IPC标准一览表.pdf

IPC标准、文件一览表标准、文件一览表 Updated May 24, 2000 IPC DOC # (IPC文件 号) TITLE 名称 PUBLICATION/ REVISION DATES 出版/修订日期 Roadmap (指南指南) National Technology Roadmap for Electronic Interconnections (美国国家电子互联技术指南) 6/95 (orig. pub.) SMC- TR- 001 SMT An Introduction to Tape Automated Bonding & Fine Pitch Technology(TAB和细间距SMT介绍) 1/89 (orig. pub.) J- STD- 001 代替代替 IPC- S- 815 Requirements for Soldered Electrical and Electronic Assemblies (电气、电子组件焊接技术要求) 4/92 (orig. pub.) Revision: A 1/95 Amendment 1: 3/96 Revision B: 10/96 Revision C: 3/00 IPC- HDBK- 001 Handbook and Guide to the Requirements for Soldered Electrical and Electronic Assemblies to Supplement J- STD- 001B (J- STD- 001B学习辅导书) 3/98 (orig. pub.) J- STD- 002 代替代替 IPC- S- 805 Solderability Tests for Component Leads,Terminations, Lugs, Terminals and Wires (元件引线,焊端,接线端和导 线的可焊性 测试) 4/92 (orig. pub.) A 10/98 J- STD- 003 代替代替 IPC- S- 804 Solderability Tests for Printed Boards(印制板可焊性测 试) 4/92 (orig. pub.) Revision A: In process J- STD- 004 代替代替IPC- SF- 818 Requirements for Soldering Fluxes(助焊剂技术要求) 1/95 (orig. pub.) Amendment 1 - 4/96 Revision A: In process J- STD- 005 代替代替 IPC- SF- 819 Requirements for Soldering Pastes(焊膏技术要求) 1/95 (orig. pub.) Amendment 1 - 1/95 J- STD- 006 Requirements for Electronic Grade Solder Alloys and Fluxed and Non- Fluxed Solid Solders for Electronic Soldering Applications 1/95 (orig. pub.) Amendment 1 - 6/96 Revision A: In process Page 1 of 18IPC Document Revision Table 2011- 3- 4file:/E:RDipc标准IPC标准（new）IPC标准一览表.html PDF 文件使用 “pdfFactory Pro“ 试用版本创建 (电子级固态焊料技术要求) J- STD- 012 Implementation of Flip Chip and Chip Scale Technology (FC和CSP器件的安装) 1/96 (orig. pub.) J- STD- 013 Implementation of Ball Grid Array and Other High Density Technology(BGA和HDI器件的安装) 7/96 (orig. pub.) IPC- DRM- 18 Component Identification Desk Reference Manual (元器件封装辨认手册) 9/95 (orig. pub.) Revision A: 4/96 Revision B: 2/97 Revision C: 7/98 J- STD- 020 Moisture/Reflow Sensitivity Classification of Plastic Surface Mount Devices(塑封表面器件对潮湿和再流焊 的敏感度要求) October 1996 (orig. pub.) Revision A: 3/99 IPC- DRM- 40 Through- Hole Solder Joint Evaluation Desk Reference Manual (通孔引线焊点评估参考手册) IPC- DRM- SMT Surface Mount Solder Joint Evaluation Desk Reference Manual (表面组装焊点评估参考手册) 8/98 IPC- T- 50 Terms and Definitions Interconnecting and Packaging Electronic Circuits(电子电路互连及封装术语和定义) 8/75 (orig. pub.) A - 8/76 B - 6/80 C - 3/85 D - 11/88 E - 7/92 F - 6/96 IPC- SC- 60 Post Solder Solvent Cleaning Handbook (焊后溶剂清洗 手册) 4/87 (orig. pub.) Revision A: In process IPC- SA- 61 Post- Solder Semi- Aqueous Cleaning Handbook (焊后半水清洗手册) 7/95 (orig. pub.) IPC- AC- 62 Post Solder Aqueous Cleaning Handbook (焊后水清洗手 册) 12/86 (orig. pub.) IPC- CH- 65 Guidelines for Cleaning of Printed Boards and Assemblies (印制板及其组件清洗导则) 12/90 (orig. pub.) Revision A: In process IPC- CS- 70 Guidelines for Chemical Handling Safety in Printed Board Manufacturing(印制板制造化学处理安全准则) 8/88 (orig. pub.) IPC- CM- 78 Page 2 of 