 (10MHz 30MHz): delaminations, defects; 电极封装、焊接内部结构的分层缺陷、杂质、裂纹等 Mid Frequency (50-75 MHz): BGAs, die attach, die top: 中频探头 (50MHz 75MHz): delaminations, defects, cracks; BGA, 粘晶芯片内部的分层缺陷、杂质、裂纹等； High Frequency (100-300 MHz): Delaminations, voids, defects, cracks in thin plastic 高频探头 (100MHz 230MHz): packages and flip chips; 薄型塑封器件、倒装焊芯片内部的分层缺陷、杂质 、裂纹等； Ultra High Frequency (0.4-2 GHz): Nano-voids, cells, defects, boundaries in ceramics 超高频探头 (400MHz 2GHz): alloys material; 陶瓷，合金材料中的纳米空洞、颗粒、缺陷、界面;,Typical Parameter C-SAM Transducers 典型超声波传感器探头参数,Sonoscan Software for Acoustic Microscope Sonoscan超声波扫描显微镜软件功能,Operation Software 操作软件基于Windows XP Easy Opertion 便于操作的人性化设计 Image Analyser 具有图象分析功能,Locate the VHR Visual Acoustics icon on the Microsoft Windows Desktop and double-click on this VHR Visual Acoustics icon 双击电脑桌面的VHR软件图标，打开软件。,VHR Software Logon VHR软件登录,VHR Visual Acoustics Start-up VHR软件启动,VHR Software GUI VHR软件界面,Transducers Selection 探头选择和参数设定,Parameter and Scaning Set-up 探头移动和扫描参数设定,RF Interface and Scan Mode Set-up RF界面和扫描模式参数设定,RF Image Set-up RF图像和设定,C-SAM D9500 Series, Fast Scan Speed (快速扫描) Production screening, QA, Failure Analysis and process control (适用于产品线,QA, 失效分析和制程控制) User-selectable transducers for superior image and resolution (更清晰和更高分 辨率图像的可选择探头) Waterfall transducer option for non-immersed scanning (针对非浸入水中的瀑布探头) Auto Focus and automated image acquisition (自动聚焦 和自动扫描图像获取),Sonoscan Scanning Acoustic Microscope,Sonoscan Scanning Acoustic Microscope,C-SAM D9500 Series Specifications,Frequency range: 1 500 MHz 频率范围 Transducer selection: 5 400 MHz 探头频率选择 Scan field: X, Y方向上 扫描范围 最小0.25 x0.25mm 最大305 x305mm Scan speed: 1000mm/sec 扫描速度 Scanner resolution: +/- 0.5m 扫描精度 Scan modes: A, B, C, M, Bulk, T, 扫描模式 3D, Q-BAM, P, ZIP Image resolution: 4096 x 4096 pixel2 图象分辨率 （最大）,Gate resolution: 0.25ns, 最小门限 时间 RF-gain射频增益: 95dB, 以0.5dB/ 步增减 FFT: 快速傅立叶变换 Patent Acoustic Impedance Polarity Detector: 专利声学的阻抗 极性探测器 VHR image analysis for Sonoscan 专用图像设置和分析软件 操作系统 Windows XP, 中英文 外形尺寸: 180 x 76 x 150cm,C-SAM D9500 Series,超声波扫描检测仪技术规格表 (1)：,1、扫描检测模式： Time Domain Pulse -Echo (时域脉冲反射方式) A-Scan：单点扫描模式； B-Scan：Z纵向截面模式； C-Scan：单一层面扫描模式； Multi-Scan：多个层/界面扫描模式； Bulk-Scan：块扫描模式； LOBE：回声损失扫描模式，特别适合芯片裂纹和MLCC缺陷扫描； Q-BAM：定量Z纵向聚焦截面扫描模式，用于虚拟切面分析； Profile：轮廓扫描模式，包括对角线和任何截面定义； Tray-Scan：Tray盘扫描模式，可同时扫描2个JEDEC标准托盘中的元件，进行自动数据收集和分析作 为接受或拒收的标准； Thru-Scan：选件，可以使用探头5MHz最大100MHz的固定区域和大面积扫描穿透式模式； STAR：选件，通过另外的数据通道，可以同步C-Scan和T-Scan扫描模式； DIA：选件，声波数字图像分析软件和美国军标MIL-STD-883方法2030粘接层分析软件； VRM：选件，虚拟分析模式，收集所有的单点扫描数据，用一个扫描存储所有的数据，使用不同的电 子门来重新产生新的图像，对任何位置的图像回声作分析； C-SAM InteractiveTM：内部自学和培训软件，提供用户内部交互式帮助功能和应用支持，帮助用户学习 和设置新的应用，优化获得分析结果。,超声波扫描检测仪技术规格表 (2)：,C-SAM D9500 Series,超声波扫描检测仪技术规格表 (3)：,C-SAM D9500 Series,超声波扫描检测仪技术规格表 (4)：,C-SAM D9500 Series,SAM Application Examples,4、超声波扫描微成像应用实例,The applications of acoustic microscopy are virtually unlimited, ranging from life sciences to Electro technology, material sciences, the semiconductor industry and living objects. 超声波扫描显微镜具有极其广泛的应用，其主要的应用领域包括半导体、材料科学和生物医学。 