RMA处理流程介绍ppt课件.ppt

,RMAHandlingProcess,NOUNIntroduction,WIP:WORKINGINPROCESSDOA:DEADONARRIVALRMA:RETURNMATERIALANALYSISNTF:NOTROUBLEFOUNDNDF:NODEFECTFOUNDCND:CANNOTDUPLICATERTV:RETURNTOVENDORCID:CUSTOMERINDUCEDEFECT,1,.,RMAHandlingProcess,RMA,ServiceTracking,CheckQtyandPackingList,AppearanceInspectionDifferentRev.SortingKeyinRMAnoandTagIn,Workingorder,VisualInspection&ECN,SCRAP,TestHandlingProcess,NG,NG,OK,OK,VisualInspection,ShipOut,InformCustomer,2,.,RMABoards,BootStrapTest,VisualInspectionPacking,Scrap,Fail,ATETest,HMUSpotTest,VisualRepair,FBTRepair,ICTRepair,GR2286orTR8001,Re-flowfromICTStation,A,A,ok,Fail,Fail,Fail,Firsttimepassed,Fail,ok,Fail,Shipout,IftheboardisNTF,2ndtimepassed,N,ok,SpecialNTFProcess,TESTHandlingProcess,3,.,SpecialProcessForNTFBoards,NTFBoards,FailureCodeQuery,TestPass,CorrespondingTestwithErrorCode,RepairOK,TestPass,SST,IssueinternalRMAAbnormalnote,CauseAnalysis,ImprovementActionReport,Scrap,UnlockSFC,Re-flowfromICTStation,Y,N,Y,DefectSymptom,VideoFail,TheMeanstomakesure,NoVideo,TrywithdifferentCPU,Memory,PowerSupplyfor20times,AudioFail,NetworkFail,HangUp,AGPcardsupport(4x,8x)3D-markTest,HeadphonespeakeroutputMicinrecord&Lineinrecord,100MBpracticalnetaccessNetworkPXEboot,TestwithdifferentCPU,Memory,HDD&Win2k,winxpOSSupport,N,Y,N,4,.,異常分析淺談,來料異常,1.確認嫌疑物料料號及用量及物料規格2.針對所有位置確認測試覆蓋率；並評估不良品是否有流出的可能性3.分析嫌疑物料在每個機種，每個位置的作用4.抽取嫌疑板進行進行有針對性的信賴性驗証（如Run-In,Pwrcycle)5.推斷此不良在終端客戶可能出現的失效模式,5,.,異常分析淺談,6.判定成品的處理方式7.判定物料的處理方式8.如物料繼續使用，觀注該物料的各段的品質狀況9.聯絡供應商進行協助處理,來料異常,6,.,異常分析淺談,制程異常,1.分析可能的造成不良的工站2.進行失效模擬（有破壞性的模擬要慎重）3.失效模式確認4.修復不良工站5.不良品