18IPC Document Revision Table 2011- 3- 4file:/E:RDipc标准IPC标准（new）IPC标准一览表.html PDF 文件使用 “pdfFactory Pro“ 试用版本创建 被被 IPC- SM- 780替替 代代 Guidelines for Surface Mounting and Interconnecting Chip Carriers 11/83 (orig. pub.) C - 3/88 IPC- MP- 83 IPC Policy on Metrication(IPC公制化导则) 8/85 (orig. pub.) IPC- PC- 90 General Requirements for Implementation of Statistical Process Control(实施SPC的总技术规范) 10/90 (orig. pub.) IPC- QS- 95 General Requirements for Implementation of ISO 9000 Quality Systems(实施 ISO 9000质量体系的总技术规 范) 4/93 (orig. pub.) IPC- L- 108 被被 IPC- 4101替代替代 Specification for Thin Metal Clad Base Materials for Multilayer Printed Boards 3/76 (orig. pub.) A 10/80 B 6/90 IPC- L- 109 被被 IPC- 4101 替代替代 Specification for Resin Impregnated Fabric (Pregreg) for Multilayer Printed Boards 3/76 (orig. pub.) A 10/80 B 7/92 IPC- L- 110 (已作废已作废) Preimpregnated, B- Stage Epoxy- Glass Cloth for Multilayer Printed Cicuit Boards A IPC- CC- 110 被被 IPC- 4121替代替代 Guidelines for Selecting Core Constructions for Multilayer Printed Wiring Board Applications 1/94 (orig. pub.) Revision A: 12/97 IPC- L- 112 被被 IPC- 4101 替代替代 Specification for Composite Metal Clad Base materials for Printed Boards 7/81 (orig. pub.) A 6/92 IPC- L- 115 被被 IPC- 4101 替代替代 Specification for Rigid Metal Clad Base Materials for Printed Boards 3/77 (orig. pub.) A 10/80 B 4/90 IPC- L- 120 (己作废己作废) Inspection Procedure for Chemical Processing Suitability of Copper- Clad Epoxy- Glass Laminates IPC- L- 125 Specifications for Plastic Substrates Clad or Unclad for High Speed/High Frequency Interconnections (高速/高频塑性基板特性规范) 8/83 (orig. pub.) A 7/92 IPC- L- 130 (已作废已作废) 被被 IPC- L- 108 替代替代 Specificaitons for Thin Laminates, Metal Clad, Primarily for General- Purpose Multilayer Printed Boards 1/77 (orig. pub.) Page 3 of 18IPC Document Revision Table 2011- 3- 4file:/E:RDipc标准IPC标准（new）IPC标准一览表.html PDF 文件使用 “pdfFactory Pro“ 试用版本创建 IPC- EG- 140 Specification for Finished Fabric Woven from “E“ Glass for Printed Boards(“E“纤维织物印制板特性规范) 3/88 (orig. pub.) A 6/97* IPC- SG- 141 Specification for Finished Fabric Woven from “S“ Glass for Printed Boards (“S“纤维织物印制板特性规范) 2/92 (orig. pub.) IPC- A- 142 Specification for Finished Fabric Woven from Aramid for Printed Boards(Aramid纤维织物印制板特性规范) 6/90 (orig. pub.) IPC- QF- 143 General Specification for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards (石英纤维织物印制板特性规范) 2/92 (orig. pub.) IPC- CF- 148 Resin Coated Metal for Printed Boards (印制板涂树脂金 属箔) 6/90 (orig. pub.) A 9/98 IPC- MF- 150 Metal Foil for Printed Wiring Applications (印制线路金属箔) 8/66 (orig.pub.) A 9/67 B 2/71 C 8/74 D 3/76 E 5/81 F 10/91 , 8/92 G 5/99 IPC- CF- 152 Composite Metallic Material Specification for Printed Wiring Boards (印制板复合金属材料特性规范) 6/90 (orig. pub.) A 1/94 B 3/98 IPC- FC- 203 (已作废已作废) Specification for Flat Cable, Round Conductor, Ground Plane 7/85 (orig. pub.) IPC- FC- 210 (已作废已作废) Performance Specification for Flat- Conductor Undercarpet Power Cable (Type FCC) 