Semiconductor 半导体 Material Science 材料科学,AMI Applications 超声扫描应用,硬币,电子器件,陶瓷镀层,金属拉伸试样,Semiconductor Devices / Packages 在半导体器件及封装上的应用,Reveal Hidden Defects (发现隐藏的缺陷),.using Acoustic Micro Imaging,双列直插式封装,Die Surface, Topside Leadframe & Paddle,Die Attach,Thru-Scan,Backside Surface,Backside Leadframe & Paddle,The following interfaces and scanning modes are generally of interest: Top Side Surface orientation, surface cracks, and chips Die Surface delaminations and die surface cracks Die Attach delaminations, voids, and subsurface die cracks Top Side Leadframe cracks and delaminations Top Side Paddle cracks and delaminations Bulk Scan voids and cracks in the encapsulant Backside Surface orientation, surface cracks, and chips Backside Paddle cracks and delaminations Backside Leadframe cracks and delaminations Thru-Scan confirmation of defects,小外形集成电路,Die Surface, Topside Leadframe & Paddle,Die Attach,Backside Leadframe & Paddle,Thru-Scan,Bulk Scan,The following interfaces and scanning modes are generally of interest: Top Side Surface orientation, surface cracks, and chips Die Surface delaminations and die surface cracks Die Attach delaminations, voids, and subsurface die cracks Top Side Leadframe cracks and delaminations Top Side Paddle cracks and delaminations Bulk Scan voids and cracks in the encapsulant Backside Surface orientation, surface cracks, and chips Backside Paddle cracks and delaminations Backside Leadframe cracks and delaminations Thru-Scan confirmation of defects,微型薄片式封装,Die Surface, Topside Leadframe & Paddle,Die Attach,Backside Leadframe,Backside Paddle,Thru-Scan,The following interfaces and scanning modes are generally of interest: Top Side Surface orientation, surface cracks, and chips Die Surface delaminations and die surface cracks Die Attach delaminations, voids, and subsurface die cracks Top Side Leadframe cracks and delaminations Top Side Paddle cracks and delaminations Bulk Scan voids and cracks in the encapsulant Backside Surface orientation, surface cracks, and chips Backside Paddle cracks and delaminations Backside Leadframe cracks and delaminations Thru-Scan confirmation of defects,Die Surface, Topside Leadframe & Paddle,塑封引线芯片载体封装,Die Attach,Bulk Scan,Thru-Scan,Backside Leadframe & Paddle,The following interfaces and scanning modes are generally of interest: Top Side Surface orientation, surface cracks, and chips Die Surface delaminations and die surface cracks Die Attach delaminations, voids, and subsurface die cracks Top Side Leadframe cracks and delaminations Top Side Paddle cracks and delaminations Bulk Scan voids and cracks in the encapsulant Backside Surface orientation, surface cracks, and chips Backside Paddle cracks and delaminations Backside Leadframe cracks and delaminations Thru-Scan confirmation of defects,塑料四边引线封装,Die Surface, Topside Leadframe & Paddle,Die Attach,Heatsink,Thru-Scan,Bulk Scan,The following interfaces and scanning modes are generally of interest: Top Side Surface orientation, surface cracks, and chips Die Surface delaminations and die surface