SMT中英文专业术语教程.ppt

SMT中英文专业术语教程,更新日期：2011.09,1.印刷工艺专业英语 2.贴片工艺专业英语 3.回流工艺专业英语,针对新入职或有一定基础的职员,2小时,罗卫龙,使大家对SMT专业英语有所了解，能够看懂一些专业素材,培训目的,培训对象,培训讲师,学习重点,培训课时,Printing Process English/印刷工艺英语,测试OK后 转DIP插件,印刷（Printing）： 目的：借助于钢网把锡膏印刷在PCB之焊盘（PAD）上,贴片（Mount）： 目的：将贴片元件准确的贴装到PCB焊盘上,回流焊（Reflow）： 目的：把完成贴片的PCB经由一定的温度曲线使锡膏与PCB，元件之间形成机械连接,AOI（自动光学检测）： 目的：自动检测PCBA板上各种不同帖装错误及焊接缺陷，确保SMT不良品不会流入下一道工序,SMT：Surface Mount Technology/表面贴装技术,Definition：Process of transferring solder paste onto the pads of a PCB, by forcing it through mating apertures on a stencil, using a squeegee,Board loader/上板机： PCBs to be transported to the screen printer using conveyors,Printer/印刷机： deposits solder paste onto pads on the circuit board,PCB（Printed circuit board）/印制线路板,Solder paste/锡膏： Mixture of solder powders and flux deposited onto pads of circuit board on a controlled volume. After reflow provides electrical, mechanical and thermal connection between component and board,Squeegee/刮刀: Critical tool used to “push” paste through the designated openings,Stencil/钢网：Vehicle by which the volume and placement location of solder paste deposition is controlled,Foil/钢片,Frame/外框,Flex Mask/绷网,Aperture/开孔,Main Elements of the Screen Printer/印刷机要素,Input Conveyor/输入导轨,Solvent tank/容剂曹,Monitor/监控器,Output Conveyor/输出导轨,Light tower/指示灯,Emergency stop buttons/紧急制动开关,Vision system/视觉系统,Clamps/夹子,Board support/支撑块 Or support Pins/支撑顶针,stencil/钢网,Squeegee/刮刀,Print Parameters/印刷参数,Angle of Attack (45 or 60 with stencil)/角度 ：The angle made by the front of squeegee blade in relation to the stencil Snap-Off (Contact or Non-Contact)/印刷间隙 ：The distance from the top surface of the PCB to the bottom surface of the stencil Squeegee Pressure/刮刀压力 ：Controls the shear stress，The total force with which the squeegee is pushing onto the board Squeegee Speed/刮刀速度 ：Controls the shear rate，The velocity at which the squeegee traverses across the stencil Separation Speed/分离速度 ：The velocity at which the PCB release from the stencil,Separation Distance/分离距离 :The distance when the PCB release from the stencil which keep the separation speed Stencil Alignment/钢网对位 :Vision Based:Fully automatic with fiducials or Semi-automatic Manual Cleaning Frequency/清洗频率 Cleaning mode/清洗模式 :Dry/wet/vacuum,Print Defects/印刷缺陷,Misalignment/偏位,Bridge or Short/短路,Icicle/拉尖,Scooping,Incomplete print/少锡,Excessive print/多锡,Paste residue/锡膏脏污,Slump/坍塌,Component placement process english/元件贴装工艺英语,测试OK后 转DIP插件,印刷（Printing）： 目的：借助于钢网把锡膏印刷在PCB之焊盘（PAD）上,贴片（Mount）： 目的：将贴片元件准确的贴装到PCB焊盘上,回流焊（Reflow）： 目的：把完成贴片的PCB经由一定的温度曲线使锡膏与PCB，元件之间形成机械连接,AOI（自动光学检测）： 目的：自动检测PCBA板上各种不同帖装错误及焊接缺陷，确保SMT不良品不会流入下一道工序,Generic SMD Placement Machine/常用表面贴装设备,Component Alignment/器件对位,User interface/ 用户界面,Placement robot,Component feeding/ 供料器,料车,feeder/飞达,Toolbit or nozzle 吸嘴,PCB transport,Board alignment,Board alignment,The other professional english used in placement process 贴装工艺其他专业英语,Loading list/站位表 Offset/偏差 Pick/吸取 Place/贴装 Placement Accuracy/贴装精度 Linear Motor/线性马达 Ball Screw/丝杆 Image/影像,Reflow process english/回流工艺英语,测试OK后 转DIP插件,印刷（Printing）： 目的：借助于钢网把锡膏印刷在PCB之焊盘（PAD）上,贴片（Mount）： 目的：将贴片元件准确的贴装到PCB焊盘上,回流焊（Reflow）： 目的：把完成贴片的PCB经由一定的温度曲线使锡膏与PCB，元件之间形成机械连接,AOI（自动光学检测）： 目的：自动检测PCBA板上各种不同帖装错误及焊接缺陷，确保SMT不良品不会流入下一道工序,Soldering/焊接,1.Process of joining metallic surfaces(金属表面连接) through the mass heating(加热) of solder or solder paste 2.Creates a mechanical(机械的) and electrical(电的) connection between the components and PCB 3.Solder alloy metal(焊料合金) is melted(熔化) to form the connection 4.Liquid solder attaches to the base metals by forming intermetallic compounds(IMC:内部合金), through the process of wetting(润湿),Surface Tension/表面张力 : Surface tension is a molecular force(分子作用力) existing in the surface film of all liquids Wetting/润湿 : The ability of the molten solder alloy (熔融焊锡合金) to adhere to the surfaces being soldered Capillary Action/毛细作用 ：Interaction between a liquid (solder or flux) and a small opening or surface in a solid ( Pad, component Lead ) Wetting Angle/润湿角 IMC（Intermetallic compounds）/内部合金层 ：When the molten solder alloy makes contact with the PCB finish or component lead finish, a small amount of Sn in the solder combines with the finish metal or the base copper to form a metallurgical compound,Typical Convection Reflow Oven/典型的热风回流炉,Lower/下温区,Upper/上温区,Typical reflow profile/典型回流曲线,The reflow of solder is achieved in a furnace with predetermined thermal profiles. The different stages are: 炉子里的回流焊接用预先设定的温度曲线来达到.温度曲线的阶段分为: 1. Preheat Zone/预热区 2. Soak(dry out) Zone/衡温区 3. Reflow Zone/回流区 4. Cooling/冷却区,Profile equipment/测温仪,Thermal couple wire/感温线,(a),Typical Soldering Defects /典型的焊接缺陷,Solder Balls/锡珠,Solder Bridging /短路,Non-wetting /不润湿,(a),De-we