9/85 (orig. pub.) IPC- FC- 213 (已作废已作废) Performance Specification for Flat Undercarpet Telephone Cable 9/84 (orig. pub.) IPC- FC- 217 (已作废已作废) General Document for Connectors, Electric, Header, Receptacle,Insulation Displacement for Use with Round Conductor Flat Cable 8/82 (orig. pub.) Reaffirmed 4/90 IPC- FC- 218B/ EIA- RS- 429 (已作废已作废) General Specification for Connectors, Electrical Flat Cable Type 7/76 (orig. pub.) Reaffirmed 11/81 Reaffirmed 05/91 IPC- FC- 219 Environment Sealed Flat Cable Connectors for use in Page 4 of 18IPC Document Revision Table 2011- 3- 4file:/E:RDipc标准IPC标准（new）IPC标准一览表.html PDF 文件使用 “pdfFactory Pro“ 试用版本创建 (已作废已作废) Aerospace Applications 5/84 (orig. pub.) IPC- FC- 220 (已作废已作废) Specification for Flat Cable, Flat Conductor, Unshielded orig. pub 5/70 A 1/74 B 8/75 C 7/85 IPC- FC- 221 (已作废已作废) Specification for Flat- Copper Conductors for Flat Cables 8/75 (orig. pub.) A 5/84 IPC- FC- 222 (已作废已作废) Specification of Flat Cable Round Conductor, Unshielded 6/80 (orig. pub.) 5/91 Reaffirmed IPC- FC- 225 (已作废已作废) Flat Cable Design Guide 8/75 (orig. pub.) 10/85 Reaffirmed IPC- FC- 231 Flexible Base Dielectrics for Use in Flexible Printed Wiring (柔性印制线路的绝缘基材) orig. pub. 7/74 A 5/83 B 2/86 C 4/92 Amendment 10/95 IPC- FC- 232 代替代替IPC- FC- 233A Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Wiring and Flexible Bonding Films (柔性电路绝缘涂覆胶粘剂) 7/74 (orig. pub.) A 5/83 B 2/86 C 4/92 Amendment 10/95 IPC- FC- 233 (作废作废) - Incorporated into IPC- FC- 232B IPC- FC- 241 Flexible Metal- Clad Dielectrics for Use in Fabrication of Flexible Printed Wiring(柔性印制电路镶嵌金属夹层的 绝缘基材) 7/74 (orig. pub.) A 5/83 B 2/86 C 4/92 Amendment 10/95 IPC- RF- 245 被被 IPC- 6013 替代替代 Performance Specification for Rigid- Flex Printed Boards 4/87 (orig. pub.) IPC- D- 249 被被 IPC- 2223 替代替代 Design Standard for Flexible Single- and Double- Sided Printed Boards 1/87 (orig. pub.) Page 5 of 18IPC Document Revision Table 2011- 3- 4file:/E:RDipc标准IPC标准（new）IPC标准一览表.html PDF 文件使用 “pdfFactory Pro“ 试用版本创建 IPC- FC- 250A 被被 IPC- 6013 替代替代 Specification for Single - and Double- Sided Flexible Printed Wiring 9/86 (orig. pub.) A 9/86 IPC- FA- 251 Guidelines for Single and Double Sided Flex Circuits (单、双面柔性电路指南) 2/92 (orig. pub.) IPC- D- 275 被被 IPC- 2221 and 2222 替代替代 Design Standard for Rigid Printed Boards and Rigid Printed Board Assemblies 9/91 (orig. pub.) Amend.1 4/96 IPC- RB- 276 被被 IPC- 6011 和和 IPC- 6012 替代替代 Qualification and Performance Specification for Rigid Printed Boards 3/92 (orig. pub.) IPC- D- 279 Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies (可靠的印制板SMT设计指南) 7/96 (orig. pub.) IPC- D- 300 Printed Board Dimensions and Tolerances (印制板的尺寸和容差) 8/60 (orig. pub.) A 7/61 B 1/64 C 10/65 D 1/70 E 10/70 F 11/74 Editorial revision G 1/84 IPC- D- 310 Guidelines for Phototool Generation and Measurement Techniques (照相底板生成和测量技术指南) 9/69 (orig. pub.) A 12/77 B 12/85 C 06/91 IPC- A- 311 Process Control Guidelines for Phototool Generation