cracks Die Attach delaminations, voids, and subsurface die cracks Top Side Leadframe cracks and delaminations Top Side Paddle cracks and delaminations Bulk Scan voids and cracks in the encapsulant Backside Surface orientation, surface cracks, and chips Backside Paddle cracks and delaminations Backside Leadframe cracks and delaminations Thru-Scan confirmation of defects,薄形四方扁平封装,Die Surface, Topside Leadframe & Paddle,Die Attach,Backside Paddle,Thru-Scan,Bulk Scan,The following interfaces and scanning modes are generally of interest: Top Side Surface orientation, surface cracks, and chips Die Surface delaminations and die surface cracks Die Attach delaminations, voids, and subsurface die cracks Top Side Leadframe cracks and delaminations Top Side Paddle cracks and delaminations Bulk Scan voids and cracks in the encapsulant Backside Surface orientation, surface cracks, and chips Backside Paddle cracks and delaminations Backside Leadframe cracks and delaminations Thru-Scan confirmation of defects,PBGA (塑料焊球阵列封装),Die Surface,Encapsulant to Substrate,Thru-Scan,THRU-Scan,Die Attach,The following interfaces and scanning modes are generally of interest: Top Side Surface orientation, surface cracks, and chips Backside Surface orientation, surface cracks, and chips Die Surface delaminations and die surface cracks Die Attach delaminations, voids, and subsurface die cracks EncapsulantSubstrate Interface - voids, cracks and delaminations Bulk Scan voids and cracks in the encapsulant Thru-Scan confirmation of defects,PGA (引脚网格阵列封装),Heatsink Attach,Lid Seals,Die Attach,The following interfaces and scanning modes are generally of interest: Top Side Surface orientation, surface cracks, and chips Die Attach delaminations, voids, and subsurface die cracks Heatsink Attach delaminations Backside Surface orientation, surface cracks, and chips Lid Seals delaminations, voids, misplacement,CSP (芯片尺寸封装),Thru-Scan,Die Attach,Die Surface,Encapsulant to Substrate,Bulk Scan,The following interfaces and scanning modes are generally of interest: Top Side Surface orientation, surface cracks, and chips Die Surface delaminations and die surface cracks Die Attach delaminations, voids, and subsurface die cracks EncapsulantSubstrate Interface voids, cracks and delaminations Bulk Scan voids and cracks in the encapsulant Thru-Scan confirmation of defects,MLCC (片式多层陶瓷电容),Loss of Back Echo (LOBE) Scan,Bulk Scan,Active Area,Termination,Scan Type: Bulk-Scan Interface Scanned: Bulk Scan of Entire thickness of capacitor Defects (Red Arrow): Delamination in ceramic Defects (Yellow Arrow): Void in ceramic,The following interfaces and scanning modes are generally of interest: Top Side Surface orientation, cracks, and surface chipouts. Cracks and voids for the active area, and cracks for the termination Bulk Scan voids and cracks in the encapsulant Loss of Back Echo (LOBE) Scan confirmation of defects Backside Surface orientation, cracks, and surface chipouts. Cracks and voids in the active area, and cracks within the terminations,Heat Si