and Use (照相底板生成和使用过程的控制指南) 3/96 (orig. pub.) Page 6 of 18IPC Document Revision Table 2011- 3- 4file:/E:RDipc标准IPC标准（new）IPC标准一览表.html PDF 文件使用 “pdfFactory Pro“ 试用版本创建 IPC- D- 316 Design Guide for Microwave Circuit Boards Utilizing Soft Substrates (软质基材的微波电路设计指南) 5/95 (orig. pub.) IPC- D- 317 Design Guidelines for Electronic Packaging Utilizing High- Speed Techniques(电子封装用于高速技术的设计 指南) 4/90 (orig. pub) A 1/95 IPC- HF- 318 被被 IPC- 6018 替代替代 Microwave End Product Board Inspection and Test 6/85 (orig. pub.) A 12/91 IPC- D- 319 (作废作废) Design Standard for Rigid Single- and Double- Sided Printed Boards 1/87 (orig. pub.) superseded by IPC- D- 275 IPC- D- 320A (作废作废) Printed Board, Rigid, Single- and Double- Side, End Product Standard 1/77 (orig. pub.) A 3/81 IPC- SD- 320B (作废作废) Performance Specification for Rigid Single- and Double- Sided Printed Boards (incorporates/supersedes IPC- TC- 500 superseded by IPC- RB- 276 1/77 (orig. pub.) A 3/81 B 11/86 IPC- D- 322 Guidelines for Selecting Printed Wiring Board Sizes Using Standard Panel Sizes(拼板中印制板迭用尺寸指 南) 8/84 orig. pub. Reaffirmed 9/91 IPC- MC- 324 Performance Specifications for Metal Core Boards (金属芯电路板性能规范) 10/88 (orig. pub.) IPC- D- 325 Documentation Requirements for Printed Boards, Assemblies and Support Drawings (印制板、组件和支撑 件图纸文件要求) 1/87 (orig. pub.) A 5/95 IPC- D- 326 Information Requirements for Manufacturing Printed Board Assemblies(印制板组装制造的文件资料要求) 4/91 (orig. pub.) IPC- D- 330 Design Guide Manual(设计指导手册) IPC- PD- 335 (作废作废) Electronic Packaging Handbook 12/89 (orig. pub.) Page 7 of 18IPC Document Revision Table 2011- 3- 4file:/E:RDipc标准IPC标准（new）IPC标准一览表.html PDF 文件使用 “pdfFactory Pro“ 试用版本创建 IPC- NC- 349 Computer Numerical Control Formatting for Drillers and Routers (钻孔和布线器的计算机控制数据格式) 8/85 (orig. pub.) IPC- D- 350 Printed Board Description in Digital Form (印制板的数字化表述) 8/72 (orig. pub.) A 2/75 B 8/77 C 10/85 Reaffirmed D 7/92 Technical Content Identical to IEC- 1182- 1 IPC- D- 351 Printed Board Drawings in Digital Form (印制板图形的数字化表述) 8/85 (orig. pub.) IPC- D- 352 Electronic Design Data Description for Printed Boards in Digital Form (印制板电子设计数椐的数字化表述) 8/85 (orig. pub.) IPC- D- 354 Library Format Description for Printed Boards in Digital Form (印制板文件格式的数字化表述) 2/87 (orig. pub.) IPC- D- 355 Printed Board Assembly Description in Digital Form (印制板组件的数字化表述) 1/95 (orig. pub.) IPC- D- 356 Bare Board Electrical Test Information in Digital Form (印制裸板电测信息的数字化表述) 3/92 (orig. pub.) A 1/98 IPC- AM- 361 (作废作废) Specification for Rigid Substrates for Additive Process Printed Boards 1/82 (orig. pub.) IPC- MB- 380 Guidelines for Molded Interconnection Devices (模制器件互连指南) 10/90 (orig. pub.) IPC- D- 390 Automated Design Guidelines(自动设计指南) 7/74 (orig. pub.) A 2/88 IPC- C- 406 Design and Application Guidelines for Surface Mount Connectors (表面组装连接器设计和应用指南) 1/90 (orig. pub.) IPC- CI- 408 Design and Application Guidelines for the Use of Solderless Surface Mount Connectors (非焊接表面组装连接器设计和应用指南) 1/94 orig. pub. IPC- BP- General Specification for Rigid Printed Board Backplanes with Press- Fit Contacts 10/80 (orig. pub.) Page 8 of 18IPC Document Revision Table 2011- 3- 4file:/E:RDipc标准IPC标准（new）IPC标准一览表.html PDF 文件使用 “pdfFactory Pro“ 试用版本创建 421 (带压接连接器的刚性印制背板通用技术规范) Reaffirmed 4/90 IPC- D- 422 Design Guide for Press Fit Rigid Printed Board Backplanes (刚性压接印制背板设计指南) 9/82 (orig. pub.) IPC- DW- 424 General Specification for Encapsulated Discrete Wire Interconnection Boards (印制板分立包皮导线互连通用技术规范) 1/95 (orig. pub.) IPC- DW- 425 Design and End Product Requirements for Discrete Wiring Boards(分立线路板设计和成品技术规范) 9/82 (orig. pub.) A 5/90 IPC- DW- 426 Specifications for Assembly of Discrete Wiring (分立线路组装技术规范) 12/87 (orig. pub.) IPC- TR- 460 Trouble- Shooting Checklist for Wave Soldering Printed Wiring Boards (印制板波峰焊故障检查表) 1973 (orig. pub) A 2/84 IPC- TR- 461 Solderability Evaluation of Thick and Thin Fused Coatings (厚、薄热涂层的可焊性评估) 3/79 (orig. pub.) IPC- TR- 462 Solderability Evaluation of Printed Boards with Protective Coatings Over Long Term Storage (具有持效保护涂层的印制板可焊性评估) 10/87 (orig. pub.) IPC- TR- 464 Accelerated Aging for Solderability Evaluations (可焊性的加速老化评估) orig. pub.4/84 A 12/87 IPC- TR- 465- 1 Round Robin Test on Steam Ager Temperature Control Stability (恒温蒸汽老化的联合测试报告) 1993 IPC- TR- 465- 2 The Effect of Steam Aging Time and Temperature on Solderability Test Results (蒸汔老化时间和温度对可焊性测试结果的影响) 1993 IPC- TR- 465- 3 Evaluation of Steam Aging on Alternative Finishes, Phase IIA ( 对不同处理剂的蒸汽老化评估,Phase IIA) 7/96 IPC- TR- 466 Wetting Balance Standard Weight Comparison Test (润湿平衡标准称重比较测试) 4/95 (orig. pub.) Page 9 of 18IPC Document Revision Table 2011- 3- 4file:/E:RDipc标准IPC标准（new）IPC标准一览表.html PDF 文件使用 “pdfFactory Pro“ 试用版本创建 IPC- TR- 467 Supporting Data and Numerical Examples for ANSI/J- STD- 001 Appendix D(ANSI/J- STD- 001附件D的支持数 据和数字举例) 10/96 (orig. pub.) IPC- TR- 468 Factors Affecting Insulation Resistance Performance of Printed Boards(印制板绝缘电阻的影响因素) 3/79 (orig. pub.) IPC- TR- 470 Thermal Characteristics of Multilayer Interconnection Boards (多层互连板的热特性) 1/74 (orig. pub.) IPC- TR- 474 An Overview of Discrete Wiring Techniques(分立线路综 观) 3/79 (orig. pub.) Reprint 1984 IPC- TR- 476 How to Avoid Metallic Growth Problems on Electronic Hardware(如何避免电子硬件的合金化生长) 9/77 (orig. pub.) A 6/84 IPC- TR- 480 (作废作废) Results of Multilayer Test Program Round Robin IV Phase I 9/75 (orig. pub.) IPC- TR- 481 Results of Multilayer Test Program Round Robin V (多层V循环测试程序的结果) 4/81 (orig. pub.) IPC- TR- 483 Dimensional Stability Testing of Thin Laminates - Report on Phase I International Round Robin Test Program (薄层压板尺寸稳定性测试- - - - ) 4/84 (orig. pub.) 10/87 Addendums Revised 3/91 IPC- TR- 484 Results of IPC Cooper Foil Ductility Round Robin Study (IPC Cooper 箔延展性研究联合报告) 4/86 (orig. pub.) IPC- TR- 485 Results of Cooper Foil Rupture Strength Test Round Robin Study (Cooper 箔断裂强度研究联合报告) 3/85 (orig. pub.) IPC- TR- 549 Measles in Printed Wiring Boards(印制板内的粉点) 11/73 (orig. pub.) IPC- TR- 551 Quality Assessment of Printed Boards Used for Mounting and Interconnecting Electronic Components (电子元件安装互连印制板的质量评定) 7/93 (orig. pub.) IPC- DR- 570 General Specification for 1/8 Inch Diameter Shank Carbide Drills for Printed Boards(1/8英寸印制板硬质合 金钻头总技术规范) 1/79 (orig. pub.) A 4/84 IPC- DR- 572 Drilling Guidelines for Printed Boards(印制板钻孔指南) 4/88 (orig. pub.) IPC- TR- Page 10 of 18IPC Document Revision Table 2011- 3- 4file:/E:RDipc标准IPC标准（new）IPC标准一览表.html PDF 文件使用 “pdfFactory Pro“ 试用版本创建 576 (已作废已作废) Additive Process Evaluation 9/77 (orig. pub.) IPC- TR- 578 Leading Edge Manufacturing Technology Report - Resulting of a Round Robin Study on Minimum Conductor Width and Plated- Through Holes in Rigid, Bare Copper, Double- Sided Printed Wiring Boards(前沿 制造技术报告- - - - ) 9/84 (orig. pub.) IPC- TR- 579 Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in Printed Wiring Boards (印制板小孔金属化可靠性评估联合报告) 9/88 (orig. pub.) IPC- TR- 580 Cleaning and Cleanliness Test Program Phase 1 Test Results (清洗和洁净度测试程序第1阶段测试结果) 10/89 (orig. pub.) IPC- TR- 581 IPC Phase 3 Controlled Atmosphere Soldering Study IPC Phase 3 可控气氛焊接研究) 8/94 (orig. pub.) IPC- TR- 582 IPC Phase 3 No- Clean Flux Study(IPC Phase 3免洗助焊 剂研究) 11/94 (orig pub.) IPC- A- 600 Acceptability of Printed Boards(印制板可接收条件) orig pub. 64 A 70 B 74 C 78 D 89 E 8/95 F 11/99 IPC- QE- 605A Printed Board Quality Evaluation Handbook (印制板质量评定手册) Revision A: 2/99 IPC- SS- 605 Printed Board Quality Evaluation Slide Set (印制板质量评定,幻灯片) IPC- A- 610 Acceptability of Electronic Assemblies (电子组装的可接收条件) 8/83 (orig. pub.) 2nd printing 1/86 3rd printing 5/88 A 3/90 B 12/94 Amendment 1/96 Revision C: 1/00 IPC- QE- 615 Assembly Quality Evaluation Handbook(组装质量评定手 册) 3/93 (orig. pub.) IPC- SS-Assembly Quality Evaluation Slide Set(组装质量评定,幻3/93 (orig. pub.) Page 11 of 18IPC Document Revision Table 2011- 3- 4file:/E:RDipc标准IPC标准（new）IPC标准一览表.html PDF 文件使用 “pdfFactory Pro“ 试用版本创建 615 灯片) Revision A: 2/99 IPC- AI- 640 (已作废已作废) Users Guidelines for Automated Inspection of Unpopulated Thick Film Hybrid Substrates 1/87 (orig. pub.) IPC- AI- 641 Users Guidelines for Automated Solder Joint Inspection (自动焊点检查用户指南) 1/87 (orig. pub.) IPC- AI- 642 Users Guidelines for Automated Inspection of Artwork, Interlayers, and Unpopulated PWBs (照相底图,内层和PCB裸板自动检查用户指南) 10/88 (orig. pub.) IPC- OI- 645 Standard for Visual Optical Inspection Aids (光学检查目测标准) 10/93 (orig. pub.) IPC- TM- 650 Test Methods Manual(测试方法手册) Updated per test method IPC- ET- 652 Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards (PCB裸板电气测试要求和导则) 10/90 (orig. pub.) IPC- QL- 653 Qualification of Facilities that Inspect/Test Printed Boards, Components, and Material (检查/测试印制板,元件和材料的设备鉴定) 8/88 (orig. pub.) A 11/97 IPC- MI- 660 Incoming Inspection of Raw Materials Manual (原材料来料检查手册) 2/84 (orig. pub.) IPC- R- 700C 被被 IPC- 7711 and 7721 替代替代 Suggested Guidelines for Modification, Rework and Repair of Printe